Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2000
10/17/2000US6134075 Magnetic head suspension with single layer preshaped trace interconnect
10/17/2000US6133808 Dielectric filter having input/output electrodes connected to electrodes on a substrate, and dielectric duplexer incorporating the dielectric filter
10/17/2000US6133805 Isolation in multi-layer structures
10/17/2000US6133657 Vibrator bracket
10/17/2000US6133639 Compliant interface for semiconductor chip and method therefor
10/17/2000US6133633 Method for building interconnect structures by injection molded solder and structures built
10/17/2000US6133535 Electronic component having calcined electrode
10/17/2000US6133534 Wiring board for electrical tests with bumps having polymeric coating
10/17/2000US6133377 Compostion of epoxy resin, phenol-triazine-aldehyde condensate and rubber
10/17/2000US6133213 Water-free solution for cleaning printed circuits
10/17/2000US6133135 Process for manufacturing electronic circuits
10/17/2000US6133134 Ball grid array integrated circuit package
10/17/2000US6133052 Bump inspection method
10/17/2000US6132930 Negative photoresist composition
10/17/2000US6132887 Heat treatment
10/17/2000US6132853 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
10/17/2000US6132852 Multilayer wiring substrate and method for production thereof
10/17/2000US6132851 Phenolic resole resin and epoxy resin
10/17/2000US6132850 Reworkable, thermally-conductive adhesives for electronic assemblies
10/17/2000US6132809 Conformal coating using multiple applications
10/17/2000US6132657 Process for producing polymeric materials
10/17/2000US6132646 Electroconductive ink and curing adhesive with flux and metals
10/17/2000US6132589 To improve its adhesion to non-dicy prepregs by applying layer of zinc metal and layer of hexavalent chromium oxide
10/17/2000US6132588 Process for forming a deposit layer on an isolated conductor circuit pattern of wiring circuit boards employed in the field of electronic material
10/17/2000US6132583 Shielding method and apparatus for use in electroplating process
10/17/2000US6132543 Method of manufacturing a packaging substrate
10/17/2000US6132510 Nozzle apparatus for extruding conductive paste
10/17/2000US6132265 Battery connector
10/17/2000US6132226 Structure and method for mounting an electronic part
10/17/2000US6132225 Press-in pin with an elastic press-in region
10/17/2000US6132222 BGA socket terminal
10/17/2000US6132221 Multi-pin connector
10/17/2000US6131895 Holding device for holding a printed circuit panel
10/17/2000US6131793 Reflow soldering apparatus
10/17/2000US6131511 Screen printing method and screen printing apparatus
10/17/2000US6131510 Silk-screen scraping blades for inhibiting overflow of printing ink
10/17/2000US6131279 Integrated manufacturing packaging process
10/17/2000US6131277 Method for accurately aligning and attaching an electrical part to a surface mount circuit
10/17/2000CA2161690C Improvements relating to component mounting arrangements
10/17/2000CA2126271C A process for forming a photosensitive material and an exposure apparatus used for the process
10/17/2000CA2073566C High density and multiple insertion connector
10/12/2000WO2000060913A1 Device for heating printed-circuit board
10/12/2000WO2000060912A1 Method and noise suppressor unit for installing a common mode choke for noise suppressor in a power source module onto a circuit
10/12/2000WO2000060911A1 Method for drilling circuit boards
10/12/2000WO2000060696A1 Electrical connecting element
10/12/2000WO2000060662A1 Method of producing a device for electrically connecting a semiconductor component to a mounting surface, and corresponding device
10/12/2000WO2000060622A1 Thick-film on metal encoder element
10/12/2000WO2000060614A1 Anisotropically conductive paste
10/12/2000WO2000060613A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate
10/12/2000WO2000059717A1 Process for direct digital printing of circuit boards
10/12/2000WO2000059645A1 Methods to produce robust multilayer circuitry for electronic packaging
10/12/2000WO2000028385A3 Method and device for aligning two photo masks with each other and optionally, an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards
10/12/2000WO2000008675A3 Adapter for surface mounted devices
10/12/2000WO1999067321A3 Method for depositing a metallic layer on a polymer surface of a workpiece
10/12/2000DE19850592C1 Haftvermittlerschicht zur Erzeugung haftfester Leiterstrukturen auf Isoliermaterialien der Elektronik Adhesive layer to produce adherent conductor structures on insulating the electronics
10/12/2000DE10016064A1 Combined substrate for production of single substrate has oblong single substrate formed with bore with first and second single substrates being adjacent and having common front part area of wide part
10/12/2000CA2367870A1 Process for direct digital printing of circuit boards
10/11/2000EP1043922A1 Multilayer printed wiring board
10/11/2000EP1043921A1 Multilayer printed wiring board and method for manufacturing the same
10/11/2000EP1043920A2 Surface mountable power supply module and method of manufacture therefor
10/11/2000EP1043766A1 Bump forming method, soldering preprocessing method, soldering method, soldering preprocessing apparatus and soldering apparatus
10/11/2000EP1043112A1 Lead-free solder
10/11/2000EP1043110A2 Method for machining ceramic green sheet and apparatus for machining the same
10/11/2000EP1042947A1 A method of shielding a printed board assembly with at least one component and a shielding element for shielding components on such a printed board assembly
10/11/2000EP1042946A2 Hybrid circuit with a heat dissipation system
10/11/2000EP1042945A1 Molded electronic package, method of preparation and method of shielding
10/11/2000EP1042803A1 Method of manufacturing a multi-layered ceramic substrate
10/11/2000EP1042792A1 Method and device for removing a cut-out from a layer of material
10/11/2000EP1042540A1 Programmed pulse electroplating process
10/11/2000EP1042539A1 Printed circuit manufacturing process using tin-nickel plating
10/11/2000EP1042534A1 Metal surface coating, especially for micro electronics
10/11/2000EP1042101A1 Method for making soldering flux and resulting weld joint
10/11/2000EP1042092A1 Component of printed circuit boards
10/11/2000EP1042079A1 Improved miniature surface mount capacitor and method of making same
10/11/2000EP0920792B1 Method and apparatus for orienting miniature components
10/11/2000EP0840994B1 Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards
10/11/2000EP0598914B1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
10/11/2000EP0464224B1 Method of and material for forming thick filmy pattern
10/11/2000CN1269698A Fitting structure of chip element and fitting method thereof
10/11/2000CN1269697A Installing method of high-density coaxial junction on printed circuit board
10/11/2000CN1269695A Printed circuit board and producing method thereof
10/11/2000CN1269694A Line width compensating value determining method by means of line resistance measurement
10/11/2000CN1269693A Insualtion resin composition for multi-layer printed circuit board
10/11/2000CN1269637A Master slice, substrate element and producing method therefor
10/11/2000CN1269636A Master slice and substrate element and producing method therefor
10/11/2000CN1269538A Low-CTE power source and stratum
10/11/2000CN1269521A Displaying device and electronic device
10/11/2000CN1269519A Liquid crystal displaying apparatus, flat type displaying apparatus and electronic device fitted with said flat-type displaying device
10/11/2000CN1269276A Method and apparatus for processing ceramic inner piece
10/11/2000CN1057350C Process for corrosion protection of copper and copper alloys
10/11/2000CN1057331C Cleaning compositions
10/11/2000CN1057318C High-temp. resistant adhesive agent for flexible pritned circuit and preparation method thereof
10/10/2000US6130601 Thick-film resistor having concentric terminals and method therefor
10/10/2000US6130547 Test apparatus for printed circuit board and assembly kit therefor
10/10/2000US6130479 Minimizing the formation of intermetallic compounds in solder joints used in making electrical interconnections in electronic packaging of semiconductor devices
10/10/2000US6130171 Residue removal process for forming inter-level insulating layer of paraylene polymer without peeling
10/10/2000US6130141 Flip chip metallization
10/10/2000US6130114 Semiconductor device
10/10/2000US6130015 Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit
10/10/2000US6130000 Copper and steel components for use in manufacturing printed circuit boards
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