Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2000
11/16/2000WO2000068996A1 Surface mount ic stacking method and device
11/16/2000WO2000068972A2 Method of creating an electrical interconnect device bearing an array of electrical contact pads
11/16/2000WO2000068960A1 Polymer thick-film resistor printed on planar circuit board surface
11/16/2000WO2000068740A1 Solder resist ink composition
11/16/2000WO2000068739A1 Photosensitive composition
11/16/2000WO2000068620A2 Fibrous supported polymer encapsulated electrical component
11/16/2000WO2000068297A1 Compositions for making ene-thiol elastomers
11/16/2000WO2000068010A1 Cartridge squeegee system with floating paste retainers
11/16/2000WO2000021126A9 Semiconductor copper bond pad surface protection
11/16/2000WO2000004584A3 Semiconductor component in a chip format and method for the production thereof
11/16/2000DE19921936A1 Circuit board, especially for tolerance-sensitive components e.g. microswitches, has core of base material, and circuit board coatings with apertures at some points where components are mounted
11/16/2000DE19921726A1 Accelerating draining of liquid lacquer material from coating side of circuit board, involves using floating bodies in immersion bath that come into point contact with lacquered side of board
11/16/2000DE19912519A1 Method of electrically connecting circuit boards
11/16/2000DE19901107C1 Lumineszierender elektrisch leitender Klebstoff Luminescent electrically conductive adhesive
11/16/2000CA2373149A1 Manufacturing electronic components in a direct-write process using precision spraying and laser irradiation
11/16/2000CA2337809A1 Method for producing contact between two circuit layers separated by an insulating layer
11/15/2000EP1052736A1 Electrical connecting system for flat cable
11/15/2000EP1052732A2 Solderless pin connection
11/15/2000EP1052695A2 Tape carrier and manufacturing method of tape carrier type semiconductor device
11/15/2000EP1052653A2 Conductive powder and making process
11/15/2000EP1051888A1 Process and solution for the preliminary treatment of copper surfaces
11/15/2000EP1051887A1 Process for producing a plastic object containing an electronic component
11/15/2000EP1051886A2 Device for electrolytic treatment of printed circuit boards and conductive films
11/15/2000EP1051885A1 Thin film transferable electric components
11/15/2000EP1051748A1 A vertical connector based packaging solution for integrated circuits
11/15/2000EP1051534A1 Process for metal plating liquid crystalline polymers and compositions related thereto
11/15/2000EP1051265A1 A method of forming a coating onto a non-random monolayer of particles, and products formed thereby
11/15/2000EP0970544B1 A contact spring and a tool for handling it
11/15/2000CN1273762A Printed circit board material and method of manufacturing board material and intermediate block body for board material
11/15/2000CN1273695A Semiconductor device, method of manufacture thereof, circuit board and electronic device
11/15/2000CN1273694A Semiconductor device, method of manufacture thereof circuit board and electronic device
11/15/2000CN1273501A No-welding needle connection
11/15/2000CN1273457A Package for electronic component
11/15/2000CN1058581C Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities
11/15/2000CN1058450C Adhesion method capable of controlling effectively thickness of adhibited layer
11/14/2000US6147876 Multi-chip module having printed wiring board comprising circuit pattern for IC chip
11/14/2000US6147871 Low profile computer assembly using paired back-to-back peripheral card connectors that support different bus form factors and are mounted on a riser card
11/14/2000US6147870 Printed circuit assembly having locally enhanced wiring density
11/14/2000US6147505 Adapter arrangement for electrically testing printed circuit boards
11/14/2000US6147311 Multi layer circuit board using anisotropic electroconductive adhesive layer and method for producing same
11/14/2000US6147310 Insulative holder for an electronic component
11/14/2000US6147019 Borate glass based ceramic tape
11/14/2000US6146920 Bump formation method
11/14/2000US6146919 Package stack via bottom leaded plastic (BLP) packaging
11/14/2000US6146815 Developer for photosensitive polyimide precursor, and method of using it for patterning
11/14/2000US6146792 Method of making a color filter with high speed and durable image-transfer characteristics for laser-induced thermal transfer
11/14/2000US6146743 Barrier metallization in ceramic substrate for implantable medical devices
11/14/2000US6146701 Treating metal surfaces with composition comprising oxidizer, acid, corrosion inhibitor, source of halide ions, source of adhesion enhancing ions selected from molybdates, tungstates, tantalates, niobates, vanadates and a water soluble polymer
11/14/2000US6146700 Pretreating solution for electroless plating, electroless plating bath and electroless plating process
11/14/2000US6146698 Inserting perforated stencil into receptacle for component with contact areas, inserting punch into perforations, placing mount onto punch, removing mount, inserting component into receptacle, wetting nubs, transferring liquid to contact areas
11/14/2000US6146517 Filling trench; vapor deposition, electroplating
11/14/2000US6146480 Depositing a layer of cu on a first side of a polyimide film having a metal layer on that side; modifying the second side to increase the surface energy thereof; applying an adhesive to the second side and curing
11/14/2000US6146189 Flexible printed circuit board mounting structure and recording/reproducing apparatus using the same
11/14/2000US6146155 Recyclable locater device for board mounted connectors
11/14/2000US6145735 Thin film solder paste deposition method and tools
11/14/2000US6145734 Reflow method and reflow device
11/14/2000US6145733 Process for soldering electronic components to a printed circuit board
11/14/2000US6145729 Non-connected drainage channels for selective wave solder pallets
11/14/2000US6145543 Automotive hydraulic modulator
11/14/2000US6145365 Method for forming a recess portion on a metal plate
11/14/2000US6145191 Method for mounting and testing integrated circuits on printed circuit boards
11/14/2000US6145190 Method of assembling parts on a printed circuit board
11/14/2000CA2176789C Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board
11/14/2000CA2136137C Silane compositions
11/09/2000WO2000067536A1 A method for making flexible circuits
11/09/2000WO2000067346A1 Edge clip terminal and method
11/09/2000WO2000067310A1 Microelectronic subassembly
11/09/2000WO2000067005A1 A method and apparatus for inspecting solder paste deposits on substrates
11/09/2000WO2000066674A1 Dielectric material including particulate filler
11/09/2000WO2000066312A1 Method for producing weld points on a substrate and guide for implementing said method
11/09/2000WO2000036891A9 Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods
11/09/2000WO2000032848A3 An inflatable compliant bladder assembly
11/09/2000DE19919781A1 Leiterplatte und Verfahren zu ihrer Anbringung Circuit board and method of installation
11/09/2000DE19919753A1 Electrically contactable mask for making three-dimensional circuit carriers, is of metallic material, can be electrically contacted, and has structure of bridges corresponding to regions to be activated
11/09/2000DE10018346A1 Stromkreisanordnung für die Elektrik eines Kraftfahrzeuges Circuit arrangement for the electrical system of a motor vehicle
11/09/2000DE10017239A1 Tuner unit has pressure device on frame bearer that presses surface of protrusion, which is inserted into main card opening, with connection conductor image towards second conductor image
11/09/2000CA2373172A1 Dielectric material including particulate filler
11/09/2000CA2369658A1 A method for making flexible circuits
11/08/2000EP1050906A1 Package for electronic components
11/08/2000EP1050888A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
11/08/2000EP1050201A1 Rotative cutting method and device for printed circuit boards and electric conductors
11/08/2000EP1050093A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
11/08/2000EP1050089A1 Secondary electric power distribution cabinet in an aeroplane
11/08/2000EP1049819A1 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product
11/08/2000CN2405328Y 电连接器 The electrical connector
11/08/2000CN2405324Y 电连接器 The electrical connector
11/08/2000CN1272963A Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
11/08/2000CN1272892A Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same
11/08/2000CN1058225C Ink jet recording head, ink jet recording head cartridge and recording apparatus using same
11/07/2000US6144559 Process for assembling an interposer to probe dense pad arrays
11/07/2000US6144558 Parts installation structure having electronic part connected to flexible sheet with conductive and non-conductive adhesives
11/07/2000US6144557 Self-locking conductive pin for printed wiring substrate electronics case
11/07/2000US6144547 Miniature surface mount capacitor and method of making same
11/07/2000US6144278 Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit
11/07/2000US6144213 Ball grid array probing technique
11/07/2000US6144142 Multi-layer piezoelectric transformer mounting device
11/07/2000US6144103 Graded PB for C4 bump technology
11/07/2000US6144091 Semiconductor device
11/07/2000US6144090 Ball grid array package having electrodes on peripheral side surfaces of a package board
11/07/2000US6143992 Circuit board with terminals having a solder lead portion
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