| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/27/2000 | EP1039791A1 Electronic casing |
| 09/27/2000 | EP1039790A2 Electrical connector housing |
| 09/27/2000 | EP1039789A1 Method of manufacturing multilayer printed wiring board |
| 09/27/2000 | EP1039788A2 Flexible printed wiring board, electro-optical device, and electronic equipment |
| 09/27/2000 | EP1039581A2 Circuit board assembly |
| 09/27/2000 | EP1039543A2 Circuit chip connector and method of connecting a circuit chip |
| 09/27/2000 | EP1039539A2 Ceramic circuit board |
| 09/27/2000 | EP1039537A2 Heat conductive resin substrate and semiconductor package |
| 09/27/2000 | EP1039527A2 Semiconductor device mounting structure |
| 09/27/2000 | EP1039331A2 Display device and electronic apparatus |
| 09/27/2000 | EP1038628A1 Unleaded solder powder and production method therefor |
| 09/27/2000 | EP1038421A1 Ground clip apparatus for circuit boards |
| 09/27/2000 | EP1038420A1 Method for making circuit elements for a z-axis interconnect |
| 09/27/2000 | EP1038419A1 Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |
| 09/27/2000 | EP1038418A1 Manufacturing method of wiring circuit board, and wiring circuit board |
| 09/27/2000 | EP1038417A1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 09/27/2000 | EP1037836A1 A machine for treating sheet-shaped goods with various media, and goods carrier for use in such a machine |
| 09/27/2000 | EP0711102B1 Method for forming a conductive circuit on the surface of a molded product |
| 09/27/2000 | EP0658300B1 Structured printed circuit boards and films and process for producing them |
| 09/27/2000 | EP0656025B2 Solution for coating non conductors with conductive polymers and their metallization process |
| 09/27/2000 | CN1268282A Flexible circuits and carriers and process for manufacture |
| 09/27/2000 | CN1268245A A system and method for packaging integrated circuits |
| 09/27/2000 | CN1267910A Ball grid array package capable of relieving stress |
| 09/27/2000 | CN1267891A Conducting and resistance material with electrical stability using for electronic equipment |
| 09/27/2000 | CN1267696A Interlamellar insulation adhesive using for multilayer printed circuit board |
| 09/27/2000 | CN1267688A Ultraviolet curing resin composition therewith and photoprotection welding ink |
| 09/27/2000 | CN1267596A Copper surface treatment for preventing microcrack in soft circuit |
| 09/26/2000 | US6125425 Memory controller performing a mid transaction refresh and handling a suspend signal |
| 09/26/2000 | US6125043 Circuit board arrangement with accurately positioned components mounted thereon |
| 09/26/2000 | US6125042 Ball grid array semiconductor package having improved EMI characteristics |
| 09/26/2000 | US6125039 Hybrid module |
| 09/26/2000 | US6125026 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components |
| 09/26/2000 | US6125015 Head gimbal assembly with low stiffness flex circuit and ESD Protection |
| 09/26/2000 | US6124778 Magnetic component assembly |
| 09/26/2000 | US6124772 Control unit |
| 09/26/2000 | US6124721 Method of engaging electrically conductive test pads on a semiconductor substrate |
| 09/26/2000 | US6124633 Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 09/26/2000 | US6124631 Micro sensor and method for making same |
| 09/26/2000 | US6124629 Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip |
| 09/26/2000 | US6124553 Multilayer wiring board having vent holes and method of making |
| 09/26/2000 | US6124454 β-form tris-(2, 3-epoxypropyl)-isocyanurate crystals and process for their production |
| 09/26/2000 | US6124425 Thermally reactive near infrared absorption polymer coatings, method of preparing and methods of use |
| 09/26/2000 | US6124408 The composite comprises a photosensitive resin and thermoplastic resin forming a quasi-homogeneous compatible structure, wherein photosensitive resin comprsies atleast one of acrylated resin; improved heat resistance/photosensitivity |
| 09/26/2000 | US6124405 Polymers for photoresist compositions |
| 09/26/2000 | US6124151 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 09/26/2000 | US6124056 Battery holder |
| 09/26/2000 | US6124041 Multilayer ceramic package comprising ceramic substrate and a copper based sintering paste for forming conductive vias or surface patterns, comprising copper powder, and powdered copper aluminate as copper sources, and organic materials |
| 09/26/2000 | US6124023 Prepreg for laminate and process for producing printed wiring-board using the same |
| 09/26/2000 | US6123995 Applying to liquid conductive polymer composition but prior to drying thereof, an organic polyol coating comprising an organic solvent at room temperature and having one or more hydroxy or other groups |
| 09/26/2000 | US6123984 Method and apparatus for plating a substrate |
| 09/26/2000 | US6123874 First glass powder, a second glass powder, a conductive material powder, and an organic vehicle. |
| 09/26/2000 | US6123815 Plating apparatus |
| 09/26/2000 | US6123799 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| 09/26/2000 | US6123588 Circuit trace termination and method |
| 09/26/2000 | US6123551 Electronic circuit interconnection method and apparatus |
| 09/26/2000 | US6123251 Apparatus and method for soldering |
| 09/26/2000 | US6123248 Soldering method and soldering apparatus |
| 09/26/2000 | US6123247 Electronic unit soldering apparatus |
| 09/26/2000 | US6123088 Cleaning the conductor layer with a mixture comprising a hydroxyl amine material, an ammonium fluoride material and a benzotriazole material |
| 09/26/2000 | US6123024 Stencil incorporating electronic tag |
| 09/26/2000 | US6122815 Circuit board stiffener and method of attachment to a circuit board |
| 09/26/2000 | CA2111337C A composition and a process for removing rosin solder flux with terpene and hydrocarbons |
| 09/21/2000 | WO2000056130A1 A method and an arrangement for the electrical contact of components |
| 09/21/2000 | WO2000056129A1 Method for introducing plated-through holes in an electrically insulating base material that is provided with metal layers on both sides |
| 09/21/2000 | WO2000056128A1 Method of manufacturing resistors |
| 09/21/2000 | WO2000055946A1 System for providing a removable high density electrical interconnect for flexible circuits |
| 09/21/2000 | WO2000055925A1 Opto-electronic element |
| 09/21/2000 | WO2000055917A1 Power semiconductor module |
| 09/21/2000 | WO2000055913A1 Multi-layer substrates and fabrication processes |
| 09/21/2000 | WO2000055909A1 Extreme density packaging for electronic assemblies |
| 09/21/2000 | WO2000055908A1 Laminate for multi-layer printed circuit |
| 09/21/2000 | WO2000055907A2 Compensation model and registration simulator apparatus and method for manufacturing of printed circuit boards |
| 09/21/2000 | WO2000055875A1 Low inductance four terminal capacitor lead frame |
| 09/21/2000 | WO2000055870A1 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 09/21/2000 | WO2000055868A1 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 09/21/2000 | WO2000054969A1 Flexible laminate for flexible circuit |
| 09/21/2000 | WO2000054921A1 Filling device and method for filling balls in the apertures of a ball-receiving element |
| 09/21/2000 | WO2000022814A9 Image sensor mounted by mass reflow |
| 09/21/2000 | WO2000022667A9 Apparatus and method for filling a ball grid array |
| 09/21/2000 | WO2000021101A9 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 09/21/2000 | DE19910768A1 Chip card with recess to fit exchangeable chip module and antenna formed around recess |
| 09/21/2000 | DE19910407A1 Test plate for testing equipment and materials used for manufacturing printed circuit boards |
| 09/21/2000 | DE19910173A1 Waste solder material removal method for circuit boards |
| 09/21/2000 | DE19909505A1 Verfahren zur Herstellung von Schaltungsanordnungen A process for producing circuit arrangements |
| 09/21/2000 | DE19855578C1 Stanzeinrichtung mit wechselbaren Stempeln Punching device with interchangeable dies |
| 09/21/2000 | DE10012510A1 Connector e.g. for surface mounting of circuit device, has conductor connection from connector body which is fastened at flexible element and electrically connected at flexible element |
| 09/21/2000 | CA2368057A1 A method and an arrangement for the electrical contact of components |
| 09/21/2000 | CA2368013A1 Compensation model and registration simulator apparatus and method for manufacturing of printed circuit boards |
| 09/21/2000 | CA2367384A1 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 09/21/2000 | CA2360323A1 Laminate for multi-layer printed circuit |
| 09/21/2000 | CA2332789A1 Flexible laminate for flexible circuit |
| 09/20/2000 | EP1037513A2 Micro-etch solution for producing metal surface topography |
| 09/20/2000 | EP1037511A2 Surface treatment of copper to prevent microcracking in flexible circuits |
| 09/20/2000 | EP1037312A1 Circuit connection structure for a junction block |
| 09/20/2000 | EP1037300A1 Radio frequency transformer and its use |
| 09/20/2000 | EP1037111A1 Ultraviolet curable resin composition and photo solder resist ink using the same |
| 09/20/2000 | EP1036490A1 Surface mount power supply device |
| 09/20/2000 | EP1036489A1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
| 09/20/2000 | EP1036023A1 A device for holding and carrying objects |
| 09/20/2000 | EP1035940A1 Method and apparatus for dispensing materials on a substrate |