| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/25/2000 | US6093894 Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer |
| 07/25/2000 | US6093643 Electrically conductive projections and semiconductor processing method of forming same |
| 07/25/2000 | US6093477 Laminated substrates and data input unit using the same |
| 07/25/2000 | US6093443 Process for producing a ceramic-metal substrate |
| 07/25/2000 | US6093335 Method of surface finishes for eliminating surface irregularities and defects |
| 07/25/2000 | US6093249 Board matched nested support fixture |
| 07/25/2000 | US6093054 Connector for connecting a printed circuit board to a flat flexible circuit |
| 07/25/2000 | US6093036 Terminal connection device for power supply circuit |
| 07/25/2000 | US6093035 Contact for use in an electrical connector |
| 07/25/2000 | US6093033 Connector for a circuit board |
| 07/25/2000 | US6092714 Method of utilizing a plasma gas mixture containing argon and CF4 to clean and coat a conductor |
| 07/25/2000 | US6092713 Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof |
| 07/25/2000 | US6092578 Transferring thin film to a substrate |
| 07/25/2000 | US6092463 Printing method and printing device |
| 07/25/2000 | US6092282 Method of manufacturing printed circuits |
| 07/25/2000 | US6092280 Flexible interface structures for electronic devices |
| 07/21/2000 | CA2258304A1 Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit |
| 07/20/2000 | WO2000042830A1 Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards |
| 07/20/2000 | WO2000042829A1 Article having a circuit soldered with parts and method for recycling wastes of the same |
| 07/20/2000 | WO2000042679A2 A printed circuit board |
| 07/20/2000 | WO2000042517A1 Device for connecting a bus system to a computing unit, a plug-in card for a pcmcia-standard type interface and an adapter for a device of this type |
| 07/20/2000 | WO2000042472A1 Method for patterning thin films |
| 07/20/2000 | WO2000042442A1 Apparatus for testing the pattern of pcb and method thereof |
| 07/20/2000 | WO2000042370A2 Method and apparatus for drying conveyorized manufactured articles |
| 07/20/2000 | WO2000042114A1 Luminescent electroconductive adhesive |
| 07/20/2000 | WO2000041893A1 Thermal transfer element and process for forming organic electroluminescent devices |
| 07/20/2000 | WO2000041892A1 Thermal transfer element for forming multilayer devices |
| 07/20/2000 | WO2000041884A1 Composite film |
| 07/20/2000 | WO2000041841A1 Conductive leads with non-wettable surfaces |
| 07/20/2000 | WO2000041839A1 Laser beam machining and laser beam machine |
| 07/20/2000 | WO2000017840A3 Display and backlighting assembly |
| 07/20/2000 | WO2000003573A9 Integrated circuit module having springy contacts of at least two different types for reduced stress, and subassembly for such module |
| 07/20/2000 | DE19931692A1 Verfahren und Vorrichtung zur Herstellung von mit Dielektrikum beschichteter Kupferfolie, die auf Leiterplatten laminiert wird Method and apparatus for the production of dielectric-coated copper foil is laminated to printed circuit boards |
| 07/20/2000 | DE19901913A1 Electrical device with housing has circuit board encapsulated in housing with at least one electrically insulating setting material so as to leave access to connection devices |
| 07/20/2000 | DE19900912A1 Board, for electronic circuit board manufacture, comprises a pre-stamped board having holes filled with a soft filler or having an applied thin substrate to eliminate the need for drilling |
| 07/20/2000 | DE19859049A1 Exposure arrangement for photo-lacquer coated circuit boards has recesses in mask carrier at edge of mask region on side facing mask filled with permanent magnetic or ferromagnetic material |
| 07/19/2000 | EP1020914A2 Ceramic substrate used for fabricating electric or electronic circuit |
| 07/19/2000 | EP1020913A2 Lead frame, resin-encapsulated semiconductor device and fabrication process therefor |
| 07/19/2000 | EP1020910A2 Heat sink attachment |
| 07/19/2000 | EP1020908A1 Resin-sealed surface mounting type electronic parts |
| 07/19/2000 | EP1020904A1 Thermocompression bonding device and bonding head thereof |
| 07/19/2000 | EP1020814A2 Process for producing non-contact data carrier |
| 07/19/2000 | EP1020505A2 Conductive adhesive tapes and their preparation |
| 07/19/2000 | EP1020503A1 Process for improving the adhesion of polymeric materials to metal surfaces |
| 07/19/2000 | EP1020104A1 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 07/19/2000 | EP1020036A4 Slotline-mounted flip chip |
| 07/19/2000 | EP1020036A1 Slotline-mounted flip chip |
| 07/19/2000 | EP1019989A1 Interposers for land grid arrays |
| 07/19/2000 | EP1019986A1 Wiring board constructions and methods of making same |
| 07/19/2000 | EP1019961A1 Method for producing a multilevel cable carrier (substrate), especially for multichip modules |
| 07/19/2000 | EP1019960A1 Ball grid array semiconductor package and method for making the same |
| 07/19/2000 | EP1019925A1 Microelectronic component carrier and method of its manufacture |
| 07/19/2000 | EP1019481A1 Degreasing method using a surfactant-free composition |
| 07/19/2000 | EP0896787B1 A multi-layer moulded electronic device and method for manufacturing same |
| 07/19/2000 | CN1260885A Substrate having unidirectional conductivity perpendicular to its surface, devices comprising such substrate and methods for manufacturing such substrate |
| 07/19/2000 | CN1260684A Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board |
| 07/19/2000 | CN1260589A Semiconductor device and manufacturing method thereof, and reinforcing belt for manufacturing said semiconductor device |
| 07/19/2000 | CN1260551A Method for manufacturing non-contact data carrier |
| 07/19/2000 | CN1260250A Method for separating metal material from waste printed circuit board and destruction distillation apparatus for processing waste materials |
| 07/19/2000 | CA2295421A1 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line (s) |
| 07/18/2000 | US6091996 Printed circuit board analysis and repair system |
| 07/18/2000 | US6091608 Method and apparatus for simplified and compact component addition to a printed circuit board |
| 07/18/2000 | US6091598 Laminated ceramic electronic part including a plurality of internal electrodes having two leading portions and a non-exposed portion between the two leading portions |
| 07/18/2000 | US6091474 Display assembly |
| 07/18/2000 | US6091310 Multi-layer printed board with an inductor providing a high impedance at high frequency |
| 07/18/2000 | US6091254 Universal wafer carrier for wafer level die burn-in |
| 07/18/2000 | US6091251 Discrete die burn-in for nonpackaged die |
| 07/18/2000 | US6091250 Discrete die burn-in for nonpackaged die |
| 07/18/2000 | US6091147 Connector type semiconductor package |
| 07/18/2000 | US6091137 Semiconductor device substrate and method of manufacturing the same |
| 07/18/2000 | US6091136 Plastic lead frames for semiconductor devices |
| 07/18/2000 | US6091027 Via structure |
| 07/18/2000 | US6091026 Multi-layer printed circuit board with human detectable layer misregistration, and manufacturing method therefor |
| 07/18/2000 | US6090633 Multiple-plane pair thin-film structure and process of manufacture |
| 07/18/2000 | US6090493 Bismuth coating protection for copper |
| 07/18/2000 | US6090474 Flowable compositions and use in filling vias and plated through-holes |
| 07/18/2000 | US6090468 Insulation adhesive layer which is a semi-cured product of an epoxy group-containing acrylic rubber |
| 07/18/2000 | US6090330 The two ends of a sheet are held by means of a fixed clamp and a movable clamp, the sheet being held by applying bias by means of a biasing cylinder to the movable clamp in a direction such as would separate it from the fixed clamp |
| 07/18/2000 | US6090301 Method for fabricating bump forming plate member |
| 07/18/2000 | US6090261 Method and apparatus for controlling plating over a face of a substrate |
| 07/18/2000 | US6090237 Apparatus for restraining adhesive overflow in a multilayer substrate assembly during lamination |
| 07/18/2000 | US6089853 Patterning device for patterning a substrate with patterning cavities fed by service cavities |
| 07/18/2000 | US6089479 Method for treating waste printed circuit boards with molten mixture of inorganic salts |
| 07/18/2000 | US6089445 Method and device for dry fluxing of metallic surfaces before soldering or tinning |
| 07/18/2000 | US6089442 Electrode connection method |
| 07/18/2000 | US6089151 Method and stencil for extruding material on a substrate |
| 07/18/2000 | US6088914 Method for planarizing an array of solder balls |
| 07/18/2000 | CA2213957C Communication terminal apparatus |
| 07/18/2000 | CA2196265C Assembly circuit board with plug connector |
| 07/18/2000 | CA2142683C Process for catalyzation in electroless plating using chitosan or a chitosan derivative |
| 07/13/2000 | WO2000041447A1 Method for producing a multilayer printed circuit board |
| 07/13/2000 | WO2000041446A1 Circuit board features with reduced parasitic capacitance and method therefor |
| 07/13/2000 | WO2000041219A1 Method and device for processing components, notably semiconductor chips, arranged on a substrate |
| 07/13/2000 | WO2000041192A1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor |
| 07/13/2000 | WO2000040648A1 Heat debondable adhesive composition and adhesion structure |
| 07/13/2000 | WO2000040520A1 Electrically conductive ceramics |
| 07/13/2000 | WO2000040345A1 Methods of manufacturing voidfree resin impregnated webs |
| 07/13/2000 | WO2000040343A1 Apparatus and method for applying flux to a substrate |
| 07/13/2000 | WO2000016366A3 Method for assembling metal printed conductors as electrodes on a channel plate for ultrawide flat screens |
| 07/13/2000 | WO1999065282A9 Ic stack utilizing flexible circuits with bga contacts |