| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/23/2000 | EP1030349A2 Method and apparatus for treating components mounted on a substrate, in particular semiconductor chips |
| 08/23/2000 | EP1030323A1 Ceramic electronic component |
| 08/23/2000 | EP1029947A2 Electroplating solution for electroplating lead and lead/tin alloys |
| 08/23/2000 | EP1029944A2 Method for enhancing the solderability of a surface |
| 08/23/2000 | EP1029829A1 Photosensitive insulating paste and thick film multi-layer circuit substrate |
| 08/23/2000 | EP1029649A1 Laminator |
| 08/23/2000 | EP1029626A2 Method and apparatus for dispensing small amounts of liquid material |
| 08/23/2000 | EP1029431A1 Via pad geometry supporting uniform transmission line structures |
| 08/23/2000 | EP1028818A1 Deposition of substances on a surface |
| 08/23/2000 | EP1018290A4 A system and method for packaging integrated circuits |
| 08/23/2000 | CN2393305Y Automatic adhesive-tape applicating machine |
| 08/23/2000 | CN1264273A Electronic component and manufacture method thereof |
| 08/23/2000 | CN1264271A Method for manufacturing double-side flexible printed circuit board |
| 08/23/2000 | CN1264270A Flexible wiring base and making method thereof |
| 08/23/2000 | CN1264169A Device and method for testing integral circuit packaging pin welding |
| 08/23/2000 | CN1264131A Photosensitive insulation paste and thick film multilayer circuit substrate |
| 08/23/2000 | CN1264130A Photosensitive insulation paste and thick film multilayer circuit substrate |
| 08/23/2000 | CN1264108A Method for manufacture suspension device for magnetic head |
| 08/23/2000 | CN1055819C Bite device for applying soler to circuit board |
| 08/23/2000 | CN1055818C Method for selective metallizing substrate |
| 08/23/2000 | CN1055734C Apparatus for chemically etching substrates |
| 08/22/2000 | US6108228 Quad in-line memory module |
| 08/22/2000 | US6108212 Surface-mount device package having an integral passive component |
| 08/22/2000 | US6108211 Electrical contact system |
| 08/22/2000 | US6108210 Flip chip devices with flexible conductive adhesive |
| 08/22/2000 | US6108205 Means and method for mounting electronics |
| 08/22/2000 | US6108197 Flexible wearable computer |
| 08/22/2000 | US6107877 Predistortion generator coupled with an RF amplifier |
| 08/22/2000 | US6107638 Silicon nitride circuit substrate and semiconductor device containing same |
| 08/22/2000 | US6107600 Laser machining apparatus |
| 08/22/2000 | US6107186 High planarity high-density in-laid metallization patterns by damascene-CMP processing |
| 08/22/2000 | US6107181 Method of forming bumps and template used for forming bumps |
| 08/22/2000 | US6107119 Method for fabricating semiconductor components |
| 08/22/2000 | US6107109 Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate |
| 08/22/2000 | US6107003 Electrodepositing alkaline refractory metal on surface of copper foil; thermosetting resin is applied to surface and cured; laminating foil to inner layer board having wirings;etching; forming blid vias; forming outer wirings |
| 08/22/2000 | US6106923 Venting hole designs for multilayer conductor-dielectric structures |
| 08/22/2000 | US6106899 Method for surface treatment of copper or copper alloys |
| 08/22/2000 | US6106891 Applying a curable fill to an aperture, peeling a layer of polymer, applying heat and pressure |
| 08/22/2000 | US6106322 Electrical connections |
| 08/22/2000 | US6106308 Contact of an electrical connector having solder terminal capable of fitting with a housing of the connector |
| 08/22/2000 | US6106303 Trim panel having grooves with integrally formed electrical circuits |
| 08/22/2000 | US6105852 Etched glass solder bump transfer for flip chip integrated circuit devices |
| 08/22/2000 | US6105851 Method of casting I/O columns on an electronic component with a high yield |
| 08/22/2000 | US6105495 Screen printing apparatus and screen printing method |
| 08/22/2000 | US6105246 Method of making a circuit board having burr free castellated plated through holes |
| 08/22/2000 | US6105243 Method of fabricating multilayer printed circuit board |
| 08/17/2000 | WO2000048441A1 Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same |
| 08/17/2000 | WO2000048437A1 Discrete component in-mold mounting |
| 08/17/2000 | WO2000048267A1 A method and a device for manufacturing a roll of items |
| 08/17/2000 | WO2000048249A1 Semiconductor component with a chip carrier with openings for contacting |
| 08/17/2000 | WO2000048243A1 Flexible printed-circuit substrate, film carrier, semiconductor device on tape, semiconductor device, method of semiconductor manufacture, circuit susbstrate, and electronic device |
| 08/17/2000 | WO2000048242A1 Method for producing electrically conductive connections |
| 08/17/2000 | WO2000048012A1 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board |
| 08/17/2000 | WO2000047399A1 Multilayer ceramic circuit boards with embedded resistors |
| 08/17/2000 | WO2000032835A8 Electro-chemical deposition system |
| 08/17/2000 | WO2000017924A3 Method and device for buried chips |
| 08/17/2000 | DE19905886A1 Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements Identification element and method for producing an identification element |
| 08/17/2000 | DE19905055A1 Halbleiterbauelement mit einem Chipträger mit Öffnungen zur Kontaktierung A semiconductor device comprising a chip carrier having openings for contacting |
| 08/17/2000 | CA2362151A1 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board |
| 08/16/2000 | EP1028608A2 Process and coating composition for applying heat-sink paste to circuit boards |
| 08/16/2000 | EP1028607A1 Printed circuit board material and method of manufacturing board material and intermediate block body for board material |
| 08/16/2000 | EP1028483A1 Printed circuit with a conductive pattern for radio communication equipment and method for manufacturing such circuits |
| 08/16/2000 | EP1028462A1 Electronic module of extra thin construction |
| 08/16/2000 | EP1028388A2 Identification element and method of manufacturing an identification element |
| 08/16/2000 | EP1028354A1 Positive photosensitive resin composition, method of forming relief pattern, and electronic part |
| 08/16/2000 | EP1028180A1 Method for producing very small metal ball |
| 08/16/2000 | EP1027753A1 Edge interface electrical connectors |
| 08/16/2000 | EP1027739A1 Housing for piezoelectric transformer device |
| 08/16/2000 | EP1027723A2 Method of forming an electronic device |
| 08/16/2000 | EP1027721A1 Articles or compositions comprising nanoscale particles; methods of utilizing or producing such particles |
| 08/16/2000 | EP0929428B1 Valve control device with tridimensional printed board in mid technology |
| 08/16/2000 | EP0864118B1 Donor elements and processes for thermal dye transfer by laser |
| 08/16/2000 | EP0678124B1 Phosphating processes, particularly for use in fabrication of printed circuits utilizing organic resists |
| 08/16/2000 | CN2392339Y Acid resistant and alkaline resistant roller structure |
| 08/16/2000 | CN1263692A Method of producing ceramic multilayer substrate |
| 08/16/2000 | CN1263691A A device and method in electronics systems |
| 08/16/2000 | CN1263690A Pressure-bonded substrate, liquid crystal device, and electronic device |
| 08/16/2000 | CN1263689A Pressure-bonded substrate, liquid crystal device, and electronic device |
| 08/16/2000 | CN1263631A Method and apparatus for producing multilayer body for electronic component |
| 08/16/2000 | CN1263570A Process for manufacture of high quality very low profile copper foil and copper foil produced thereby |
| 08/16/2000 | CN1263485A Composition for preventing creeping of flux for soldering |
| 08/16/2000 | CN1263359A Circuit interconnection adopting virtual mirror image packaging piece |
| 08/16/2000 | CN1263346A Flexible printed circuit board mounting structure and recording reproducing device adopting said structure |
| 08/16/2000 | CN1263280A Connection wiring base board of electro-optical board, electro-optical device and electronic device |
| 08/16/2000 | CN1262977A Laser processing device and its method |
| 08/16/2000 | CN1055572C Assembly of shielded connectors and board having plated holes |
| 08/16/2000 | CN1055434C Single side copper-clad laminate |
| 08/15/2000 | US6104615 Semiconductor component assembly |
| 08/15/2000 | US6104598 Free form capacitor |
| 08/15/2000 | US6104464 Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board |
| 08/15/2000 | US6104280 Method of manufacturing and testing an electronic device, and an electronic device |
| 08/15/2000 | US6104267 Surface mount electronic reed switch component with transverse lead wire loops |
| 08/15/2000 | US6104088 Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board |
| 08/15/2000 | US6104087 Microelectronic assemblies with multiple leads |
| 08/15/2000 | US6103992 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| 08/15/2000 | US6103978 Printed wiring board having inner test-layer for improved test probing |
| 08/15/2000 | US6103977 Multilayer printed circuit board with cured and uncured resin layers |
| 08/15/2000 | US6103551 Semiconductor unit and method for manufacturing the same |
| 08/15/2000 | US6103549 No clean flux for flip chip assembly |
| 08/15/2000 | US6103354 Ceramic circuit substrate and method of fabricating the same |