| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/15/2000 | US6103135 Forming strips of polyimide films with flashing layer of metals for multilayer element |
| 08/15/2000 | US6103134 Circuit board features with reduced parasitic capacitance and method therefor |
| 08/15/2000 | US6103086 Method of forming reliable copper interconnects with improved hole filling |
| 08/15/2000 | US6103016 Cooling substrate in moist atmosphere prior to directing solid carbon dioxide particles against it to cause moisture to condense on the substrate surface in a continuous film which reacts to form carbonic acid ions to neutralize charges |
| 08/15/2000 | US6102839 Tool-change system for a machine tool with a number of machining heads |
| 08/15/2000 | US6102747 Modular connectors |
| 08/15/2000 | US6101937 Screen printing machine having paste dispensers and a squeegee unit |
| 08/15/2000 | US6101710 Method for facilitating engineering changes in a multiple level circuit package |
| 08/15/2000 | US6101708 Method for electrically connecting terminals to each other |
| 08/15/2000 | CA2191807C Circuit arrangement having a plurality of circuit units and a common multi-wire cable |
| 08/10/2000 | WO2000047027A1 Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device |
| 08/10/2000 | WO2000047025A2 Method for forming printed circuit board electrical interconnects |
| 08/10/2000 | WO2000047024A2 Multi-layer circuit board assembly for the packaging of semiconductor devices |
| 08/10/2000 | WO2000046877A2 Printed circuit boards with solid interconnect and method of producing the same |
| 08/10/2000 | WO2000046837A2 Improved circuit board manufacturing process |
| 08/10/2000 | WO2000046730A1 Registration control during workpiece processing |
| 08/10/2000 | WO2000046315A1 Adhesive, electrode-connecting structure, and method of connecting electrodes |
| 08/10/2000 | WO2000046188A1 Method for producing alkanesulfonic acids |
| 08/10/2000 | WO2000045674A1 Fabric-based, adhesively mounted printed circuit for upholstered seats and the like |
| 08/10/2000 | WO2000028552A8 Method and apparatus for photosensitized ultraviolet decontamination of surfaces and aerosol clouds |
| 08/10/2000 | WO2000011679A3 Contact element |
| 08/10/2000 | DE19904262A1 Verfahren zur Herstellung von Alkansulfonsäuren A process for preparing alkanesulfonic acids |
| 08/10/2000 | DE19901974A1 Electronic switch unit, has shaft or axle in form of separate part for retrospective fitting into aperture in unit and cover for aperture on side remote from unit |
| 08/10/2000 | CA2362072A1 Method for producing alkanesulfonic acids |
| 08/09/2000 | WO2000052755A1 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus |
| 08/09/2000 | EP1026930A1 Circuit board side interconnect |
| 08/09/2000 | EP1026929A2 Elemental piece of flexible printed wiring board and flexible printed wiring board |
| 08/09/2000 | EP1026928A2 Bond pads for fine-pitch applications on air bridge circuit boards |
| 08/09/2000 | EP1026927A2 Special bond pad configurations for printed circuit boards |
| 08/09/2000 | EP1026794A2 Electrical slip ring having a higher circuit density |
| 08/09/2000 | EP1026787A2 A contact spring and a tool for handling it |
| 08/09/2000 | EP1026744A1 Video display and manufacturing method therefor |
| 08/09/2000 | EP1026286A2 Method and apparatus for plating substrate with copper |
| 08/09/2000 | EP1026285A2 Electroless gold plating solution and process |
| 08/09/2000 | EP1025749A1 Multi-layer circuit board |
| 08/09/2000 | EP1025587A1 Semiconductor flip-chip package and method for the fabrication thereof |
| 08/09/2000 | EP1025418A1 Three-dimensional inspection system |
| 08/09/2000 | EP1025409A1 Improved chemical drying and cleaning system |
| 08/09/2000 | EP1024958A1 Manufacture of lithographic printing forms |
| 08/09/2000 | EP0909407B1 Photopolymerizable thermosetting resin composition |
| 08/09/2000 | EP0686093B1 Metal on plastic films with adhesion-promoting layer |
| 08/09/2000 | CN1262859A Printed wiring board and method for manufacturing same |
| 08/09/2000 | CN1262800A IC socket |
| 08/09/2000 | CN1262636A Apparatus and method for making uniformly sized and shaped spheres |
| 08/09/2000 | CN1262597A Equipment and method for making plug holes |
| 08/09/2000 | CN1262596A Method for making multi-layer circuit board by substrate with open |
| 08/09/2000 | CN1262595A Equipment and method for making plug holes |
| 08/09/2000 | CN1262492A Conductive paste and its solidifying method, information receiver-transmitter and antenna forming method |
| 08/09/2000 | CN1262335A Rolled copper foil for flexible PCB and its manufacturing method |
| 08/09/2000 | CN1055370C Semiconductor unit heat discharging device |
| 08/08/2000 | US6101099 Method and device for connecting electrical components to printed circuit boards |
| 08/08/2000 | US6101094 Printed circuit board with integrated cooling mechanism |
| 08/08/2000 | US6100915 Laser drawing apparatus |
| 08/08/2000 | US6100787 Multilayer ceramic package with low-variance embedded resistors |
| 08/08/2000 | US6100626 System for connecting a transducer array to a coaxial cable in an ultrasound probe |
| 08/08/2000 | US6100606 High frequency switching device |
| 08/08/2000 | US6100589 Semiconductor device and a method for making the same that provide arrangement of a connecting region for an external connecting terminal |
| 08/08/2000 | US6100582 Circuit substrate, circuit-formed suspension substrate, and production method thereof |
| 08/08/2000 | US6100580 Semiconductor device having all outer leads extending from one side of a resin member |
| 08/08/2000 | US6100475 Solder bonding printed circuit boards |
| 08/08/2000 | US6100178 Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same |
| 08/08/2000 | US6100175 Method and apparatus for aligning and attaching balls to a substrate |
| 08/08/2000 | US6100115 Semiconductor device |
| 08/08/2000 | US6100112 Method of manufacturing a tape carrier with bump |
| 08/08/2000 | US6099974 Composite layer of two components formed on and adhered to surface of substrate, wherein first component is solderable metal that has a higher melting point than and is wettable by solder and second component is material of lower melting point |
| 08/08/2000 | US6099959 Method of controlling the spread of an adhesive on a circuitized organic substrate |
| 08/08/2000 | US6099939 Adhesion of metal by vapor depositon on substrate from organic dielectric layer |
| 08/08/2000 | US6099935 Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
| 08/08/2000 | US6099798 Ultraviolet light block and photocatalytic materials |
| 08/08/2000 | US6099745 Rigid/flex printed circuit board and manufacturing method therefor |
| 08/08/2000 | US6099715 Method for electrochemical treatment, especially for polishing |
| 08/08/2000 | US6099713 Tin-silver alloy electroplating bath and tin-silver alloy electroplating process |
| 08/08/2000 | US6099711 Process for the electrolytic deposition of metal layers |
| 08/08/2000 | US6099681 Mounting apparatus for mounting small balls and mounting method thereof |
| 08/08/2000 | US6099677 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 08/08/2000 | US6099365 Solder-holding clips for applying solder to connectors or the like |
| 08/08/2000 | US6099326 Contact for use with matrix type connector |
| 08/08/2000 | US6099324 Electrical motor unit having a control module |
| 08/08/2000 | US6098861 Breaking apparatus for ceramic board |
| 08/08/2000 | US6098539 Apparatus for screen position correcting in screen printing |
| 08/08/2000 | US6098283 Method for filling vias in organic, multi-layer packages |
| 08/08/2000 | US6098282 Laminar stackable circuit board structure with capacitor |
| 08/08/2000 | US6098281 Electrical pins and method for their insertion into apertures of a circuit board |
| 08/08/2000 | US6098280 Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes |
| 08/08/2000 | US6098278 Method for forming conductive epoxy flip-chip on chip |
| 08/08/2000 | US6098275 Method for inserting an electrical contact pin with an compliant attachment zone into a hole in a printed circuit board |
| 08/08/2000 | US6098274 Machine tool featuring a number of machining heads for machining printed circuit boards |
| 08/08/2000 | US6098271 Method for assembling a magnetic disk drive with a relaying flexible printed circuit sheet |
| 08/05/2000 | CA2296900A1 Electroplating solution for electroplating lead and lead/tin alloys |
| 08/03/2000 | WO2000050909A1 Testing fastenings of printed circuit board |
| 08/03/2000 | WO2000045625A2 Method for the direct electroplating of through-holes in printed circuit boards |
| 08/03/2000 | WO2000045624A1 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
| 08/03/2000 | WO2000045431A1 Method of packaging semiconductor device using anisotropic conductive adhesive |
| 08/03/2000 | WO2000045323A1 In-line programming system and method |
| 08/03/2000 | WO2000044961A1 Surface treating method |
| 08/03/2000 | WO2000044960A1 Matrix assisted pulsed laser evaporation direct write |
| 08/03/2000 | WO2000022814A3 Image sensor mounted by mass reflow |
| 08/03/2000 | DE19951865A1 Circuit board e.g. for vehicle indicator instrument, has light source mounted on bearer in form of bridge attached to circuit board by fixing arrangement in form of clip fixing or hinge made in one piece with instrument housing |
| 08/03/2000 | DE19903500A1 Dünnschichtschaltkreis mit Bauteil Thin film circuit with component |
| 08/03/2000 | DE19903108A1 Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten Method for direct galvanic through-hole plating of printed circuit boards |