Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2000
11/07/2000US6143991 Bump electrode with adjacent pad and insulation for solder flow stopping
11/07/2000US6143990 Printed wiring board with two ground planes connected by resistor
11/07/2000US6143989 Active alignment/contact verification system
11/07/2000US6143640 Method of fabricating a stacked via in copper/polyimide beol
11/07/2000US6143639 Methods of forming electrically conductive interconnections and electrically interconnected substrates
11/07/2000US6143451 Improved processes which operate effectively at high speeds and which afford high image densities and good durability of images present on receiver elements upon thermal imaging
11/07/2000US6143432 Ceramic composites with improved interfacial properties and methods to make such composites
11/07/2000US6143421 Electronic components incorporating ceramic-metal composites
11/07/2000US6143401 Electronic chip package
11/07/2000US6143382 Glass substrate having fine holes
11/07/2000US6143374 Method for precise placement of an array of single particles on a surface
11/07/2000US6143356 Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards
11/07/2000US6143355 Print alignment method for multiple print thick film circuits
11/07/2000US6143139 Method for recovering metals from waste
11/07/2000US6143128 Apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof
11/07/2000US6143121 Hybrid module and method of manufacturing the same
11/07/2000US6143117 Process for transferring a thin-film structure to a temporary carrier
11/07/2000US6143116 Process for producing a multi-layer wiring board
11/07/2000US6143063 Misted precursor deposition apparatus and method with improved mist and mist flow
11/07/2000US6143059 Bath comprises nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer, traces of lead as a stabilizer, and includes a citrate used as a complexing agent associated with a gluconate used as catalyst and stabilizer
11/07/2000US6142811 Electrical connector
11/07/2000US6142794 Low cost pin retention socket
11/07/2000US6142791 Construction for mounting electronic component on flexible substrate
11/07/2000US6142789 Demateable, compliant, area array interconnect
11/07/2000US6142726 Automated chamfering method
11/07/2000US6142609 End portion structure for connecting leads of flexible printed circuit board
11/07/2000US6142361 Chip C4 assembly improvement using magnetic force and adhesive
11/07/2000US6142357 Molded selective solder pallet
11/07/2000US6141870 Method for making electrical device
11/02/2000WO2000065889A1 Porous power and ground planes for reduced pcb delamination and better reliability
11/02/2000WO2000065888A1 Circuit board, battery pack, and method of manufacturing circuit board
11/02/2000WO2000065740A1 Energy conditioning circuit assembly
11/02/2000WO2000065692A1 Connector and method for establishing solderfree connections between a rigid main pcb and associated conductors
11/02/2000WO2000065689A1 Wireless article including a plural-turn loop antenna
11/02/2000WO2000065652A1 Universal package and method of forming the same
11/02/2000WO2000065616A1 Electronic device and manufacture thereof
11/02/2000WO2000064960A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same
11/02/2000WO2000064669A1 Phenol-novolacs with improved optical properties
11/02/2000WO2000064625A1 Improved solder balls and use thereof
11/02/2000WO2000064623A1 A system and method for material processing using multiple laser beams
11/02/2000WO2000042370A3 Method and apparatus for drying conveyorized manufactured articles
11/02/2000EP1049364A1 Method of manufacturing multilayer wiring boards
11/02/2000EP1049363A2 Printed circuit board
11/02/2000EP1049362A2 Circuit substrate with heat conducting portion
11/02/2000EP1049191A2 Procedure for the production of electronical elements with strip lines
11/02/2000EP1049162A2 Interconnection structure of a multilayer circuit board for electrical connection to a semiconductor package and manufacturing method thereof
11/02/2000EP1049110A2 Large area thick film resistors with improved predictability and uniformity and method for producing same
11/02/2000EP1048946A2 Inspection method and device
11/02/2000EP1048757A1 Plating method and apparatus
11/02/2000EP1048709A1 Adhesive composition
11/02/2000EP1048680A1 Modified polyimide resin and thermosetting resin composition containing the same
11/02/2000EP1048392A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE
11/02/2000EP1048075A1 Semiconductor component with several substrate layers and at least one semiconductor chip and method for producing a semiconductor component
11/02/2000EP1048069A1 Method for connecting electronic components to a substrate, and a method for checking such a connection
11/02/2000EP1047744A1 Curable epoxy-based compositions
11/02/2000EP1047743A1 Circuit protection film
11/02/2000EP1047552A1 Direct write imaging medium
11/02/2000EP1047520A1 Apparatus and method for inerting a wave soldering installation
11/02/2000EP0895486A4 Grafted thermoplastic elastomer barrier layer
11/02/2000EP0721659B1 Method of forming a patterned array of uniform metal microbeads
11/02/2000DE19955100A1 On-board semiconductor device e.g. power converter for motor controller, has control substrate carrying electronic components mounted on external housing by pushing substrate into housing and fastened by screws
11/02/2000DE19913660A1 Verfahren und Vorrichtung zur Befestigung elektrischer Bauelemente Method and device for mounting electrical components
11/02/2000DE10007981A1 Thermal spraying process in manufacture of circuit pattern, involves thermally spraying conductive substance on polyamide group resin board by masking board by leaving space corresponding to circuit pattern size
11/02/2000CA2370832A1 A system and method for material processing using multiple laser beams
11/02/2000CA2335163A1 Phenol-novolacs with improved optical properties
11/01/2000CN1272298A Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
11/01/2000CN1272127A Adhesive and circuit material using adhesive
11/01/2000CN1272082A Plate for screen printing and method for manufacturing same
11/01/2000CN1272072A Multilayer metalized composite on polymer film product and process
11/01/2000CN1272038A Porous power source and stratum capable of reducing PCB stripping with higher reliability
10/2000
10/31/2000US6141223 Battery assembly for supplying power to an integrated circuit
10/31/2000US6140977 Method for attaching an antenna to a circuit board and article produced thereby
10/31/2000US6140827 Method and apparatus for testing bumped die
10/31/2000US6140696 Vertically mountable semiconductor device and methods
10/31/2000US6140421 Flame retardant curable epoxy resin containing a curing agent mixture comprising lower ultraviolet light absorbing phenol-formaldehyde novolak and higher absorbing phenol-glyoxal polycondensate
10/31/2000US6140415 Comprising shaped mixture of an injection moldable solid mixture of partially hydrolyzed polyvinyl alcohol resin, and fully hydrolyzed polyvinyl alcohol resin
10/31/2000US6140286 Defluxing agent cleaning method and cleaning apparatus
10/31/2000US6140025 Photoresists pattern films, curing in laser light and photosensitive films, development
10/31/2000US6140013 Photoresist layer supporting film and photoresist film laminate
10/31/2000US6140009 Heat exchangers for electroluminescent device formed by positioning the transfer layer on receptor substrate and heat exchanging
10/31/2000US6139972 Integrated circuit packaging.
10/31/2000US6139944 Electronic device having a sheathed body and a method of producing the same
10/31/2000US6139904 Method of making a printed board
10/31/2000US6139777 Conductive paste comprises a metallic particle such as copper, an epoxy resin containing a hydroxyl group, an amino group and carboxyl group not more than 5 mol % and epoxy equivalent of epoxy compounds ranges 100-350 g/eq.
10/31/2000US6139762 Contacting the substrate with a first solution, and thereafter contacting with a second aqueous solution comprising paramagnate salt, the ph of first and second etchant is around 13, and free of added hydroxide
10/31/2000US6139666 Method for producing ceramic surfaces with easily removable contact sheets
10/31/2000US6139661 Two step SMT method using masked cure
10/31/2000US6139362 Fastener for connecting an electrical device to a substrate
10/31/2000US6139360 Transmitting system having a connector
10/31/2000US6139345 Clip for coupling component to connector contacts
10/31/2000US6139336 High density connector having a ball type of contact surface
10/31/2000US6139304 Mold for injection molding encapsulation over small device on substrate
10/31/2000US6139079 Universal transport apparatus
10/31/2000US6138894 Method for coupling a circuit component to a substrate
10/31/2000US6138893 Method for producing a reliable BGA solder joint interconnection
10/31/2000US6138892 Method for mounting an integrated circuit from a tape carrier package on a printed circuit board
10/31/2000US6138890 Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality
10/31/2000US6138562 Vibrational energy waves for assist in the print release process for screen printing
10/31/2000US6138350 Process for manufacturing a circuit board with filled holes
10/31/2000US6138349 Protective coating for an electronic device
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