Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2000
10/31/2000US6138348 Method of forming electrically conductive polymer interconnects on electrical substrates
10/31/2000CA2135157C Process for producing plastic laminates with metal laminae, especially for printing circuits
10/31/2000CA2076549C Direct bonding of copper to aluminum nitride substrates
10/27/2000CA2305977A1 Connection method and structure to printed circuit board
10/26/2000WO2000064229A1 Contact module, as for a smart card, and method for making same
10/26/2000WO2000064227A1 Method of manufacturing method of ceramic multilayer board
10/26/2000WO2000064226A1 Ceramic circuit board and method of manufacture thereof
10/26/2000WO2000063970A1 Module component and method of manufacturing the same
10/26/2000WO2000063969A1 Electrical conductor system of a semiconductor device and manufacturing method thereof
10/26/2000WO2000063928A1 Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
10/26/2000WO2000062988A1 Sheet retainer for punching ceramic green sheet and punching device
10/26/2000WO2000062941A1 Electrically operated liquid dispensing apparatus and method for dispensing viscous liquid
10/26/2000DE4445129C2 Elektrisches Gerät für Kraftfahrzeuge Electrical equipment for motor vehicles
10/26/2000DE19918833A1 Non-conductive substrate surfaces, especially polymer resist layer and copper surface regions of circuit boards, are electroplated after precious metal nucleation and contact with an electroless reduction copper bath
10/26/2000DE19918746A1 Lötbrücke Solder bridge
10/26/2000DE19917580A1 Coil component, has second mass point mounted on component side opposite to electrical contact connections so that simple positioning of component results on circuit substrate
10/26/2000DE19916180A1 Insulated conductor intersection formation in thermoplastic supports, by pressing lower strips into support before applying upper strips
10/26/2000DE19905869C1 Bindemittel enthaltende Masse für die Beschichtung von Leiterplatten , Verwendung als Leiterplatten und Verfahren zur Herstellung Containing binder composition for the coating of printed circuit boards, use as printed circuit boards and processes for preparing
10/26/2000DE19900437A1 Surface coating and/or implantation of solid objects or human or animal tissue is carried out using one or more laser beams coaxial with ion beam from electron cyclotron resonance ion source
10/26/2000DE10013986A1 Electro optic probe for electro-optic sampling oscilloscope, has voltage applied at metal pin to change polarization of pulsed light
10/25/2000EP1047291A1 Solder bridge
10/25/2000EP1047290A2 Printing wiring board
10/25/2000EP1047121A1 Cleaning solution for substrates of electronic devices
10/25/2000EP1046198A2 Electric connector
10/25/2000EP1046093A2 An improved power contact for testing a power delivery system
10/25/2000EP0979208A4 Composition and method for reducing copper oxide to metallic copper
10/25/2000EP0920789B1 Method for manufacturing a device for dissipating thermal energy produced by electronic components embedded in a printed circuit card, and resulting device
10/25/2000EP0820351B1 Fluid delivery apparatus and method
10/25/2000CN1271509A Method for mounting semiconductor element to circuit board, and semiconductor device
10/25/2000CN1271466A Housing for piezoelectric transformer device
10/25/2000CN1271248A Printed circuit board
10/25/2000CN1271000A Base board cleaning liquid of electronic material
10/25/2000CN1057871C Method and apparatus for forming contacts
10/25/2000CN1057803C Device for electrolytic treatment of board-shaped objects
10/25/2000CN1057800C Copper etchant solution additives
10/25/2000CN1057731C Ablative imaging on work piece by using high power source
10/24/2000US6137693 High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
10/24/2000US6137690 Electronic assembly
10/24/2000US6137687 Printed circuit board, IC card, and manufacturing method thereof
10/24/2000US6137224 Electronic device encapsulated directly on a substrate
10/24/2000US6137164 Thin stacked integrated circuit device
10/24/2000US6137064 Split via surface mount connector and related techniques
10/24/2000US6137063 Electrical interconnections
10/24/2000US6137062 Ball grid array with recessed solder balls
10/24/2000US6137061 Reduction of parasitic through hole via capacitance in multilayer printed circuit boards
10/24/2000US6137054 Wire-circuit sheet and electric junction box thereof
10/24/2000US6136513 Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
10/24/2000US6136512 Method of forming resistors
10/24/2000US6136509 Method of exposing thermoresist
10/24/2000US6136507 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards
10/24/2000US6136506 Epoxy resin obtained by extending chains of epoxy compound by an isocyanate compound having two isocyanate groups per molecule, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group, initiator
10/24/2000US6136419 Ceramic substrate having a sealed layer
10/24/2000US6136142 Film applying apparatus
10/24/2000US6136127 Electrically conductive adhesive transfers
10/24/2000US6136047 Having solder deposits on the surface non-wettable to molten solder, both diameter and spacing of which are smaller than diameter and spacing of the terminal pads on a semiconductor substrate
10/24/2000US6135793 Coupler for grounding of a modular transceiver housing
10/24/2000US6135792 Electrical card connector
10/24/2000US6135791 Method for achieving uniform expansion of dielectric plate
10/24/2000US6135344 Reflow soldering method and a reflow soldering furnace
10/24/2000US6135024 Screen printing method and printing apparatus
10/24/2000US6134772 Via fill compositions for direct attach of devices and methods of applying same
10/23/2000CA2305954A1 Package for high-frequency device
10/19/2000WO2000062588A1 Multilayer printed wiring board
10/19/2000WO2000062587A1 Dispensing assembly
10/19/2000WO2000062586A1 Ultraviolet curable silver composition and related method
10/19/2000WO2000062585A1 Circuit board with arrangement for cooling power components
10/19/2000WO2000062582A1 Composite substrate, thin film el element using it, and method of producing the same
10/19/2000WO2000062417A1 Predistortion generator coupled with an rf amplifier
10/19/2000WO2000062337A1 Metal core substrate printed wiring board enabling thermally enhanced ball grid array (bga) packages and method
10/19/2000WO2000062300A1 Disposable sound recording and reproduction device
10/19/2000WO2000061658A1 Polyimide resin, resin composition with improved moisture resistance comprising the same, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these
10/19/2000WO2000061489A1 Method and apparatus for dispensing viscous material
10/19/2000WO2000061297A1 Dispensing assembly
10/19/2000WO2000035259A3 Method for producing printed conductor structures
10/19/2000WO2000026942A9 Method for producing filled vias in electronic components
10/19/2000DE19916784A1 Drying chamber or tunnel, e.g. for drying rinsed parts after cleaning, electroplating or other surface treatment, employs a directional stream of extremely dry air blown over parts to be dried
10/19/2000DE19916382A1 Adjustment method for high-frequency resonant printed circuit, involves correction of conductor layer by part removal using rotary mechanical cutter applied perpendicularly to remove material around periphery of hole in substrate
10/19/2000DE19912771A1 Elastic acoustic decoupler for electro-acoustic system contacting it at edge region, typically for loudspeaker
10/19/2000DE19912236A1 Electronic component connection to printed circuit board via contact base has fastening element allowing indirect connection of component to cover
10/19/2000CA2369495A1 Predistortion generator coupled with an rf amplifier
10/18/2000EP1045627A2 Method for making conductor tracks with a laser on plastics materials
10/18/2000EP1045626A1 Method for high resolution trimming of PCB components
10/18/2000EP1045437A2 Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
10/18/2000EP1044800A1 Metal laminate for a circuit board
10/18/2000EP1044082A1 Method for fixing miniaturised components onto a base plate by soldering
10/18/2000EP0904675B1 Screen printing method and screen printing apparatus
10/18/2000CN2402097Y Soft electric circuit board with support frame
10/18/2000CN1270755A Radio-electronic element
10/18/2000CN1270614A Dual curing silicone compositions
10/18/2000CN1270495A Surface installation structure and electronic elements included inside
10/18/2000CN1270494A Method for forming conductive pattern and manufacturing multi-layer ceramic substrates
10/18/2000CN1270493A Screen board for supplying soldering agent onto electric circuit board
10/18/2000CN1270445A Manufacture of high frequency assembly
10/18/2000CN1057659C Multilayered metallic printed board and molded module
10/18/2000CN1057638C Method and apparatus for removing an electronic component from a board
10/17/2000US6134121 Housing assembly utilizing a heat shrinkable composite laminate
10/17/2000US6134118 Conductive epoxy flip-chip package and method
10/17/2000US6134117 Method for high resolution trimming of PCB components
10/17/2000US6134111 Vertical surface mount apparatus with thermal carrier
10/17/2000US6134093 Category 5/25-pair protector
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