| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/20/2000 | EP0916238B1 Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive |
| 09/20/2000 | CN1267342A Method and device for regulating concentration of substaces in electrolytes |
| 09/20/2000 | CN1267341A Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| 09/20/2000 | CN1267317A Conductive epoxy resin compositions anisotropically conductive adhesive films and electrical connecting methods |
| 09/20/2000 | CN1267182A PC board capable of preventing short circuit during welding |
| 09/20/2000 | CN1267181A Method for regulating thermal expansion of plate-shaped electronic elements and its structural member |
| 09/20/2000 | CN1267180A Terminal structure to connect electronic component thereon |
| 09/20/2000 | CN1267086A Electronic package method |
| 09/19/2000 | US6122177 Semiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliability |
| 09/19/2000 | US6122157 Apparatus and method for surge protecting an electrical load connected to an AC power distribution system |
| 09/19/2000 | US6121988 Printed wiring board and its manufacturing method, and electronic apparatus |
| 09/19/2000 | US6121866 Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same |
| 09/19/2000 | US6121689 Semiconductor flip-chip package and method for the fabrication thereof |
| 09/19/2000 | US6121688 Anisotropic conductive sheet and printed circuit board |
| 09/19/2000 | US6121679 Structure for printed circuit design |
| 09/19/2000 | US6121678 Wrap-around interconnect for fine pitch ball grid array |
| 09/19/2000 | US6121576 Method and process of contact to a heat softened solder ball array |
| 09/19/2000 | US6121554 Printed wiring board |
| 09/19/2000 | US6121553 Circuit boards using heat resistant resin for adhesive layers |
| 09/19/2000 | US6121174 Dielectric material with low temperature coefficient and high quality |
| 09/19/2000 | US6121069 Connectors for integrated circuit chips with lead balls surrounded with barrier photoresists and tin coverings |
| 09/19/2000 | US6121062 Process of fabricating semiconductor unit employing bumps to bond two components |
| 09/19/2000 | US6120975 Methods for production of a plasma display panel |
| 09/19/2000 | US6120885 Electrically conducting spheres disposed in array on electronic chip carrier module, spheres being joined to terminal pads on module by means of electrically conducting adhesive comprising thermosetting, thermoplastic resin, solder |
| 09/19/2000 | US6120883 Computer printable top coating |
| 09/19/2000 | US6120839 Electro-osmotic displays and materials for making the same |
| 09/19/2000 | US6120708 Conductive paste and method for producing ceramic substrate using the same |
| 09/19/2000 | US6120693 Method of manufacturing an interlayer via and a laminate precursor useful for same |
| 09/19/2000 | US6120672 Applying electroless deposition catalyst to substrate surface, applying photoresist, exposure and development of pattern, plating desired metal layers in pattern, removing photoresist, overcoating with protective decorative lacquer |
| 09/19/2000 | US6120670 Method of fabricating a multi-layered printed wiring board |
| 09/19/2000 | US6120669 Bipolar electrochemical connection of materials |
| 09/19/2000 | US6120639 Method for the manufacture of printed circuit boards |
| 09/19/2000 | US6120588 Electronically addressable microencapsulated ink and display thereof |
| 09/19/2000 | US6120586 Stable mixtures of organometallic complexes dissolved or disbursed in organic solvent with additives for heightening the adhesion of the metal film formed after firing, for decorations, electronic elements |
| 09/19/2000 | US6120585 Reflow soldering device |
| 09/19/2000 | US6120179 Apparatus for measuring the temperature of a circuit board during a drilling operation |
| 09/19/2000 | US6119925 Method for soldering an electrical element to a motherboard |
| 09/19/2000 | US6119923 Packaging electrical circuits |
| 09/19/2000 | US6119919 Method and device for repairing defective soldered joints |
| 09/19/2000 | US6119706 Apparatus for cleaning electronic components |
| 09/19/2000 | US6119675 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/19/2000 | US6119592 Apparatus for screen printing having a belt screen and locking frame |
| 09/19/2000 | US6119555 Method of making a precision punch and die design and construction |
| 09/19/2000 | US6119366 Chemical drying and cleaning method |
| 09/19/2000 | US6119338 Method for manufacturing high-density multilayer printed circuit boards |
| 09/19/2000 | US6119337 Method of mounting conductive balls |
| 09/19/2000 | US6119335 Method for manufacturing multi-layer printed circuit board |
| 09/19/2000 | US6119334 Method and apparatus for connecting wiring boards and ink jet recording head and recording apparatus |
| 09/19/2000 | CA2057725C Photosensitive composition containing water as solvent or dispersant |
| 09/19/2000 | CA2010743C Printed circuit board capable of preventing electromagnetic interference |
| 09/14/2000 | WO2000054561A1 Method for improving the manufacturing safety of weld joints |
| 09/14/2000 | WO2000054560A1 A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method |
| 09/14/2000 | WO2000054382A1 A closed box for electronics equipment |
| 09/14/2000 | WO2000054373A1 Display device |
| 09/14/2000 | WO2000054337A1 Apparatus and method for an integrated circuit having high q reactive components |
| 09/14/2000 | WO2000054333A1 Display device |
| 09/14/2000 | WO2000054324A1 Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| 09/14/2000 | WO2000054323A1 Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| 09/14/2000 | WO2000054322A1 Flip chip with integrated flux and underfill |
| 09/14/2000 | WO2000054107A1 Step and flash imprint lithography |
| 09/14/2000 | WO2000054098A1 Liquid crystal display and its inspecting method |
| 09/14/2000 | WO2000054005A1 Improved registration of sheet materials using statistical targets and method |
| 09/14/2000 | WO2000053409A1 Laminated board |
| 09/14/2000 | WO2000053364A1 Device and method for laser-structuring workpieces |
| 09/14/2000 | DE19939740A1 Roller coating system for applying variable thickness layer of thermal and IR/UV radiation hardenable material on printed circuit boards of different widths, using pair of rollers arranged such that sticking of rollers is prevented |
| 09/14/2000 | DE19907949A1 Steuergerät für ein Kraftfahrzeug Control unit for a motor vehicle |
| 09/14/2000 | CA2362159A1 Apparatus and method for an integrated circuit having high q reactive components |
| 09/13/2000 | EP1035760A2 Interlaminar insulating adhesive for multilayer printed circuit board |
| 09/13/2000 | EP1035759A2 Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board |
| 09/13/2000 | EP1035758A1 Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board |
| 09/13/2000 | EP1035581A2 Multilayer wiring board |
| 09/13/2000 | EP1035580A2 Method and structure for integrated circuit package |
| 09/13/2000 | EP1035579A2 Fabrication method and strcuture of an integrated circuit package |
| 09/13/2000 | EP1035562A2 Apparatus for cleaning electronic components |
| 09/13/2000 | EP1035559A2 Electron source substrate and image-forming apparatus using the same |
| 09/13/2000 | EP1035444A2 Cover film for dry film resist |
| 09/13/2000 | EP1035440A1 Photosensitive resin and photosensitive resin composition |
| 09/13/2000 | EP1035156A1 Processes for the production of prepregs and laminated sheets |
| 09/13/2000 | EP1034983A2 Branch connection box |
| 09/13/2000 | EP1034510A1 Method for producing a supporting element for an integrated circuit module for placement in chip cards |
| 09/13/2000 | EP1034438A2 Method and apparatus for distinguishing regions where a material is present on a surface |
| 09/13/2000 | EP1034193A1 Phenol-novolacs with improved optical properties |
| 09/13/2000 | EP1034091A1 Interior trim panel and electrical harness apparatus for an automotive vehicle |
| 09/13/2000 | EP1034061A1 Method and device for assembling two structures with a weld bead |
| 09/13/2000 | EP0820359B1 Method and apparatus for circuit board treatment |
| 09/13/2000 | EP0813521B1 Energy-activatable salts with fluorocarbon anions |
| 09/13/2000 | CN1266607A Method of manufacturing surface-mountable SIL hybrid circuit |
| 09/13/2000 | CN1266463A Method and apparatus for treating metal surfaces by dry process |
| 09/13/2000 | CN1266200A Display device |
| 09/13/2000 | CN1056492C Thermoformed three dimensional wiring module |
| 09/13/2000 | CN1056490C Method of manufacturing organic substrate used for printed circuits and organic substrate manufactured thereby |
| 09/13/2000 | CN1056399C Electrically conductive adhesive compositions |
| 09/12/2000 | US6118666 Flexible printed wiring board and connecting structure thereof |
| 09/12/2000 | US6118665 Flexible printed circuit and connected printed circuit structure |
| 09/12/2000 | US6118426 Transducers and indicators having printed displays |
| 09/12/2000 | US6118347 Voltage controlled oscillator mounting assembly |
| 09/12/2000 | US6118291 Test socket and methods |
| 09/12/2000 | US6118288 Adaptive PCB testing system employing rearrangable test probes |
| 09/12/2000 | US6118182 Integrated circuit package with rectangular contact pads |
| 09/12/2000 | US6118179 Semiconductor component with external contact polymer support member and method of fabrication |