Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2000
05/11/2000DE19949378A1 Abgeschirmte impedanzgesteuerte Gatling-Geschütz-Durchkontaktierung Screened impedance controlled Gatling gun-plated-through hole
05/11/2000DE19947092A1 Printed circuit board has electronic component(s) mounted in positioning area for separation from circuit board for another application
05/11/2000DE19851575A1 Verfahren und Vorrichtung zum Ausrichten zweier Fotomasken zueinander und gegebenenfalls eines unbelichteten Leiterplatten-Rohlings und zum anschließenden simultanen Belichten bei der Herstellung von doppelseitigen Leiterplatten Method and apparatus for aligning two photomasks with each other and optionally an unexposed PCB blank and subsequent to simultaneous exposure in the production of double-sided printed circuit boards
05/11/2000DE19850888A1 Einrichtung zur Halterung eines miniaturisierten Bauteils Means for supporting a miniaturized component
05/11/2000DE19847361A1 Electrical contact for connecting electro-mechanical components to board has contact extension with central opening penetrated by bolt
05/11/2000DE19842379A1 Circuit board layers, especially solder-stop lacquer, solder paste, etch-resist lacquer or printed layers, are produced by line printing a two-dimensional pixel structure derived from layer structure-defining data
05/11/2000CA2348968A1 Solder paste with a time-temperature indicator
05/11/2000CA2348275A1 Case for circuit board for horizontal or vertical mounting
05/10/2000EP0999731A1 Printed wiring board and method for manufacturing the same
05/10/2000EP0999730A2 Lead-free solder process for printed wiring boards
05/10/2000EP0999729A2 Process for laser soldering and for temperature monitoring of semi-conductor chips, and chip cards manufactured according to this process
05/10/2000EP0999728A1 An electrical component and an electrical circuit module having connected ground planes
05/10/2000EP0999591A1 Semiconductor package
05/10/2000EP0999532A1 Resonant tag labels and method of making same
05/10/2000EP0999451A2 Connecting apparatus, method of fabricating wiring film with holder, inspection system and method of fabricating semiconductor element
05/10/2000EP0999296A2 Apparatus for removing a coating from objects
05/10/2000EP0999253A1 Adhesive and circuit material using the adhesive
05/10/2000EP0998756A1 Device and method for producing a chip-substrate connection
05/10/2000EP0998723A2 Chip module, module and method for producing a module, chip card
05/10/2000EP0998550A1 n-PROPYL BROMIDE BASED CLEANING SOLVENT AND IONIC RESIDUE REMOVAL PROCESS
05/10/2000EP0894036B1 A solder dispensing apparatus
05/10/2000EP0836795A4 Method for making a debossed conductive film composite
05/10/2000EP0792221B1 Symmetrical circuit connection board for vehicle application
05/10/2000EP0777873B1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
05/10/2000CN2377795Y Isostatic circuit board surface processing device
05/10/2000CN1252922A Circuit board mount
05/10/2000CN1252894A BGA connector with heat activated connection and disconnection means
05/10/2000CN1252842A Lead-free solder
05/10/2000CN1252682A Mixed type module
05/10/2000CN1252351A Method and device for cleaning silk screen for screen printing
05/10/2000CN1052375C Copper foil used for layered plate plated with copper
05/10/2000CN1052374C Method and equipment for testing copper slag of grounding layer of power source on inner layer of printed-circuit board
05/10/2000CN1052373C Circuit board and circuit board module
05/10/2000CN1052347C Printed circuit board sparkgap
05/10/2000CN1052179C Solder paste for ball grid array
05/09/2000US6061370 Fourth harmonic generation apparatus
05/09/2000US6061249 Sealing system and method for sealing circuit card connection sites
05/09/2000US6061248 Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
05/09/2000US6061247 Motor with attached control device
05/09/2000US6061246 Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same
05/09/2000US6061243 Modular and multifunctional structure
05/09/2000US6061242 Die paddle heat sink with thermal posts
05/09/2000US6061228 Multi-chip module having an integral capacitor element
05/09/2000US6061075 Non-systolic time delay and integration printing
05/09/2000US6060893 Carrier having slide connectors for testing unpackaged semiconductor dice
05/09/2000US6060780 Surface mount type unit and transducer assembly using same
05/09/2000US6060775 Semiconductor device
05/09/2000US6060666 Electrolytic layer applied to metallic foil to promote adhesion to a polymeric substrate
05/09/2000US6060665 Grooved paths for printed wiring board with obstructions
05/09/2000US6060381 Method of manufacturing an electronic part having an air-bridge interconnection
05/09/2000US6060339 Method and apparatus providing redundancy for fabricating highly reliable memory modules
05/09/2000US6060330 Method of customizing integrated circuits by selective secondary deposition of interconnect material
05/09/2000US6060215 Photosensitive resin composition and application of its photosensitivity
05/09/2000US6060175 A polyimide film surface having a non-continuous random distribution of metal oxide from the group of oxides of iron, chromium, nickel, molybdenum, manganese, and/or zirconium; a metal layer, a sputtered chromium layer; printing
05/09/2000US6060165 Thick film paste conductors for multilayer ceramic electronic components; oxidation resistance; storage stability; resistors, capacitors; circuits; heating to decompose a metal compound to a metal while forming a glass protective coating
05/09/2000US6060150 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
05/09/2000US6060127 Mechanically restricted laser deposition
05/09/2000US6060121 Microcontact printing of catalytic colloids
05/09/2000US6059984 Forming alumina layer; masking; etching
05/09/2000US6059983 Method for fabricating an overcoated printed circuit board with contaminant-free areas
05/09/2000US6059952 Method of fabricating coated powder materials and their use for high conductivity paste applications
05/09/2000US6059949 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances
05/09/2000US6059919 Film-stripping process
05/09/2000US6059704 System for selecting tools from a tool store of a machine tool for machining printed circuit boards
05/09/2000US6059624 Screen and driver assembly for screen pixels
05/09/2000US6059579 Semiconductor structure interconnector and assembly
05/09/2000US6059382 Control device for an antilocking system and process for producing a control device
05/09/2000US6059176 Device and a method for applying a plurality of solder globules to a substrate
05/09/2000US6059173 Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
05/09/2000US6059172 Method for establishing electrical communication between a first object having a solder ball and a second object
05/09/2000US6059170 Method and apparatus for insulating moisture sensitive PBGA's
05/09/2000US6058835 Screen apparatus
05/09/2000CA2230506C Nickel powder and process for preparing the same
05/04/2000WO2000025559A1 Method for manufacturing a circuit board
05/04/2000WO2000025392A1 Coding element
05/04/2000WO2000025358A1 Device for providing balls or preforms for making flip-chip connections
05/04/2000WO2000025265A1 Method for making a chip card and an electronic module designed to be inserted in such a card
05/04/2000WO2000025141A1 High density printed circuit board
05/04/2000WO2000024612A1 Ribbed trim panel for thermal spraying of electrical circuit
05/04/2000WO2000024581A1 Method of manufacturing laminated sheet
05/04/2000WO2000024544A1 Lead-free solder
05/04/2000WO2000005748A3 Blind pin placement on circuit boards
05/04/2000DE19941110A1 Vereinheitlichtes Testsystem und Testverfahren mit Verwendung selbiges Unified Test System and method using selbiges
05/04/2000DE19910482A1 Wiring level production on a support, especially for multilayer circuit board production, involves leaving an exposed and developed photosensitive resin layer as insulation between conductive regions
05/04/2000DE19909643A1 Mounting SMD components on circuit board, e.g. for acceleration sensor used in passenger protection system by using SMD contact surface and contact zone of different areas
05/04/2000DE19850388A1 Hybrid carrier board, e.g. for motor vehicle engine control circuit, with microcontroller as flip chip module attached to board with further hybrid carrier substrate arranged over flip chip for additional components
05/04/2000DE19849658A1 Verfahren und Einrichtung zum Ablösen eines Ausschnittes einer Materialschicht Method and apparatus for peeling a section of one material layer
05/04/2000DE19847537A1 Platine mit auf beiden Seiten angeordneten Leiterbahnen Board having arranged on both sides conductor tracks
05/04/2000CA2348724A1 Device for providing balls or preforms for making flip-chip connections
05/03/2000EP0998179A1 Device to support a circuit board
05/03/2000EP0998175A1 Method for soldering Dpak-type electronic components to circuit boards
05/03/2000EP0997944A2 Printed circuit board with integrated circuit devices mounted on both sides thereof
05/03/2000EP0997942A2 Chip Size Semiconductor Package and process for producing it
05/03/2000EP0997941A2 Conductive paste and ceramic printed circuit substrate using the same
05/03/2000EP0997935A1 Printed wiring board and method for manufacturing the same
05/03/2000EP0997488A1 Polybenzoxazole resin and precursor thereof
05/03/2000EP0997226A2 High speed drilling spindle with reciprocating ceramic shaft and double-gripping centrifugal chuck
05/03/2000EP0997061A1 Method for metallization of a substrate containing electric non-conductive surface areas
05/03/2000EP0997060A1 A device and method in electronics systems
05/03/2000EP0996957A1 Capacitor connector, especially for an electrolytic power capacitor
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