| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/04/2000 | US6045857 Curable, water-borne one-component coating system using thermally labile hydrophillic groups |
| 04/04/2000 | US6045743 Enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property and then sealing the container and removing oxygen |
| 04/04/2000 | US6045714 Method for forming flat surface vias in integrated circuit substrates |
| 04/04/2000 | US6045713 Forming an underlying metal layer on an insulation film with a deposition layer formed by dry plating and a copper deposition layer formed by dry plating; applying a surface treatment using an alkaline solution; adhesive-free; defects |
| 04/04/2000 | US6045615 Homogeneous screening nozzle |
| 04/04/2000 | US6045604 Autocatalytic chemical deposition of zinc tin alloy |
| 04/04/2000 | US6045396 Flex cable connector for cryogenic application |
| 04/04/2000 | US6045371 Connector for electrical connection of circuit boards and such a method for electrical connection of circuit boards using such a connector |
| 04/04/2000 | US6045368 Means for accurately aligning and attaching an electrical part to a surface mount circuit |
| 04/04/2000 | US6045240 LED lamp assembly with means to conduct heat away from the LEDS |
| 04/04/2000 | US6045032 Method of preventing solder reflow of electrical components during wave soldering |
| 04/04/2000 | US6045025 Method and apparatus for soldering and soldering land of a printed circuit board |
| 04/04/2000 | US6044708 Oscillation type gyroscope |
| 04/04/2000 | US6044550 Process for the manufacture of printed circuit boards |
| 04/04/2000 | US6044549 Assembly of electronic components onto substrates |
| 04/04/2000 | CA2021318C Method of forming fine patterns |
| 04/03/2000 | CA2284358A1 Electronic verification machine for documents |
| 03/30/2000 | WO2000018203A1 Method and means for manufacturing printed wiring boards |
| 03/30/2000 | WO2000018202A1 Multilayer build-up wiring board |
| 03/30/2000 | WO2000018201A1 Method for producing multi-layer circuits |
| 03/30/2000 | WO2000018200A1 Method for applying conductive lines on the casing of mobile phone |
| 03/30/2000 | WO2000018199A1 Method for producing etched circuits |
| 03/30/2000 | WO2000017963A1 Connecting system |
| 03/30/2000 | WO2000017924A2 Method and device for buried chips |
| 03/30/2000 | WO2000017923A1 Bump forming method, soldering preprocessing method, soldering method, soldering preprocessing apparatus and soldering apparatus |
| 03/30/2000 | WO2000017840A2 Display and backlighting assembly |
| 03/30/2000 | WO2000017422A1 Electrolytic cleaning of conductive bodies |
| 03/30/2000 | WO2000017243A1 Phenol-novolacs with improved optical properties |
| 03/30/2000 | WO2000003259A3 Method and apparatus for distinguishing regions where a material is present on a surface |
| 03/30/2000 | DE19946130A1 Contact device for flat foil conductor e.g. for automobile electrics, has contact pin inserted through opening in carrier element over which flat foil conductor is applied |
| 03/30/2000 | DE19858232C1 Electric drive unit for motor vehicle window lifter or windscreen wiper, has power switch combined with control unit in integrated circuit arranged on lead frame |
| 03/30/2000 | DE19844098A1 Kunststoffolie für die Verklebung mit anderen Folien und Leiterplatten Plastic film for bonding with other films and boards |
| 03/30/2000 | DE19843517A1 Drilling tool for providing micro-bores in multi-layer printed circuit board has spiral feed section which tapers inwards over defined axial length towards pointed drill head |
| 03/30/2000 | DE19841900A1 Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme A process for applying metallic conductor tracks as electrodes on a channel plate for large area flat panel displays |
| 03/30/2000 | DE19840825A1 Printed circuit board manufacturing method for vehicle air bag control device |
| 03/30/2000 | DE19840167A1 Electrical insulation testing of thin base material, for multilayer printed circuit board, applies voltage avoiding breakdown, then breakdown current measurement |
| 03/30/2000 | DE19831558C1 Vorrichtung zum Laserbearbeiten von flachen Werkstücken An apparatus for laser machining of flat workpieces |
| 03/30/2000 | DE19829986C1 Verfahren zur Direktbelichtung von Leiterplattensubstraten Process for the direct exposure of circuit board substrates |
| 03/30/2000 | CA2341622A1 Electrolytic cleaning of conductive bodies |
| 03/30/2000 | CA2309579A1 Phenol-novolacs with improved optical properties |
| 03/29/2000 | EP0989794A2 Surface mount thermal connections |
| 03/29/2000 | EP0989793A2 Method of making peripheral low inductance interconnects with reduced contamination |
| 03/29/2000 | EP0989792A2 Polymeric foil for glueing onto other foils and circuit boards |
| 03/29/2000 | EP0989791A2 Desmearing process |
| 03/29/2000 | EP0989790A1 Apparatus and method for the treatment of substrates with an etching liquid |
| 03/29/2000 | EP0989789A2 Printed wiring board and manufacturing method thereof |
| 03/29/2000 | EP0989788A2 Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board |
| 03/29/2000 | EP0989631A2 System for modifying printed wiring connections after installation |
| 03/29/2000 | EP0989610A2 Multilayered wiring structure and method of manufacturing the same |
| 03/29/2000 | EP0989570A1 Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device |
| 03/29/2000 | EP0989175A1 Thermosetting adhesive |
| 03/29/2000 | EP0989173A1 Thermosetting pressure-sensitive adhesive |
| 03/29/2000 | EP0989172A1 Adhesive composition for metal foil, adhesive-coated metal foil, metal clad laminate and related materials using the same |
| 03/29/2000 | EP0988576A2 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |
| 03/29/2000 | EP0988197A2 Window wiper motor system for an automotive vehicle |
| 03/29/2000 | EP0988129A1 Method and device for repairing defective soldered joints |
| 03/29/2000 | EP0988029A1 Device and methods for wound treatment |
| 03/29/2000 | EP0663417B1 Polyimide laminate comprising thermoplastic polyimide polymer or thermoplastic polyimide film, and process for producing the laminate |
| 03/29/2000 | EP0583426B2 Improved process for preparing a nonconductive substrate for electroplating |
| 03/29/2000 | CN2371766Y Device for detaching integrated circuit |
| 03/29/2000 | CN1249122A Moulded sockets for electronic component attachment |
| 03/29/2000 | CN1249121A Circuit board for electrical apparatus with HF components, particularly for mobile radio communications equipment |
| 03/29/2000 | CN1248958A Composition and method for reducing copper oxide to metallic copper |
| 03/29/2000 | CN1248882A Multi-layer circuit board for semiconductor chip set unit and making method thereof |
| 03/29/2000 | CN1248881A Permanganate dirt-removing method for printed-circuit board |
| 03/29/2000 | CN1248802A Device for changing printed wire connection mode after installation |
| 03/29/2000 | CN1248798A Method for installing transmission or receiving module of optical chain and rigid bendable board |
| 03/29/2000 | CN1248778A Axial wire-guiding type electronics parts and device for installation of circuit base board |
| 03/29/2000 | CN1248604A Adhesion agent for metal sheet and adhesion agent coated metal sheet |
| 03/29/2000 | CN1248603A Small chip adhesion agent for microelectronic device |
| 03/29/2000 | CN1050941C Device and method for electric/mechanical connection structure |
| 03/29/2000 | CN1050930C Belt-rolling automatic welding ball array IC package method |
| 03/28/2000 | US6043990 Multiple board package employing solder balis and fabrication method and apparatus |
| 03/28/2000 | US6043989 Static electricity removing structure for portable electronic devices |
| 03/28/2000 | US6043986 Printed circuit board having a plurality of via-holes |
| 03/28/2000 | US6043745 Electronic devices and methods of forming electronic devices |
| 03/28/2000 | US6043670 Method for testing integrated circuits |
| 03/28/2000 | US6043669 Wireless test fixture |
| 03/28/2000 | US6043563 Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals |
| 03/28/2000 | US6043454 Apparatus and method for in-line soldering |
| 03/28/2000 | US6043437 Alumina insulation for coating implantable components and other microminiature devices |
| 03/28/2000 | US6043435 Conducting section device and method for manufacturing the same |
| 03/28/2000 | US6043429 Method of making flip chip packages |
| 03/28/2000 | US6043150 Method for uniform plating of dendrites |
| 03/28/2000 | US6042929 Multilayer metalized composite on polymer film product and process |
| 03/28/2000 | US6042894 Anisotropically electroconductive resin film |
| 03/28/2000 | US6042889 Immersing substrate in aqueous plating bath containing dissolved metal salt, chelating agent, reducing agent, dissolved mediator organometallic compound |
| 03/28/2000 | US6042712 Apparatus for controlling plating over a face of a substrate |
| 03/28/2000 | US6042711 Metal foil with improved peel strength and method for making said foil |
| 03/28/2000 | US6042689 Apparatus for joining flat electrical components of variable size |
| 03/28/2000 | US6042685 Multiple wire printed circuit board and process for making the same |
| 03/28/2000 | US6042682 Method of thermocompression bonding a supporting substrate to a semiconductor bare chip |
| 03/28/2000 | US6042667 Method of fabricating ceramic multilayer substrate |
| 03/28/2000 | US6042648 Vertical circuit board soldering apparatus |
| 03/28/2000 | US6042413 Method for achieving substantially uniform expansion of dielectric plate and electrical connector made in accordance therewith |
| 03/28/2000 | US6042391 High density electrical connectors |
| 03/28/2000 | US6042389 Low profile connector |
| 03/28/2000 | US6042388 Electromechanical module having a thin springy plate for establishing pressed electrical connections |
| 03/28/2000 | US6041840 Vacuum lamination device and a vacuum lamination method |
| 03/28/2000 | US6041496 Method of making ceramic substrate |