| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/13/2000 | DE19962702A1 Test card, for testing conductivity between a chip-sized package component and a solder ball on a BGA component, has a contact element block with a sloping face for uniform pressure application to a solder ball surface |
| 07/13/2000 | DE19917875A1 Befestigung von Gehäusen elektronischer Bauteile an Kühlkörpern Mounting of electronic component housings to heat sinks |
| 07/13/2000 | DE19859613A1 Verfahren und Vorrichtung zur Herstellung von Multilayern Method and apparatus for production of multilayers |
| 07/13/2000 | CA2258403A1 Printed circuit board header attachment station |
| 07/12/2000 | EP1018858A1 Method and apparatus for manufacturing printed wiring board |
| 07/12/2000 | EP1018787A1 Resilient electrical interconnects having non-uniform cross-section |
| 07/12/2000 | EP1018750A1 Resistor and method of producing the same |
| 07/12/2000 | EP1018390A2 Ultrasonic vibration bonding machine |
| 07/12/2000 | EP1018291A1 Flexible circuits and carriers and process for manufacture |
| 07/12/2000 | EP1018290A1 A system and method for packaging integrated circuits |
| 07/12/2000 | EP1018194A1 Recyclable locator device for board mounted connectors |
| 07/12/2000 | EP1018157A1 Improved solder ball joint |
| 07/12/2000 | EP1018154A1 Component hybridising system allowing for defective planarity |
| 07/12/2000 | EP1017886A1 Method of electrophoretic deposition of laminated green bodies |
| 07/12/2000 | EP1017881A1 Composition and method for priming substrate materials |
| 07/12/2000 | EP0950082A4 Reducing void formation in curable adhesive formulations |
| 07/12/2000 | EP0907963A4 Solder bump apparatus, electronic component and method for forming a solder bump |
| 07/12/2000 | EP0877713A4 Ultrasonic mixing of through hole treating compositions |
| 07/12/2000 | EP0655961B1 Tin-bismuth solder paste and method of use |
| 07/12/2000 | CN2387697Y Single cantilever type support of automatic tin soldering machine |
| 07/12/2000 | CN1259844A Mounting of electronic components packages onto heat radiator |
| 07/12/2000 | CN1259768A Interconnector made of conductive elastomer |
| 07/12/2000 | CN1259417A Ultrasonic vibration welding apparatus |
| 07/12/2000 | CN1054338C System for automatically connecting source of electric current and a pile of package to make plastic laminates with endothermic heating |
| 07/12/2000 | CN1054337C Process for mfg. by endothermic heating of plastic laminates in continuous band pressed in cycles |
| 07/11/2000 | USRE36773 Method for plating using nested plating buses and semiconductor device having the same |
| 07/11/2000 | US6088465 Door-dependent system for enabling and adjusting options on hearing aids |
| 07/11/2000 | US6088241 Foil-type connector for motor-vehicle subassemblies |
| 07/11/2000 | US6088234 Connection structure of circuit protection element |
| 07/11/2000 | US6088233 Semiconductor device and assembly board having through-holes filled with filling core |
| 07/11/2000 | US6088230 Procedure for producing a chip mounting board and chip-mounting board thus produced |
| 07/11/2000 | US6088227 Heat sink with integrated buss bar |
| 07/11/2000 | US6088215 Capacitor and method of manufacture |
| 07/11/2000 | US6087920 Monolithic inductor |
| 07/11/2000 | US6087845 Universal wafer carrier for wafer level die burn-in |
| 07/11/2000 | US6087759 Post-assembly processed crystal resonator with conductive layers suitable for surface mounting |
| 07/11/2000 | US6087723 Vertical surface mount assembly and methods |
| 07/11/2000 | US6087625 Laser machining apparatus |
| 07/11/2000 | US6087597 Connecting member and a connecting method with ball and tapered via |
| 07/11/2000 | US6087596 Solder joints for printed circuit boards having intermediate metallic member |
| 07/11/2000 | US6087258 Method for circuitizing through-holes by photo-activated seeding |
| 07/11/2000 | US6087037 Vertically positioned support for a button type battery |
| 07/11/2000 | US6087021 Electrically conductive metallurgical bonds using components having low melting point constituent |
| 07/11/2000 | US6086990 High thermal conductivity silicon nitride circuit substrate and semiconductor device using the same |
| 07/11/2000 | US6086956 Composition and method for reducing copper oxide to metallic copper |
| 07/11/2000 | US6086946 Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
| 07/11/2000 | US6086863 Compositions of microspheres for wound healing |
| 07/11/2000 | US6086779 A cleaning surface treatment in the production of printed circuits by forming a complexes |
| 07/11/2000 | US6086743 Increasing surface roughness and the peel strength by three step lamination including oxidation, electrolysis, silanation |
| 07/11/2000 | US6086687 Lead-free tin alloy |
| 07/11/2000 | US6086683 Low-melting alloy and cream solder using a powder of the alloy |
| 07/11/2000 | US6086441 Method for connecting electrodes of plasma display panel |
| 07/11/2000 | US6086386 Flexible connectors for microelectronic elements |
| 07/11/2000 | US6086384 Method of fabricating electronic device employing a flat flexible circuit and including the device itself |
| 07/11/2000 | US6086383 Coaxial interconnect devices and methods of making the same |
| 07/11/2000 | US6086225 Surface mount lamp assembly |
| 07/11/2000 | US6086043 Valve control apparatus with three-dimensional circuit board using MID technology |
| 07/11/2000 | US6085998 Dismountable hot air nozzle |
| 07/11/2000 | US6085415 Methods to produce insulated conductive through-features in core materials for electric packaging |
| 07/11/2000 | US6085414 Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
| 07/11/2000 | US6085413 Multilayer electrical interconnection device and method of making same |
| 07/11/2000 | US6085407 Component alignment apparatuses and methods |
| 07/11/2000 | CA2176441C Infrared shield for capacitors |
| 07/08/2000 | CA2292680A1 Time switch |
| 07/06/2000 | WO2000040066A1 Electronic module |
| 07/06/2000 | WO2000039189A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 07/06/2000 | DE19958741A1 Component transport method for circuit boards etc. in electroplating systems uses vibrators positioned on carrier bars near goods frame suspension |
| 07/06/2000 | DE19957609A1 Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them |
| 07/06/2000 | DE19902428C1 Connecting cable to circuit board involves forming connecting lead perpendicularly with respect to main direction of cable by bending end region by inserting cable transversely into cable opening |
| 07/06/2000 | DE19860035A1 Elektronikmodul Electronics module |
| 07/06/2000 | DE19857959A1 Elektronisches Steuergerät Electronic control unit |
| 07/06/2000 | DE10002097A1 Method for installing interposition device, for testing dense connection area array; involves applying solder preform to ends of terminal pins protruding through interposition circuit board and soldering in soldering furnace |
| 07/06/2000 | CA2294553A1 Ultrasonic vibration bonding machine |
| 07/05/2000 | EP1017258A2 Method for manufacturing double-sided flexible printed board |
| 07/05/2000 | EP1017068A2 Process for forming device comprising metallized magnetic substrates |
| 07/05/2000 | EP1017043A2 Process for producing magnetic head suspension |
| 07/05/2000 | EP1016739A2 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same |
| 07/05/2000 | EP1016467A2 Vibration motor holding apparatus and portable electronic equipment having the same |
| 07/05/2000 | EP1016106A1 Ceramic multilayer printed circuit boards with embedded passive components |
| 07/05/2000 | EP1015669A1 Article, method, and apparatus for electrochemical fabrication |
| 07/05/2000 | EP1015668A1 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| 07/05/2000 | EP1015667A2 Method and device for regulating the concentration of substances in electrolytes |
| 07/05/2000 | EP1015666A1 Simplified process and apparatus for production of copper foil |
| 07/05/2000 | EP1015247A1 Mini-stencil and device for using same |
| 07/05/2000 | EP1015220A1 Injection molding encapsulation for an electronic device directly onto a substrate |
| 07/05/2000 | EP1015159A1 Solder ball placement apparatus |
| 07/05/2000 | EP1015130A4 Electroformed squeegee blade for surface mount screen printing |
| 07/05/2000 | EP1015130A1 Electroformed squeegee blade for surface mount screen printing |
| 07/05/2000 | EP0858725B1 Multilayer printed circuit board and process for producing the same |
| 07/05/2000 | EP0857348A4 An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 07/05/2000 | EP0800457B1 Method and apparatus for dispensing viscous material |
| 07/05/2000 | CN1259268A Fine pitch component placement method and apparatus |
| 07/05/2000 | CN1259085A Bonding system in an ink jet printer pen and method for providing the same |
| 07/05/2000 | CN1259009A Producing method of printed circuit board |
| 07/05/2000 | CN1259008A Tellite and display apparatus and electronic equipment usng the same |
| 07/05/2000 | CN1259007A Tellite and its producing method,and display apparatus and electronic equipment using the same circuit board |
| 07/05/2000 | CN1258954A Vibratory motor maintainer and portable electronic equipment with the same apparatus |
| 07/05/2000 | CN1258761A Metalizing process for diamond heat-sink thick-film base plate |
| 07/04/2000 | US6085018 Integrated circuit, electronic equipment and method of assembly which uses said integrated circuit |
| 07/04/2000 | US6084782 Electronic device having self-aligning solder pad design |