| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/12/2000 | US6118081 Component to substrate connection by runners and pads |
| 09/12/2000 | US6118080 Z-axis electrical contact for microelectronic devices |
| 09/12/2000 | US6117784 Process for integrated circuit wiring |
| 09/12/2000 | US6117759 Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package |
| 09/12/2000 | US6117706 Print circuit board |
| 09/12/2000 | US6117539 Conductive elastomer comprising non-conductive elastic material having quantity of conductive flakes interspersed therein grafted to elastic substrate to form electrically conductive circuit traces |
| 09/12/2000 | US6117536 Adhesion promoting layer for use with epoxy prepregs |
| 09/12/2000 | US6117497 Solid surface modification method and apparatus |
| 09/12/2000 | US6117382 Method for encasing array packages |
| 09/12/2000 | US6117367 Comprised of a metal or alloy, glass frit, an organic binder, a solvent, and a modifier phase; use in fabrication of multilayer ceramic substrates for semiconductors; paste reduces substrate defects such as via bulge and camber |
| 09/12/2000 | US6117347 Method of separating wafers into individual die |
| 09/12/2000 | US6117300 Method for forming conductive traces and printed circuits made thereby |
| 09/12/2000 | US6117250 Aqueous solution for increasing surface area of a metal and providing acid resistance to the metal; proton source, oxidizer, source of halogen ions, an azole compound, a thiazole and/or thiocarbamide, and water miscible solvent |
| 09/12/2000 | US6117212 System for evacuating air from a viscous media |
| 09/12/2000 | US6116923 Electrical connector |
| 09/12/2000 | US6116922 Electrical connector |
| 09/12/2000 | US6116921 Electrical connector having recessed solderball foot |
| 09/12/2000 | US6116916 Electrical connection box |
| 09/12/2000 | US6116912 Matrix switch board used to connect/disconnect switching system-and subscriber-side line |
| 09/12/2000 | US6116497 Process and device for the wave or vapor-phase soldering of electronic units |
| 09/12/2000 | US6116495 Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same |
| 09/12/2000 | US6116494 Method for re-attachment of a SMT component using a heated air jet |
| 09/12/2000 | US6116492 Jig for facilitating surface-soldering pin to laminated metal sheet |
| 09/12/2000 | US6116491 Gas flow controlling device and soldering apparatus using same |
| 09/12/2000 | US6116127 Flex die punching apparatus and method |
| 09/12/2000 | US6115939 Process and apparatus for the treatment of flat-form material especially of printed circuit boards |
| 09/12/2000 | US6115913 Connecting board |
| 09/12/2000 | US6115912 Apparatus and method for printed circuit board repair |
| 09/12/2000 | US6115911 Method of manufacturing a plug |
| 09/12/2000 | US6115910 Misregistration fidutial |
| 09/12/2000 | CA2216457C Nickel powder and process for preparing the same |
| 09/12/2000 | CA2044146C Non-toxic, non-flammable cleaner for printed board cleaning |
| 09/08/2000 | WO2000052982A2 Multifonctional laminate structure and process |
| 09/08/2000 | WO2000052977A1 Method of manufacturing multilayer wiring board |
| 09/08/2000 | WO2000052975A1 Circuit board printer |
| 09/08/2000 | WO2000052974A1 Method for producing circuit arrangements |
| 09/08/2000 | WO2000052383A1 Control and signaling device or signaling device with a luminous element |
| 09/08/2000 | WO2000051816A1 Method of manufacturing printing plate, and printing plate |
| 09/08/2000 | WO2000051719A1 Method and apparatus for conditioning solder paste |
| 09/08/2000 | WO2000021659A9 Integrated multilayered microfluidic devices and methods for making the same |
| 09/08/2000 | CA2366927A1 Circuit board printer |
| 09/08/2000 | CA2328956A1 Control and signaling device or signaling device with a luminous element |
| 09/07/2000 | DE19908960A1 Metal layer etching, especially for circuit board manufacture, is carried out in a spray etching unit using spray interruption durations conforming to the desired etching depth of different thickness layers |
| 09/07/2000 | DE19908574A1 Befehls- und Meldegerät oder Meldegerät mit einem Leuchtelement Control and signaling device or signaling device with a light element |
| 09/07/2000 | DE19907276A1 Producing solder connection between electrical/electronic component and carrier substrate involves solder coating of pure tin with thickness of less than 10 microns applied to metal pad |
| 09/07/2000 | DE19849930C1 Control apparatus for motor vehicle |
| 09/07/2000 | DE19840234C1 Printed circuit board screening soldering method e.g. for cordless telephones or mobile radio apparatus |
| 09/07/2000 | DE10010542A1 Elektrische Komponente zum Oberflächenmontieren auf einer Leiterplatte Electrical component for surface mounting on a printed circuit board |
| 09/06/2000 | EP1033778A2 Antenna frame for IC card |
| 09/06/2000 | EP1033777A2 Fabricating high-Q RF components |
| 09/06/2000 | EP1033749A2 Method and producing ceramic multilayer substrate |
| 09/06/2000 | EP1033197A2 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| 09/06/2000 | EP1032482A1 Method and device for thermally bonding connecting surfaces of two substrates |
| 09/06/2000 | EP0704145B1 Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern |
| 09/06/2000 | CN2395409Y 电连接器 The electrical connector |
| 09/06/2000 | CN2395398Y 电连接器 The electrical connector |
| 09/06/2000 | CN1265818A Circuit member and circuit board |
| 09/06/2000 | CN1265559A Circuit and with multi-voltage plane and multi-signal plane |
| 09/06/2000 | CN1265517A Method for manufacturing electrical insulating material board |
| 09/05/2000 | US6115264 Multilayer high frequency electronic parts |
| 09/05/2000 | US6115262 Enhanced mounting pads for printed circuit boards |
| 09/05/2000 | US6115261 Wedge mount for integrated circuit sensors |
| 09/05/2000 | US6115260 Memory module with obstacle removing terminal structure |
| 09/05/2000 | US6115254 Vertical surface mount apparatus with thermal carrier |
| 09/05/2000 | US6114769 Solder paste brick |
| 09/05/2000 | US6114763 Semiconductor package with translator for connection to an external substrate |
| 09/05/2000 | US6114759 Semiconductor package |
| 09/05/2000 | US6114757 Leadless IC socket |
| 09/05/2000 | US6114754 Tape automated bonding film |
| 09/05/2000 | US6114674 Multilayer circuit board with electrically resistive heating element |
| 09/05/2000 | US6114634 Circuit board layers with identification images |
| 09/05/2000 | US6114497 Polybenzoxazole resin and precursor thereof |
| 09/05/2000 | US6114240 Method for fabricating semiconductor components using focused laser beam |
| 09/05/2000 | US6114239 Relates to semiconductor flip chip technology and more particularly to conductive epoxy attachment of a die pad to a supporting substrate |
| 09/05/2000 | US6114187 Method for preparing a chip scale package and product produced by the method |
| 09/05/2000 | US6114185 Welding process and photovoltaic device |
| 09/05/2000 | US6114098 Filling an aperture in an electronic substrate which may be personalized or subsequently personalized to support and interconnect chips or other electronic components |
| 09/05/2000 | US6114097 Improves the 3-d patterning capability of laser pantography (computer controlled laser direct-write patterning); process for interconnecting ic chips to a substrate via sidewall patterning |
| 09/05/2000 | US6114091 Photopolymerizable composition containing an N-heterocyclic photoinitiator |
| 09/05/2000 | US6114088 Thermal transfer element for forming multilayer devices |
| 09/05/2000 | US6114060 Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions |
| 09/05/2000 | US6114019 Circuit board assemblies having filled vias free from bleed-out |
| 09/05/2000 | US6114015 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 09/05/2000 | US6113999 Multilayered substrate and method for its production |
| 09/05/2000 | US6113836 Method of forming thick film pattern and material for forming thick film pattern |
| 09/05/2000 | US6113835 Forming a separation groove and a ditch for cutting a thermoplastic resin sheet by a laser beam |
| 09/05/2000 | US6113730 Metal-foil-clad composite ceramic board and process for the production thereof |
| 09/05/2000 | US6113728 Forming filmy adhesive layer comprising liquid epoxy resin, solid resin and micro-capsule curing agent on surfaces of projecting electrodes of semiconductor wafer; cutting wafer along with adhesive layer to form chips; curing adhesive |
| 09/05/2000 | US6113724 Lamination molding method and an apparatus thereof |
| 09/05/2000 | US6113709 Method of preparing a conductive bonding pad |
| 09/05/2000 | US6113693 Universal fixture for holding printed circuit boards during processing |
| 09/05/2000 | US6113216 Wide array thermal ink-jet print head |
| 09/05/2000 | US6113053 Electronic chip component for measurement and tape cartridge holding the same |
| 09/05/2000 | US6112976 Method of manufacturing wire segments of homogeneous composition |
| 09/05/2000 | US6112975 Method for attaching spherical and/or non-spherical contacts to a substrate |
| 09/05/2000 | US6112911 Support assembly for board-mounted electrical appliance |
| 09/05/2000 | US6112885 Transport apparatus for thin, board-shaped substrates |
| 09/05/2000 | US6112657 Squeegee attachment system for a printing machine |
| 09/05/2000 | US6112656 Creamed-solder printing machine |
| 09/05/2000 | US6112408 Method for fabricating a chip carrier which includes at least one photo-via |