| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/29/2000 | EP1055194A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component |
| 11/29/2000 | EP1054770A1 Method for transferring a picture to a surface |
| 11/29/2000 | CN2408647Y Heating device for infrared reflow welder |
| 11/29/2000 | CN1275246A Semiconductor device, method of manufacture, circuit board and electronic device |
| 11/29/2000 | CN1274950A Mounting structure, method of manufacturing the same and electrically conductive adhesive |
| 11/28/2000 | US6154863 Apparatus and method for testing non-componented printed circuit boards |
| 11/28/2000 | US6154372 Multichip module for surface mounting on printed circuit boards |
| 11/28/2000 | US6154371 Printed circuit board assembly and method |
| 11/28/2000 | US6154364 Circuit board assembly with IC device mounted thereto |
| 11/28/2000 | US6154112 Chip inductor |
| 11/28/2000 | US6153940 Core metal soldering knob flip-chip technology |
| 11/28/2000 | US6153522 Semiconductor device manufacturing method |
| 11/28/2000 | US6153518 Method of making chip size package substrate |
| 11/28/2000 | US6153508 Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same |
| 11/28/2000 | US6153359 Etching solution mixture of amide solvent, alkali metal compound and alcohol; nonaqueous solution |
| 11/28/2000 | US6153348 Comprises a dispersion of metallic toner particles having metal particles combined with a metallo-organic compound, dispersed in an electrically insulating organic liquid with the addition of a charge director; electrostatic process for |
| 11/28/2000 | US6153290 Multi-layer ceramic substrate and method for producing the same |
| 11/28/2000 | US6153255 Manual electronic-part mounting method |
| 11/28/2000 | US6153078 Providing unfired ferrite substrate; coating conductive material comprising silver/palladium particles, ferrite particles, cellulose-based binder, solvent; firing substrate; electroplating copper using copper pyrophosphate bath |
| 11/28/2000 | US6153064 Apparatus for in line plating |
| 11/28/2000 | US6153060 Sputtering process |
| 11/28/2000 | US6152765 Electrical connector |
| 11/28/2000 | US6152744 Integrated circuit test socket |
| 11/28/2000 | US6152610 Optical transmission mechanism for mount chip and chip mounting |
| 11/28/2000 | US6152568 Lighting apparatus and display apparatus having the same |
| 11/28/2000 | US6152353 Printed circuit board header attachment station |
| 11/28/2000 | US6152033 Mechanically printing onto substrate an electroconductive frit transferred from recesses of an fine intaglio patterned surface while curing frit |
| 11/28/2000 | US6151796 Substrate drying device, drying method and substrate dried by the same |
| 11/28/2000 | US6151792 Registration system and method |
| 11/28/2000 | US6151775 Multilayer circuit board and method of producing the same |
| 11/28/2000 | CA2041062C Demetallizing procedure |
| 11/23/2000 | WO2000070925A1 Multilayer printed-circuit board and method of manufacture |
| 11/23/2000 | WO2000070924A1 Integrated circuits with copper matallization for interconnections |
| 11/23/2000 | WO2000070676A1 High-density electronic package, and method for making same |
| 11/23/2000 | WO2000070672A1 Creation of a corner of an electric strip conductor, in particular, consisting of copper, which has been produced by damascene work on a substrate |
| 11/23/2000 | WO2000070671A1 Mounting arrangement for a semiconductor element |
| 11/23/2000 | WO2000070670A1 Semiconductor device and method for manufacturing the same, and electronic device |
| 11/23/2000 | WO2000070360A1 A microvia inspection system |
| 11/23/2000 | WO2000070127A1 Method and apparatus related to an electroplated structure |
| 11/23/2000 | WO2000044066A3 Remote entry integrally molded transmitter |
| 11/23/2000 | WO2000036188A3 Method for producing a self-supporting metal film |
| 11/23/2000 | WO2000031797A3 Device for electronic packaging, pin jig fixture |
| 11/23/2000 | DE19931114A1 Production of pi-conjugated polymers, useful for the production of multilayered circuit boards, comprises polymerization of a complex of a monomer and a cyclodextrin compound. |
| 11/23/2000 | DE19923117A1 Filling bores in HDI multilayers, involves heating epoxy resin lacquer, moving to column setting device, sucking into bores, removing excess, and setting lacquer in bores with ultraviolet light |
| 11/23/2000 | DE19923055A1 Transparent package for ball grid array integrated circuit consists of transparent material with channels for connections and contacts to integrated circuit |
| 11/23/2000 | DE19922176A1 Oberflächenmontierte LED-Mehrfachanordnung The surface-mount LED array |
| 11/23/2000 | DE19921678A1 Manufacture of carrier e.g. multifunctional chip card with display, involves covering base with flowable plastic material so that electronic components are partially embedded and processing upper side of plastics material |
| 11/22/2000 | EP1054582A2 Mask film, its manufacturing method, and manufacturing method of circuit board using the same |
| 11/22/2000 | EP1054549A2 Arrangement for mounting and fastening an optical display device in a telecommunication apparatus |
| 11/22/2000 | EP1054447A1 Surface mount millimeter wave IC package |
| 11/22/2000 | EP1054081A2 Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| 11/22/2000 | EP1054080A2 Electrolytic copper plating solutions |
| 11/22/2000 | EP1053580A1 An improved connector scheme for a power pod power delivery system |
| 11/22/2000 | EP1053507A1 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 11/22/2000 | EP1053280A1 Adhesive composition and precursor thereof |
| 11/22/2000 | CN2407551Y Circuit board drier with oily dust remover |
| 11/22/2000 | CN2406732Y Improved nozzle assembly of workpiece spray washing apparatus |
| 11/22/2000 | CN1274516A Substrate for formation of special pattern, and method of manufacture of substrate |
| 11/22/2000 | CN1274257A Shielding thin film, its mfg. method, and method for mfg. circuit substrate using such shielding film |
| 11/22/2000 | CN1274256A Printed circuit board and its mfg. method |
| 11/22/2000 | CN1274173A Method of mfg. carrying band and carrying band type semiconductor device |
| 11/22/2000 | CN1274021A Electrolytic copper electroplating liquid |
| 11/22/2000 | CN1274018A Super-thin stainless steel foil |
| 11/22/2000 | CN1058741C Aqueous silver compsn. |
| 11/21/2000 | USRE36956 Flip up side stencil to be used with single site stencil printer |
| 11/21/2000 | US6151221 Printed circuit board having wire clamps for securing component leads |
| 11/21/2000 | US6151220 Mounting structure for electronic part |
| 11/21/2000 | US6151204 Electronic device |
| 11/21/2000 | US6150920 Resistor and its manufacturing method |
| 11/21/2000 | US6150813 Method of connecting heads of a data storage system to a testing apparatus |
| 11/21/2000 | US6150726 Component carrier with raised bonding sites |
| 11/21/2000 | US6150723 Copper stud structure with refractory metal liner |
| 11/21/2000 | US6150712 Lead frame for semiconductor device, and semiconductor device |
| 11/21/2000 | US6150614 Conducting foil for conductively connecting electric and/or electronic components |
| 11/21/2000 | US6150456 High dielectric constant flexible polyimide film and process of preparation |
| 11/21/2000 | US6150255 Method of planarizing a curved substrate and resulting structure |
| 11/21/2000 | US6150240 Method and apparatus for singulating semiconductor devices |
| 11/21/2000 | US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
| 11/21/2000 | US6150074 Method of forming electrically conductive wiring pattern |
| 11/21/2000 | US6150071 Fabrication process for flex circuit applications |
| 11/21/2000 | US6150070 Method of creating optimal profile in single layer photoresist |
| 11/21/2000 | US6150061 Placing mask around the perimeter of a plated through hole (pth); the clover leaf shaped opening maintains the necessary barrier between the pth and adjacent lands while providing additional clearance around the pth |
| 11/21/2000 | US6149988 Method and system of laser processing |
| 11/21/2000 | US6149857 Method of making films and coatings having anisotropic conductive pathways therein |
| 11/21/2000 | US6149443 Ground connection apparatus |
| 11/21/2000 | US6149122 Method for building interconnect structures by injection molded solder and structures built |
| 11/21/2000 | US6149050 Method for attaching solderable wire leads to a lead frame |
| 11/21/2000 | US6149048 Apparatus and method for use in manufacturing semiconductor devices |
| 11/21/2000 | US6148900 Connecting board for connection between base plate and mounting board |
| 11/21/2000 | US6148512 Method for attaching an electronic device |
| 11/21/2000 | US6148505 System and method for wiring electronic components in a three-dimensional manner |
| 11/21/2000 | US6148500 Electronic inductive device and method for manufacturing |
| 11/20/2000 | CA2308943A1 Surface mount millimeter wave ic package |
| 11/16/2000 | WO2000069239A1 Method for manufacturing a printed circuit board with integrated heat sink for semiconductor package |
| 11/16/2000 | WO2000069238A1 Double-sided printed wiring board and method for manufacturing multilayer printed wiring board having three or more layers |
| 11/16/2000 | WO2000069237A1 Method for producing contact between two circuit layers separated by an insulating layer |
| 11/16/2000 | WO2000069235A1 Manufacturing electronic components in a direct-write process using precision spraying and laser irradiation |
| 11/16/2000 | WO2000069234A1 Wiring method and wiring device |
| 11/16/2000 | WO2000069029A1 Connection arrangement on a printed circuit board of a portable electric apparatus |
| 11/16/2000 | WO2000069000A1 Light-emitting diode arrangement |