Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2000
10/10/2000US6129998 Copper/steel laminated sheet for use in manufacturing printed circuit boards
10/10/2000US6129990 A carbon steel substrate layer, having a coefficient of thermal expansion less than 9.8 mu.inches/degree f. and a knoop hardness between 150-850 and a copper foil layer releasably bonded to the substrate surface
10/10/2000US6129955 Applying a coating of epxoy resin, photoinitiator, and dispersed silica over the solder joint, photocuring the epoxy resin to reinforce the solder joint
10/10/2000US6129948 Using a supersonic velocity spray of graphite particles to physically embed graphite particles into the surface of a non-conductive substrate such as polymer or ceramic, thereby rendering it electroconductive; dry process; can be localized
10/10/2000US6129858 Electrolytically reclaimable; circuit boards and mold parts of copper and copper alloys; comprising copper tetrammine sulfate, ammonia, ammonium sulfate, ammonium chloride or ammonium nitrate, and a catalyst of vanadium (v2o5); kinetics
10/10/2000US6129830 In short time, using deposition bath containing copper ions, compounds that increase electroconductivity of the bath, additives to influence material properties of the copper, and compounds of an electrochemically reversible redox system
10/10/2000US6129559 Microconnector and method of manufacturing the same
10/10/2000US6129459 Apparatus for analyzing radiating electromagnetic wave from multilayer substrate
10/10/2000US6129040 Semi-conductor mounting apparatus for applying adhesive to a substrate
10/10/2000US6129014 Apparatus and method for screen printing of paste
10/10/2000US6128818 Method for testing integrated circuits which are on printed circuit boards
10/10/2000CA2143293C Electronic component
10/10/2000CA2138218C Process for delaminating organic resin from board and process for manufacturing organic resin multi-layer wiring board
10/10/2000CA2137823C Method of making a printed circuit board
10/05/2000WO2000059278A1 Multi-layer laminate and method of producing same
10/05/2000WO2000059277A1 Method of producing printed wiring boards
10/05/2000WO2000059276A1 A via connector and method of making same
10/05/2000WO2000059275A1 Method and system for processing metal-clad laminate for printed-circuit board
10/05/2000WO2000059274A1 Method for manufacturing three-dimensional printed wiring board
10/05/2000WO2000059263A1 Apparatus having an electroacoustic transducer mounted on a p.c. board with the aid of a holding means
10/05/2000WO2000059083A1 Fourth harmonic generation apparatus
10/05/2000WO2000059033A1 Wiring board, connection board, semiconductor device, method of manufacture thereof, circuit board, and electronic device
10/05/2000WO2000059028A1 Method and apparatus for forming solder bumps
10/05/2000WO2000059000A2 Method for making segmented through holes in printed circuit boards
10/05/2000WO2000058872A1 Field programmable ball array
10/05/2000WO2000058205A1 Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus
10/05/2000WO2000058187A1 Machine for treatment of plate-shaped objects
10/05/2000WO2000009327A9 Resin/copper/metal laminate and method of producing same
10/05/2000WO2000004446A9 Prototype development system
10/05/2000DE19932597C1 Flat element, useful as price or barcode label or as chip card comprises barcode- or antenna-structured metal layer with black oxide-coated cauliflower structure surface bonded to base layer
10/05/2000DE19925819A1 Printed circuit board coating device has grabbers that take hold of the PCB at the edge
10/05/2000DE19915245A1 Electronic component with strip conductor, e.g. coil or coupler for high frequency application and high speed digital circuits, is produced by conductive layer deposition on metal base layer regions exposed by structured photolacquer layer
10/05/2000DE19914418A1 Printed circuit board, particularly flexible printed circuit board
10/05/2000DE19910500A1 Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board
10/05/2000DE19908434A1 Verfahren und Reinigungsflüssigkeit zum Flüssigreinigen von Gegenständen Procedures and cleaning liquid for liquid cleaning of objects
10/05/2000DE10013255A1 Electronic component, e.g. an automobile electronic ignition module, comprises a filled resin housing encapsulating a hybrid integrated circuit substrate and a tin-antimony soldered power semiconductor on a heat sink
10/05/2000DE10013189A1 Substrate for a power semiconductor module in an electric vehicle has a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink
10/05/2000CA2360325A1 Multi-layer laminate and method of producing same
10/04/2000EP1041868A2 Insulating resin composition for multilayer printed-wiring board
10/04/2000EP1041867A2 Printed circuit board and manufacturing method of the printed circuit board
10/04/2000EP1041866A2 Device to produce electronic circuits
10/04/2000EP1041865A2 Device to produce multi-layer electronic circuits
10/04/2000EP1041864A2 Supporting plate for flexible base supports for electronic circuits
10/04/2000EP1041631A2 Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor
10/04/2000EP1041617A1 Semiconductor device and method of production thereof and semiconductor mounting structure and method
10/04/2000EP1041616A1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
10/04/2000EP1041586A2 Chip thermistor
10/04/2000EP1040892A1 Blasting medium and blasting method
10/04/2000EP1040520A1 Demountable, compliant area array interconnect
10/04/2000EP1025587A4 Semiconductor flip-chip package and method for the fabrication thereof
10/04/2000EP0654174B1 Sealed conductive active alloy feedthroughs
10/04/2000CN2399841Y 导电端子 Conductive terminals
10/04/2000CN1269120A Method for heating printed circuit board, and printed circuit board comprising a heating element
10/04/2000CN1268862A Circuit plate and soldering method therefor
10/04/2000CN1268769A Substrate element and soft substrate
10/04/2000CN1268675A Flexible printing wiring substrate, electrooptics arrangement, and electronic device
10/04/2000CN1268429A Metallic tension laminated plate used for electric circuit basic plate and its mfg. method
10/03/2000US6128385 Impact-tolerant mounting of acoustic components
10/03/2000US6128201 Three dimensional mounting assembly for integrated circuits
10/03/2000US6128199 Composite device and manufacturing method thereof
10/03/2000US6128195 Transfer molded PCMCIA standard cards
10/03/2000US6128190 Electronic assembly
10/03/2000US6128063 Liquid crystal display apparatus having multi-layer substrate
10/03/2000US6127736 Microbump interconnect for semiconductor dice
10/03/2000US6127735 Interconnect for low temperature chip attachment
10/03/2000US6127731 Capped solder bumps which form an interconnection with a tailored reflow melting point
10/03/2000US6127634 Wiring board with an insulating layer to prevent gap formation during etching
10/03/2000US6127633 Multilayer print circuit board having a blind hole in an insulation layer with a roughened surface formed by application of an oxidizing agent and method of production
10/03/2000US6127253 Lead-free interconnection for electronic devices
10/03/2000US6127204 Column grid array or ball grid array pad on via
10/03/2000US6127195 Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus
10/03/2000US6127097 Photoresist develop and strip solvent compositions and method for their use
10/03/2000US6127091 Photopolymerizable composition and photopolymerizable recording material prepared using this composition
10/03/2000US6127069 Method of visually inspecting positioning of a pattern on a substrate
10/03/2000US6127052 Substrate and method for producing it
10/03/2000US6127051 For use in a press lay-up between printed circuit board panels having a metal substrate layer and a copper foil layer disposed on at least one surface of the substrate layer
10/03/2000US6127038 Printed circuit board coating and method
10/03/2000US6127025 Circuit board with wiring sealing filled holes
10/03/2000US6126865 Polyacrylic ester; hook and loop fasteners
10/03/2000US6126761 Process of controlling grain growth in metal films
10/03/2000US6126456 Solder column tip compliancy modification for use in a BGA socket connector
10/03/2000US6126455 Lidless socket and method of making same
10/03/2000US6126454 Contact device between a liquid crystal display and a printed circuit
10/03/2000US6126063 Integrated circuit packaging apparatus and method
10/03/2000US6126060 Soldering device
10/03/2000US6126059 Captured-cell solder printing and reflow methods and apparatuses
10/03/2000US6125531 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
10/03/2000CA2170719C Screen printing method and apparatus therefor
09/2000
09/28/2000WO2000057680A1 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
09/28/2000WO2000057469A1 Structure for mounting semiconductor device and mounting method
09/28/2000WO2000057468A2 Electric circuit and its method of production
09/28/2000WO2000056798A1 Urethane oligomer, resin compositions thereof, and cured article thereof
09/28/2000WO2000056791A1 Thermally reactive near infrared absorption polymer coatings, method of preparing and methods of use
09/28/2000WO2000048437A8 Discrete component in-mold mounting
09/28/2000DE19914032A1 Method for producing and depositing punched antenna coil with several turns on chip card by depositing one or more coils after splitting on chip card in certain spatial mode
09/28/2000DE19910318A1 Transparent sheet, especially an automobile pane with a wideband r.f. aerial and-or a heater, has a surface conductor structure connected to a circuit substrate by an electrically conductive adhesive
09/28/2000DE19910078A1 Verfahren zur Erhöung der Fertigungssicherheit von Lötverbindungen Process for the production reliability of solder joints Erhöung
09/28/2000DE19860716C1 Conductive adhesive connection arrangement for electronic components on circuit board
09/28/2000DE10014111A1 Methods for X-ray test of mounting or connection status of ball grid arrays and chip scale packages by irradiating sample with x-rays from x-ray source that rotates together with X-ray detector about same line
09/28/2000CA2365144A1 Urethane oligomer, resin compositions thereof, and cured article thereof
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