| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/03/2000 | DE19901140A1 Leitfähige Klebebänder und ihre Herstellung Conductive tapes and their production |
| 08/03/2000 | DE10003264A1 Dielectric ceramic, for electronic multilayer ceramic substrates, comprises a sintered mixture of a neodymium- and lanthanide-substituted barium titanate ceramic and a barium, silicon and boron oxide glass |
| 08/02/2000 | EP1024554A2 Flexible circuit compression connector system and method of manufacture |
| 08/02/2000 | EP1024546A1 Microwave circuit module and device for connection to another module |
| 08/02/2000 | EP1024535A2 Thin film circuit with component |
| 08/02/2000 | EP1024529A2 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board |
| 08/02/2000 | EP1024507A1 Ceramic electronic part |
| 08/02/2000 | EP1024405A1 Photosensitive insulating paste and thick-film multi-layer circuit substrate |
| 08/02/2000 | EP1024211A2 Silver alloy plating bath and a method of forming a silver alloy film by means of the same |
| 08/02/2000 | EP1024022A1 Plate for screen printing and method for manufacturing the same |
| 08/02/2000 | EP1023821A1 Method for connecting surface mount components to a substrate |
| 08/02/2000 | EP1023770A1 Surface mount lc filter with polymer layers |
| 08/02/2000 | EP1023743A2 Composite electrical contact structure and method for manufacturing the same |
| 08/02/2000 | EP1023174A1 Manufacture of thin metal objects |
| 08/02/2000 | EP1023136A1 Flux management system |
| 08/02/2000 | EP0763261B1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof |
| 08/02/2000 | EP0700409B1 Thermally cross-linkable heat-sealing adhesive |
| 08/02/2000 | CN2390377Y Accurate automatic ring mounting device for drill specially adapted for drilling PC board |
| 08/02/2000 | CN1262025A Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 08/02/2000 | CN1261982A Thermal release for fixing on a circuit substrate |
| 08/02/2000 | CN1261977A Resistor and method of producing the same |
| 08/02/2000 | CN1261844A Extruded core laminates for circuit boards |
| 08/02/2000 | CN1261765A Composite laminated circuit structure and its making method |
| 08/02/2000 | CN1261632A Selective electrolytic metal chemical/electro plating device and method by using fluid head |
| 08/02/2000 | CN1261567A 焊接装置 Welding equipment |
| 08/02/2000 | CN1055194C Covered copper plate fast printing method |
| 08/01/2000 | US6097611 Multi-chip land grid array carrier |
| 08/01/2000 | US6097581 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 08/01/2000 | US6097277 Resistor network with solder sphere connector |
| 08/01/2000 | US6097260 Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks |
| 08/01/2000 | US6097086 Semiconductor chip carrier including an interconnect component interface |
| 08/01/2000 | US6097084 Photointerruptor |
| 08/01/2000 | US6097082 Semiconductor device |
| 08/01/2000 | US6096982 Method and apparatus for conductively joining components |
| 08/01/2000 | US6096981 Packaging electrical circuits |
| 08/01/2000 | US6096848 Prepared by reacting 2-cyanoacrylic acids or their alkyl esters with diols in the presence of sulfonic acids as catalysts; adhesives for use in electronics |
| 08/01/2000 | US6096665 Coating a sheet with a thermosetting resin surrounding the fibers, and filling some, but not all, of said interstices; coating again with a thermosetting resin surrounding the fiber and filling all the interstices; curing; integrated circuits |
| 08/01/2000 | US6096482 Making insulating layer by heat treating polyamic acid of p-phenylenediamine, 3,3',4,4'-biphenyltetracarboxyacid and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl on a metal foil substrate; coefficient of thermal expansion same as foil |
| 08/01/2000 | US6096411 Comprising 70-90 wt % of copper particles of an average particle size of 0.5-8 mu m, 0.5-15 wt % of insulating particles of an average particle size of 10-20 mu m, 6-17 wt % of thermosetting type liquid epoxy resin |
| 08/01/2000 | US6096245 Conductive resin composition with kneading with alloy, molding with alloy of tin free of lead |
| 08/01/2000 | US6096131 Solder paste deposition |
| 08/01/2000 | US6095857 Electrical component for surface-mounting on a circuit board |
| 08/01/2000 | US6095823 Method of electrically connecting a component to a PCB |
| 08/01/2000 | US6095822 Component module holder |
| 08/01/2000 | US6095405 Method for soldering integrated circuits |
| 08/01/2000 | US6095404 Positioning solder composition having antimony, lead, and tin and assembling electronics with solder |
| 08/01/2000 | US6095403 Circuit board component retention |
| 08/01/2000 | US6095400 Reinforced solder preform |
| 08/01/2000 | US6095398 Solder ball arrangement device |
| 08/01/2000 | US6095397 Solder deposit support |
| 08/01/2000 | US6095041 Stencil mask with channels including depressions |
| 08/01/2000 | US6094984 Acceleration sensor with a circuit board separated from a base plate by a space |
| 08/01/2000 | US6094832 Method for depositing solder paste on a pad |
| 08/01/2000 | US6094811 Central electric system for a motor vehicle and method of manufacturing same |
| 07/27/2000 | WO2000044211A1 Flexible printed circuit board arrangement |
| 07/27/2000 | WO2000044210A1 Multi-layer rf printed circuit architecture |
| 07/27/2000 | WO2000044209A1 System and method for interconnecting layers in a printed circuit board |
| 07/27/2000 | WO2000044208A1 Flexible microsystem and building techniques |
| 07/27/2000 | WO2000044066A2 Remote entry integrally molded transmitter |
| 07/27/2000 | WO2000044051A1 Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell |
| 07/27/2000 | WO2000043951A1 Chip card equipped with a loop antenna, and associated micromodule |
| 07/27/2000 | WO2000043574A1 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards |
| 07/27/2000 | WO2000043556A1 Method for treating a brittle thin metal strip and magnetic parts made from a nanocrystalline alloy strip |
| 07/27/2000 | WO2000043156A1 Method and apparatus for dispensing material in a printer |
| 07/27/2000 | WO2000021101A3 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 07/27/2000 | DE19902714A1 Structured coating process used in metallizing processes comprises applying a material to a substrate, covering the substrate and the material with a coating and then removing the material together with the coating |
| 07/27/2000 | DE19850595A1 Verfahren zum Laserlöten und zur Temperaturüberwachung von Halbleiterchips sowie nach diesem Verfahren hergestellte Chipkarte A method of laser soldering and for monitoring the temperature of the semiconductor chip produced by this method as well as smart card |
| 07/27/2000 | DE10001180A1 Manufacturing PCB involves holding suction surface, inserting conducting section into through hole, and soldering substrate sides to connect bridges to connection part and conducting section |
| 07/27/2000 | DE10001137A1 Rolled copper foil, for flexible printed circuits, has a specified oxygen content, strictly controlled trace element contents and a specified softening temperature increase index |
| 07/27/2000 | CA2359953A1 Method and apparatus for dispensing material in a printer |
| 07/27/2000 | CA2358907A1 Method for treating a brittle thin metal strip and magnetic parts made from a nanocrystalline alloy strip |
| 07/26/2000 | EP1022818A2 Surface mount modular jack |
| 07/26/2000 | EP1022810A2 Method for connecting a cable with a printed circuit board and housing with cable connected to the circuit board according to the method |
| 07/26/2000 | EP1022779A1 Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s) |
| 07/26/2000 | EP1022774A2 Flip chip assembly of semiconductor IC chips |
| 07/26/2000 | EP1022773A2 Chip carrier substrate |
| 07/26/2000 | EP1022770A2 Method and apparatus for plating and plating structure |
| 07/26/2000 | EP1022573A2 Scan test machine for densely spaced test sites |
| 07/26/2000 | EP1022146A1 Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit |
| 07/26/2000 | EP1022120A2 Press plate and method for producing it |
| 07/26/2000 | EP1021938A1 Process for the formation of composite films |
| 07/26/2000 | EP1021937A2 Method of manufacturing surface-mountable sil hybrid circuit |
| 07/26/2000 | EP1021792A1 Method for making smart cards capable of operating with and without contact |
| 07/26/2000 | EP1021593A2 Method and solution for producing gold coating |
| 07/26/2000 | EP0797909B1 Copper coating |
| 07/26/2000 | EP0771472B1 Process for connecting an electric connection of an unpacked ic component to a conductive track on a substrate |
| 07/26/2000 | CN1261468A Display mounting assembly |
| 07/26/2000 | CN1261457A Surface mount multilayer capacitor |
| 07/26/2000 | CN1261251A Soldering method for electric connection between mother board and electronic elements |
| 07/26/2000 | CN1261212A Elastic electric interconnector with varied lateral sections |
| 07/26/2000 | CN1261204A Method and apparatus for separating products on same substrate along cutting lines |
| 07/26/2000 | CN1261199A Variable resistors |
| 07/26/2000 | CN1261026A Flat multi-layer ceramic component with subadjacent grooves |
| 07/25/2000 | US6094357 Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove |
| 07/25/2000 | US6094354 Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board |
| 07/25/2000 | US6094349 Electrical device having a printed-circuit board and method for assembling the device |
| 07/25/2000 | US6094344 Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates |
| 07/25/2000 | US6094343 Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler |
| 07/25/2000 | US6094112 Surface mount filter device |
| 07/25/2000 | US6094058 Temporary semiconductor package having dense array external contacts |