Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2000
03/28/2000US6041495 Filling holes in a photoresist-coated polyimide film with metal, removing photoresist leaving metal bumps projecting from film; electroplating bumps forms connections on circuit board surface opposite from where semiconductor chip attaches
03/28/2000CA2146798C Laser transfer machining apparatus
03/23/2000WO2000016597A1 Printed wiring board and its manufacturing method
03/23/2000WO2000016596A1 Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board
03/23/2000WO2000016595A1 Printed conductors made of polyalkylene dioxythiophene
03/23/2000WO2000016448A1 Method for connecting electric components and device for realising the same
03/23/2000WO2000016446A1 Printed circuit board arrangement with a multipole plug-in connector
03/23/2000WO2000016443A1 Non-circular micro-via
03/23/2000WO2000016398A1 Power semiconductor module and motor drive system
03/23/2000WO2000016366A2 Method for assembling metal printed conductors as electrodes on a channel plate for ultrawide flat screens
03/23/2000WO2000015436A1 Method and apparatus for applying a viscous or paste material onto a substrate
03/23/2000WO2000015359A1 Apparatus and method for precision cleaning and drying systems
03/23/2000WO2000015352A1 Electroless metal deposition of electronic components in an enclosable vessel
03/23/2000DE19842974A1 Galvanizing device for printed circuit boards, has an electrode formed on the transportation device
03/23/2000DE19842236A1 Elektrische Anschlußvorrichtung The electrical connection device
03/23/2000CA2343892A1 Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board
03/23/2000CA2343445A1 Non-circular micro-via
03/23/2000CA2343386A1 Method for assembling metal printed conductors as electrodes on a channel plate for ultrawide flat screens
03/22/2000EP0987931A2 Composite foil of aluminum and copper
03/22/2000EP0987797A2 Electrical connection device
03/22/2000EP0987748A2 Multilayered circuit board for semiconductor chip module, and method of manufacturing the same
03/22/2000EP0986940A1 Fine pitch component placement method and apparatus
03/22/2000EP0986480A1 Bonding system in an inkjet printer pen and method for providing the same
03/22/2000EP0907998A4 Power pad/power delivery system
03/22/2000CN1050730C Method of manufacturing printed circuit board
03/22/2000CN1050710C 层结构 Layer structure
03/22/2000CN1050705C Dual substrate package assembly for being electrically coupled to conducting member
03/22/2000CN1050681C Non-contact tpype IC card and method and apparatus for manufacturing the same
03/21/2000US6040985 Circuit board having general purpose region and programmable region
03/21/2000US6040806 Circular-polarization antenna
03/21/2000US6040624 Semiconductor device package and method
03/21/2000US6040623 Slotted lead for a semiconductor device
03/21/2000US6040622 Semiconductor package using terminals formed on a conductive layer of a circuit board
03/21/2000US6040552 High-speed drilling system for micro-via pattern formation, and resulting structure
03/21/2000US6040530 Versatile printed circuit board for testing processing reliability
03/21/2000US6040529 Flexible substrate
03/21/2000US6040524 Printed circuit board having two holes connecting first and second ground areas
03/21/2000US6040068 Ceramic wiring board and method of producing the same
03/21/2000US6040002 Etching resist composition, pattern forming method making use of the same, printed-wiring board and its production
03/21/2000US6039896 Resins, organic peroxide, thermoplastic elastomers and phosphoric esters
03/21/2000US6039889 Process flows for formation of fine structure layer pairs on flexible films
03/21/2000US6039859 Method for electroplating using stabilized dispersions of conductive particles
03/21/2000US6039680 Tool changing mechanism
03/21/2000US6039600 Male connector for flat flexible circuit
03/21/2000US6039429 Misprint detection techniques
03/21/2000US6039241 Mechanism for removal of surface mount connectors using heat conduction through pins
03/21/2000US6038762 Apparatus for mounting an electrical connector on a printed wiring board
03/21/2000CA2033134C Fluxless solder coating and joining
03/16/2000WO2000015017A1 Method and device for processing substrates
03/16/2000WO2000015015A1 Multilayer printed wiring board and method for manufacturing the same
03/16/2000WO2000015002A1 Door-dependent system for enabling and adjusting options on hearing aids
03/16/2000WO2000014798A1 Electronic part module mounted on socket
03/16/2000WO2000014771A2 Non-circular micro-via
03/16/2000WO2000014679A1 Method for contacting a circuit chip
03/16/2000WO1999056509A9 Flip chip devices with flexible conductive adhesive
03/16/2000DE4423888C2 Vorrichtung zur elektrischen Kontaktierung eines sich auf der Außenseite der Fahrzeugscheibe eines Kraftfahrzeugs befindlichen Sensors A device for electrically contacting a is located on the outside of the vehicle pane of a motor vehicle sensor
03/16/2000DE19845296A1 Verfahren zur Kontaktierung eines Schaltungschips Method for contacting a circuit chip
03/16/2000DE19841804A1 Preparation of an electrically conducting structure on a substrate for computer-controlled ink jet printing involves using an aqueous dispersion of polyalkylene dioxythiophenes with a polyanion as counter ion
03/16/2000DE19840665A1 Verfahren zum Aufbringen einer Sensor-Stromschleife auf einen Leitungsträger und induktiver Sensor mit derart ausgestattetem Läufer Method for applying a sensor current loop on a lead frame and inductive sensor with such a rotor equipped
03/16/2000DE19831394A1 Carrier for electrical and/or electronic components has board with openings approximately corresp. to component connections and in electrical contact with corresp. tracks
03/16/2000CA2343119A1 Door-dependent system for enabling and adjusting options on hearing aids
03/15/2000EP0986137A2 Contact strip for surface mounting on a printed circuit board
03/15/2000EP0985585A2 Electrical connection box
03/15/2000EP0985526A1 Plastic mask for paste printing and paste printing method
03/15/2000EP0985486A1 Leadless solder
03/15/2000EP0985333A1 New process for modification of surfaces
03/15/2000EP0985332A1 Rigid/flex printed circuit board using angled prepreg
03/15/2000EP0985227A1 Method of manufacturing a patterned array of solder bumps
03/15/2000EP0985132A1 Position transducer and method of manufacture
03/15/2000EP0910490B1 Molten solder dispensing system
03/15/2000EP0879489B1 Circuit board clip connector
03/15/2000EP0862665B1 Process for the electrolytic deposition of metal layers
03/15/2000EP0764352A4 Microelectronic contacts and assemblies
03/15/2000CN2369458Y Feeding and drawing mechanism for PCB making apparatus
03/15/2000CN1247689A Printed circuit assembly
03/15/2000CN1247635A Via structure
03/15/2000CN1247577A Pretreatment solution and pretreatment process of chemical nickle plating
03/15/2000CN1247448A 印刷线路板 Printed circuit boards
03/15/2000CN1247401A Electrical connecting box
03/14/2000USRE36614 Modular surface mount component for an electrical device or LED's
03/14/2000USRE36608 Movable registration pin mechanism
03/14/2000US6038311 Communication terminal apparatus
03/14/2000US6038137 Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon
03/14/2000US6038135 Wiring board and semiconductor device
03/14/2000US6038133 Circuit component built-in module and method for producing the same
03/14/2000US6038132 Memory module
03/14/2000US6037667 Socket assembly for use with solder ball
03/14/2000US6037657 Carrier, semiconductor device, and method of their mounting
03/14/2000US6037103 Method for forming hole in printed board
03/14/2000US6037096 Film composition and method for a planar surface atop a plated through hole
03/14/2000US6037065 Electrically conductive concentric metallic layers of nickel and copper or alloys and coating of silver or gold
03/14/2000US6037044 Direct deposit thin film single/multi chip module
03/14/2000US6037020 Introducing ultrasonic energy in at least one conditioning bath and carbon bath during immersing step by placing an ultrasonic generator in at least one bath, under conditions effective to at least reduce the formation of blowholes
03/14/2000US6037007 Method of forming a uniform photoresist film using gas flow
03/14/2000US6036994 Screen printing method and apparatus therefor
03/14/2000US6036912 Production method for ceramic green sheet
03/14/2000US6036908 Injection molding method for resin-sealed component
03/14/2000US6036901 Injection molding resin into mold cavity containing a core of hot water soluble resin which is dissolved away to leave hollow electronic part having interior and exterior molded surfaces, metallization to form electronic circuit pattern
03/14/2000US6036836 Forming studs to connect spaced high density chips to the board by covering first copper layer with photoresist, then etching pattern and repeating, finally plating with copper so that first and last copper layers are separated
03/14/2000US6036835 Exposing copper underlying the electroconductive polymer by removing polymer with mixture of hydrogen peroxide, sulfuric and carboxylic acids before electroplating through holes connecting metal layers of a printed circuit board
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