| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/01/2000 | CN2367055Y Apparatus for soldering double surface electric circuit |
| 03/01/2000 | CN2367054Y Machine for automatically turning-over plate |
| 03/01/2000 | CN2367053Y Inclined standing type full automatic taking-in and putting out plate machine for integrated circuit plate |
| 03/01/2000 | CN1245908A Optical imageadable composite with improved flexibility |
| 03/01/2000 | CN1245837A Metal foil with raised bonding capacity for base and its manufacturing method |
| 03/01/2000 | CN1049904C Thermally cross-linkable heat-sealing adhesive |
| 02/29/2000 | US6031733 Preventing movement of integrated circuit packages relative to their support surface |
| 02/29/2000 | US6031730 Connector for electrically connecting circuit boards |
| 02/29/2000 | US6031729 Integral heater for reworking MCMS and other semiconductor components |
| 02/29/2000 | US6031728 Device and method for interconnection between two electronic devices |
| 02/29/2000 | US6031727 Printed circuit board with integrated heat sink |
| 02/29/2000 | US6031715 Component mounting module for printed circuit assemblies |
| 02/29/2000 | US6031590 Structure and method of mounting driver IC using anisotropic conductive film in liquid crystal display device |
| 02/29/2000 | US6031556 Overcoat for thermal imaging process |
| 02/29/2000 | US6031349 Cross-connect method and apparatus |
| 02/29/2000 | US6031318 Surface mountable crystal oscillating device and method of producing the same |
| 02/29/2000 | US6031292 Semiconductor device, interposer for semiconductor device |
| 02/29/2000 | US6031282 High performance integrated circuit chip package |
| 02/29/2000 | US6030889 Substrate-holding fixture of non-wettable material |
| 02/29/2000 | US6030701 Melt-flowable materials and method of sealing surfaces |
| 02/29/2000 | US6030693 Electronic circuit package having one or more layers, at least one of the layers having a core material comprising by weight 58%fe/42%ni, or 60%fe/39%ni/1%cu |
| 02/29/2000 | US6030512 Device for forming bumps by metal plating |
| 02/29/2000 | US6030423 Interposing conductively curable epoxy terminated silane adhesive composition between the thin profile battery and the substrate, curing adhesive into electrically conductive bond which electrically interconnects battery and substrate |
| 02/29/2000 | US6030259 Bus bar wiring board |
| 02/29/2000 | US6030234 Terminal pins mounted in flexible substrates |
| 02/29/2000 | US6030154 Minimum error algorithm/program |
| 02/29/2000 | US6029882 Plastic solder array using injection molded solder |
| 02/29/2000 | US6029344 Composite interconnection element for microelectronic components, and method of making same |
| 02/28/2000 | CA2277581A1 Improved microstrip edge card connector |
| 02/24/2000 | WO2000010370A1 A flexible circuit with conductive vias and a method of making |
| 02/24/2000 | WO2000010369A1 Method of forming solder bump, method of mounting electronic device, and mounting structure of electronic device |
| 02/24/2000 | WO2000010228A1 Connector with two rows of terminals having tail portions with similar impedance |
| 02/24/2000 | WO2000010200A1 Wafer plating method and apparatus |
| 02/24/2000 | WO2000009623A1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
| 02/24/2000 | WO2000009327A1 Resin/copper/metal laminate and method of producing same |
| 02/24/2000 | DE19838266A1 Einrichtung und Verfahren zum Vergießen elektrischer Schaltungen mittels Spritzguß Apparatus and method for encapsulating electrical circuits by means of injection molding |
| 02/24/2000 | DE19838218A1 Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board |
| 02/24/2000 | DE19836548A1 Carrier component; has integrated electrical connections for use with main section that fits into aperture formed in circuit board |
| 02/24/2000 | DE19835613A1 Resin composition for highly conductive plastics |
| 02/24/2000 | DE19831461C1 Verfahren zur partiellen Verbindung von Kupferfolien und Trennblechen (CuAI-Verfahren) Method for the partial connection of copper foils and separating plates (CuAl method) |
| 02/24/2000 | CA2338102A1 A flexible circuit with conductive vias and a method of making |
| 02/23/2000 | EP0981268A1 Circuit board with an electronic component mounted thereon and multi-layer board |
| 02/23/2000 | EP0981183A2 Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electo-optical device |
| 02/23/2000 | EP0980918A1 Product conveyance mechanism of electroplating apparatus |
| 02/23/2000 | EP0980753A2 Method of manufacturing laminate and grommet used for the method |
| 02/23/2000 | EP0980737A1 Laser machining method, laser machining device and control method of laser machining |
| 02/23/2000 | EP0980642A1 Process and apparatus for the treatment of flat-form material, especially of printed circuit boards |
| 02/23/2000 | EP0980322A2 Sensor circuit, specially for an automobiles |
| 02/23/2000 | EP0759893A4 Coating of substrates |
| 02/23/2000 | CN1245630A Connector assembly, and associated method, for radio frequency circuit device |
| 02/23/2000 | CN1245520A Reducing void formation in curable adhesive formulations |
| 02/23/2000 | CN1245392A Method for coating through-hole side wall with thick film |
| 02/23/2000 | CN1245325A Circuit substrate connecting structure, electrooptical device and its manufacturing method and electronic equipment |
| 02/23/2000 | CN1245304A Motherboard of computer |
| 02/22/2000 | US6028772 Electronic assembly having improved resistance to delamination |
| 02/22/2000 | US6028489 Modular high-frequency oscillator structure |
| 02/22/2000 | US6028390 Piezoelectric resonator and electronic component including same |
| 02/22/2000 | US6028366 Ball grid array semiconductor device |
| 02/22/2000 | US6028365 Integrated circuit package and method of fabrication |
| 02/22/2000 | US6028358 Package for a semiconductor device and a semiconductor device |
| 02/22/2000 | US6028357 Semiconductor device with a solder bump over a pillar form |
| 02/22/2000 | US6028355 Method and apparatus for dissipating heat from an enclosed printed wiring board |
| 02/22/2000 | US6027958 Transferred flexible integrated circuit |
| 02/22/2000 | US6027862 Electroless deposition of first silver layer followed by electrodeposition of second silver layer from cyanide-free bath, heat treating silver layer at least after depositing first layer |
| 02/22/2000 | US6027858 Laminating to substrate having plated through holes (pth) a curable epoxy resin dielectric (pid) film supported by a polyester film which is peeled away prior to final baking, developing, patterning, curing of structure |
| 02/22/2000 | US6027817 Plated molded article and process for producing a plated molded article |
| 02/22/2000 | US6027791 Structure for mounting a wiring board |
| 02/22/2000 | US6027762 Plating copper on a film base of the circuit pattern; forming a resist layer on the base film and plating except for an exposed pattern, wherein the copper plating between the resist layer and circuit pattern have less stresses |
| 02/22/2000 | US6027630 Method for electrochemical fabrication |
| 02/22/2000 | US6027575 Metallic adhesive for forming electronic interconnects at low temperatures |
| 02/22/2000 | US6027567 Flow coater with a temperature controller |
| 02/22/2000 | US6027371 Electrical connector |
| 02/22/2000 | US6027346 Membrane-supported contactor for semiconductor test |
| 02/22/2000 | US6027245 Apparatus for measuring a temperature of a substrate during a drilling operation |
| 02/22/2000 | US6027006 Method and apparatus for applying solder and forming solder balls on a substrate |
| 02/22/2000 | US6026884 Laminating device |
| 02/22/2000 | US6026566 Stenciling method and apparatus for PC board repair |
| 02/22/2000 | US6026564 Method of making a high density multilayer wiring board |
| 02/22/2000 | US6026563 Method of making flat cable |
| 02/17/2000 | WO2000008903A1 Printed circuit board with a heatsink and method for mounting a heatsink |
| 02/17/2000 | WO2000008900A1 Printed circuit card |
| 02/17/2000 | WO2000008681A1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 02/17/2000 | WO2000008675A2 Adapter for surface mounted devices |
| 02/17/2000 | WO2000008665A1 Electric component formed from sheet metal, provided with a welding abutment and that can be welded on the contact surfaces of a circuit substrate |
| 02/17/2000 | WO2000008531A1 Circuit support with control elements communicating via bus lines |
| 02/17/2000 | WO2000008220A1 Method of applying metal coatings on particles and substrates |
| 02/17/2000 | DE19835641A1 Hybrid element for electronic circuit has fixing legs at one end of hybrid board relatively displaced by flexure of hybrid board for insertion in openings in electronic circuit board |
| 02/17/2000 | DE19834641A1 Schaltungsträger mit voneinander trennbaren Steuereinheiten Circuit board with separable control units |
| 02/16/2000 | EP0980198A1 Detachable tool for making electrically conductive bumps on electronic components |
| 02/16/2000 | EP0980115A2 Electric circuit board with soldered pins |
| 02/16/2000 | EP0980096A1 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
| 02/16/2000 | EP0979854A1 Circuit connecting material, and structure and method of connecting circuit terminal |
| 02/16/2000 | EP0979729A1 Film applying method |
| 02/16/2000 | EP0979542A4 Button and dovetail connector actuation mechanism |
| 02/16/2000 | EP0979542A1 Button and dovetail connector actuation mechanism |
| 02/16/2000 | EP0979528A1 Method for making connection balls on electronic circuits or components |
| 02/16/2000 | EP0979208A1 Composition and method for reducing copper oxide to metallic copper |
| 02/16/2000 | EP0559777B1 A process for cleaning contaminants with monobasic ester |
| 02/16/2000 | CN1245008A Printed wiring board and method for manufacturing the same |
| 02/16/2000 | CN1245007A Optimized solder joints for surface mount chips |