Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2000
09/05/2000US6112407 Latticework with plurality of overlying lines
09/05/2000US6112406 Method for producing electrically conductive connections between two or more conductor structures
09/05/2000US6112355 Overflow scrub-washing method and apparatus
09/03/2000CA2299837A1 Electrical component for surface-mounting on a circuit board
08/2000
08/31/2000WO2000051232A1 Filter structures for integrated circuit interfaces
08/31/2000WO2000051141A1 Bus bar assembly
08/31/2000WO2000051100A1 Method for mounting tcp film to display panel
08/31/2000WO2000051099A1 Display panel
08/31/2000WO2000050555A1 Method and cleaning fluid for the wet cleaning of objects
08/31/2000WO2000050263A1 Control apparatus for an automobile
08/31/2000WO2000050246A1 Electronic device, method of manufacturing power supply board and imaging device, and method of manufacturing electronic device and electron source board
08/31/2000WO2000050230A1 Board with nickel-plated thru-holes and/or blind vias
08/31/2000WO2000050196A1 Apparatus and method for solder stenciling
08/31/2000WO2000026942A3 Method for producing filled vias in electronic components
08/31/2000DE19962422A1 Multilayer printed circuit board manufacturing method involves electro plating metal layer and etching it after which ink layer and sheet portion between slots are removed
08/31/2000DE19908366A1 Method for marking and testing thermally produced connections, particularly soldered connections by means of optical surface test involves using UV fluorescing markings applied to object surface
08/31/2000DE19906209A1 Cutting out individual circuit units from panel, using high speed milling of e.g. 1000 m per min
08/31/2000DE19905807A1 Verfahren zur Herstellung elektrisch leitender Verbindungen A process for producing electrically conductive connections
08/31/2000DE10000585A1 Screen printer has main body, chamber closed by support body, and air pockets
08/30/2000EP1032249A1 Electronic circuit board and soldering method therefor
08/30/2000EP1032079A1 Conductive elastomer interconnect
08/30/2000EP1032038A2 Conductive and resitive material with electrical stability for use in electronics devices
08/30/2000EP1032030A2 Flip chip bump bonding
08/30/2000EP1032011A2 Electron source, image forming apparatus, and manufacture method for electron source
08/30/2000EP1031644A1 Thiazole-and thiocarbamide-based chemicals for use with oxidative etchant solutions
08/30/2000EP1031417A2 Screen inspecting method, screen inspecting apparatus, and screen printing machine
08/30/2000EP1031396A1 Laser processing apparatus and method
08/30/2000EP0970520A4 Mounting structure and mounting process from semiconductor devices
08/30/2000EP0602252B1 Ceramic green sheet
08/30/2000CN2394404Y Solder coater on electric circuit board
08/30/2000CN1265262A System and method for packaging integrated circuits
08/30/2000CN1265226A Device and method for producing chip-substrate connection
08/30/2000CN1265213A Chip module, module and method for producing module, chip card
08/30/2000CN1264947A Circuit board assembly
08/30/2000CN1264930A High frequency circuit appts. antenna shared device and communication appts.
08/30/2000CN1264905A Method for prodn. of laminated ceramic electronic components
08/30/2000CN1264635A Non-lead solder powder, non-lead solder paste and its prepn. method
08/30/2000CN1264626A Soup treatment appts.
08/29/2000US6111758 Electronic component having alternate functionalities
08/29/2000US6111629 Display device
08/29/2000US6111628 Liquid crystal display device including plural bump electrodes
08/29/2000US6111602 Method and apparatus for inspecting solder joints
08/29/2000US6111479 Laminate printed circuit board with a magnetic layer
08/29/2000US6111417 Semiconductor component test apparatus including sucking mechanism maintaining components in tray during testing
08/29/2000US6111378 Window wiper motor system for an automotive vehicle
08/29/2000US6111322 Semiconductor device and manufacturing method thereof
08/29/2000US6111321 Ball limiting metalization process for interconnection
08/29/2000US6111312 Semiconductor device with leads engaged with notches
08/29/2000US6111309 Semiconductor device
08/29/2000US6111205 Via pad geometry supporting uniform transmission line structures
08/29/2000US6111204 Bond pads for fine-pitch applications on air bridge circuit boards
08/29/2000US6110982 For encapsulating electronic devices and circuits
08/29/2000US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method
08/29/2000US6110815 Electroplating fixture for high density substrates
08/29/2000US6110760 Methods of forming electrically conductive interconnections and electrically interconnected substrates
08/29/2000US6110651 Method for preparing polysilane pattern-bearing substrate
08/29/2000US6110650 Method of making a circuitized substrate
08/29/2000US6110643 Method of forming a multilayer printed circuit board and product thereof
08/29/2000US6110641 Radiation sensitive composition containing novel dye
08/29/2000US6110624 Forming masks, such as chrome masks on quartz, with a reduced defect rate.
08/29/2000US6110596 Silicon nitride ceramic circuit substrate and semiconductor device using the same
08/29/2000US6110576 Article comprising molded circuit
08/29/2000US6110568 Thin film circuit substrate and process for the manufacture thereof
08/29/2000US6110563 Method and arrangement for electromagnetically shielding an electronic means
08/29/2000US6110531 Gasifying a generated mist to form a gasified precursor comprising a bismuth-containing organic compound, a metal polyalkoxide compound, a lead-containing organic compound, oxidizing with oxygen gas to form a superlattice thin film
08/29/2000US6110399 Electroconductive solder particles dispersed in ferrofluid; magnetic field fixes pattern
08/29/2000US6109932 Three-dimensional electrical interconnection system
08/29/2000US6109930 Enhanced hardware arrangement for mounting a plurality of circuit boards together
08/29/2000US6109928 Arrangement of two disconnectable flat conductors and a connection unit for connecting a flat conductor
08/29/2000US6109927 Connector for adjacent circuit-bearing substrates
08/29/2000US6109840 Method and device for aligning a workpiece on a machine tool table
08/29/2000US6109509 Method of securely mounting conductive balls
08/29/2000US6109507 Method of forming solder bumps and method of forming preformed solder bumps
08/29/2000US6109323 Device to withdraw, superimpose and anchor foils for green-tape circuits
08/29/2000US6109175 Intaglio printing method, intaglio printer, method of formation of bumps or wiring pattern, apparatus therefor, bump electrode and printed circuit board
08/29/2000US6108938 Methods and apparatus for drying conveyorized articles of manufacture
08/29/2000US6108903 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
08/29/2000US6108863 Vacuum cleaner with dual blowing/suction function
08/29/2000CA2157259C Electronic device assembly and a manufacturing method of the same
08/24/2000WO2000049841A1 Electrical connection method and connection site
08/24/2000WO2000049655A1 Semiconductor device, circuit board, method of manufacturing circuit board, and electronic device
08/24/2000WO2000048845A1 Improved stencil
08/24/2000WO2000048837A1 Apparatus and method for depositing a viscous material
08/24/2000WO2000048784A1 Lead-free solder alloy powder paste use in pcb production
08/24/2000WO2000048780A1 Compact reflow and cleaning apparatus
08/24/2000WO2000048750A1 Polymer-coated metal composites by dip autopolymerization
08/24/2000WO2000048749A1 Method for adhering laminate structures
08/24/2000WO1999016935A3 Simplified process and apparatus for production of copper foil
08/24/2000WO1998049374A3 Device for electrolytic treatment of printed circuit boards and conductive films
08/24/2000DE19909245A1 Spreader for a viscous material on to a surface area has a smaller opening from the holding cartridge than the spreader opening with a distributor between them for an even spreading action
08/24/2000DE19908755A1 Metal electrodeposition process, especially for plastic and copper surface regions of circuit boards, uses a nickel and-or cobalt reduction plating bath containing a stabilizer to prevent autocatalytic deposition
08/24/2000DE19907628A1 Cable strain relief device has bridge elements round cable, deformable towards cable and able to be moved towards each other by screw connection to clamp cable between by deformation
08/24/2000DE19904327A1 Placing components on circuit boards involves generating marker in image of part of circuit board for alignment of component being moved in image with respect to marker
08/24/2000DE10007263A1 Arrangement for attaching conducting track planes to mounting plate, has relief structured plate surface with openings for conducting strips, and recesses for fixing straps on conducting strips
08/24/2000CA2362803A1 Polymer-coated metal composites by dip autopolymerization
08/23/2000EP1030544A1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
08/23/2000EP1030543A1 Non-woven fabric material and prepreg, and circuit board using the same
08/23/2000EP1030381A1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
08/23/2000EP1030366A2 Printed wiring board for semiconductor plastic package
08/23/2000EP1030365A1 Package substrate
1 ... 838 839 840 841 842 843 844 845 846 847 848 849 850 851 852 853 854 855 856 857 858 ... 1185