| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/12/2000 | US6159045 Method and apparatus for engaging an electrical component to a circuit board |
| 12/12/2000 | US6158650 Process for fine and coarse pitch solder deposits on printed circuit boards |
| 12/12/2000 | US6158649 Solder ball mounting apparatus and method |
| 12/12/2000 | US6158648 Method and apparatus for bonding using brazing material |
| 12/12/2000 | US6158644 Method for enhancing fatigue life of ball grid arrays |
| 12/12/2000 | US6158492 Apparatus for making a foil-clad laminate |
| 12/12/2000 | US6158491 Process for the corrosion protection of copper or copper alloys |
| 12/12/2000 | US6158341 Method for transferring a picture to a surface |
| 12/12/2000 | US6158339 Stencil holder assembly for use with solder paste stencil printers |
| 12/12/2000 | US6158338 Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate |
| 12/12/2000 | US6158268 Measuring sensor |
| 12/12/2000 | US6158119 Circuit board panel test strip and associated method of assembly |
| 12/12/2000 | US6158118 Method and apparatus for aligning surface mounted optoelectric semiconductor devices on a printed circuit board |
| 12/12/2000 | US6158115 Method of mounting a plurality of electronic parts on a circuit board |
| 12/07/2000 | WO2000074451A1 Process for promoting adhesion between an inorganic substrate and an organic polymer |
| 12/07/2000 | WO2000074450A1 Laser soldering method |
| 12/07/2000 | WO2000074449A1 Main board with printed circuit board mounted thereon |
| 12/07/2000 | WO2000074447A1 Method and apparatus for reducing electrical resonances and noise propagation in power distribution circuits employing plane conductors |
| 12/07/2000 | WO2000074446A1 Intelligent power module |
| 12/07/2000 | WO2000074445A1 Sandwich-structured intelligent power module |
| 12/07/2000 | WO2000074197A1 A multi-functional energy conditioner |
| 12/07/2000 | WO2000074133A2 Method for curing thermally curable underfill material |
| 12/07/2000 | WO2000074132A1 Method of protective coating bga solder alloy spheres |
| 12/07/2000 | WO2000074023A1 Electrical connection structure and flat display device |
| 12/07/2000 | WO2000073855A1 Production device for printed board, production method for printed board and printed board |
| 12/07/2000 | WO2000073371A1 Novel adhesive and conductive composition, use thereof and conductor element |
| 12/07/2000 | WO2000073069A1 Silk-screen printing machine |
| 12/07/2000 | WO2000073047A1 Method and apparatus for making resin-impregnated fiber substrates |
| 12/07/2000 | WO2000073013A1 Beam shaping and projection imaging with solid state uv gaussian beam to form vias |
| 12/07/2000 | DE19923805A1 Electrical or electronic component solder contact formation method |
| 12/07/2000 | DE19923446A1 Line connections for hybrids and modules |
| 12/07/2000 | DE19923166A1 Producing template for applying solder paste to circuit boards involves forming compound foil with different thicknesses by sticking first foil onto further foil(s) with pre-formed cut-outs |
| 12/07/2000 | DE19922468A1 Method of producing 3D conductor structure, involves metallising hollow channel for connecting conducting layers in free area of insulating layer using metal particles as seeds |
| 12/07/2000 | DE10023239A1 Surface mount device for electrical connections for PCB, has body with extended connection elements that fit together with body and holds connecting element in defined spatial relationship |
| 12/07/2000 | DE10018634A1 Liquid development method for printed circuit board by electrostatically charging surface and placing opposite surface on which latent image is formed |
| 12/07/2000 | DE10011368A1 Semiconductor device has copper-tin alloy layer formed on junction portion of solder ball consisting of tin, and wiring consisting of copper |
| 12/07/2000 | CA2375135A1 A multi-functional energy conditioner |
| 12/06/2000 | EP1058492A2 Method of forming distortion-free circuits |
| 12/06/2000 | EP1058307A1 Electronic unit effectively utilizing circuit board surface |
| 12/06/2000 | EP1058306A2 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same |
| 12/06/2000 | EP1057542A2 Air assisted liquid dispensing apparatus and method for increasing contact area between the liquid and a substrate |
| 12/06/2000 | EP1057384A1 Electronic control device |
| 12/06/2000 | EP1057080A1 Resist stripping process |
| 12/06/2000 | EP1057038A1 Method and device for testing printed circuit boards |
| 12/06/2000 | EP1023743A4 Composite electrical contact structure and method for manufacturing the same |
| 12/06/2000 | EP0882086A4 Composition exhibiting improved fluorescent response |
| 12/06/2000 | CN2409747Y Heat pressing head for thermosetting machine and box-type automatic belt recovering separating device |
| 12/06/2000 | CN2409746Y Improved sucking device for plate |
| 12/06/2000 | CN1276091A Package substrate |
| 12/06/2000 | CN1275881A Method for producing circuit board |
| 12/06/2000 | CN1275880A Copper foil for printed-circuit board |
| 12/06/2000 | CN1275800A Semiconductor device and making method thereof |
| 12/06/2000 | CN1275484A Picture composition method, device, template and method for making same |
| 12/06/2000 | CN1275459A Soldering tin blow flow device and tin-soldering method thereof |
| 12/06/2000 | CN1059244C Organic rust-proof treating copper foil |
| 12/05/2000 | US6157789 Electrophotographic apparatus |
| 12/05/2000 | US6157543 Case for circuit board |
| 12/05/2000 | US6157084 Film carrier and semiconductor device using same |
| 12/05/2000 | US6156980 Flip chip on circuit board with enhanced heat dissipation and method therefor |
| 12/05/2000 | US6156870 Bismaleimide compounds with novel accelerators, acridine compound as a thermosetting accelerator, render bismaleimide compounds photo-curable without deteriorating their thermosetting properties. |
| 12/05/2000 | US6156672 Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
| 12/05/2000 | US6156635 Method of correcting solder bumps |
| 12/05/2000 | US6156462 Photosensitive resin compositions, cured films thereof, and circuit substrates |
| 12/05/2000 | US6156445 A metallized ceramic substrate coated a film of an ablatively photodecomposable acrylate polymer modified by disperse red 1, a photoabsorber; circuit patterns; no phase separation or crystallization, even ablation and high resolution |
| 12/05/2000 | US6156414 Carrier film and process for producing the same |
| 12/05/2000 | US6156413 Glass circuit substrate and fabrication method thereof |
| 12/05/2000 | US6156408 Device for reworkable direct chip attachment |
| 12/05/2000 | US6156385 Treating an unsaturated polyampholyte resin coating with weak alkali solution to form alkali salt with the acid groups of resin, treating with palladium ion-containing acidic solution and reducing to form absorbed palladium catalyst, plating |
| 12/05/2000 | US6156237 Conductive paste and circuit substrate formed by use of the paste |
| 12/05/2000 | US6156221 Copper etching compositions, processes and products derived therefrom |
| 12/05/2000 | US6156220 System and method for optically aligning films and substrates used in printed circuit boards |
| 12/05/2000 | US6156218 Method of pretreatment for electroless nickel plating |
| 12/05/2000 | US6156138 Method of and structure for fixing a flexible electrical conductor |
| 12/05/2000 | US6155874 Connecting structure for electronic part and connection method thereof |
| 12/05/2000 | US6155845 Electrical contact for ball grid array socket |
| 12/05/2000 | US6155548 Fixture for aligning and clamping a workpiece, in particular a pack of printed circuit boards, on a machine tool |
| 12/05/2000 | US6155247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 11/30/2000 | WO2000072645A1 Laser machining of plastic film of circuit board, and method of manufacturing circuit board |
| 11/30/2000 | WO2000072644A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same |
| 11/30/2000 | WO2000072643A1 Fabrication of unidirectional laminate prepregs using tape casting methods and equipment |
| 11/30/2000 | WO2000072378A1 Substrate with at least two metallized polymer bumps for soldered connection to wiring |
| 11/30/2000 | WO2000072331A1 METHOD OF PRODUCING π-CONJUGATED POLYMERS |
| 11/30/2000 | WO2000072222A1 Apparatus for fabrication of miniature structures |
| 11/30/2000 | WO2000072163A1 High-speed digital distribution system |
| 11/30/2000 | WO2000071921A2 Burrless castellation via process and product for plastic chip carrier |
| 11/30/2000 | WO2000071614A1 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| 11/30/2000 | WO2000071264A1 Viscous material applicator |
| 11/30/2000 | WO2000044211A8 Flexible printed circuit board arrangement |
| 11/30/2000 | WO2000042679A3 A printed circuit board |
| 11/30/2000 | DE19922299A1 Circuit board for drive motor control for such as blinds, has gearing arrangement and end stop, and is mounted in housing. |
| 11/30/2000 | DE10014108A1 Automotive electrical connector for flexible printed circuits has flexible PCB wrapped around rigid card which is inserted along guide channel into cavity in back plane where it contacts second flexible PCB |
| 11/29/2000 | EP1056321A2 Circuit substrate |
| 11/29/2000 | EP1056320A2 Copper foil for printed wiring board |
| 11/29/2000 | EP1056319A2 Daughter board for insertion into a mother board |
| 11/29/2000 | EP1056318A2 Improvements relating to electrical circuits |
| 11/29/2000 | EP1056158A2 Electronic package and contact therefor |
| 11/29/2000 | EP1055932A2 Apparatus and method for inspecting wiring on board |
| 11/29/2000 | EP1055557A2 Vehicle lighting device with a plurality of light-emitting diodes employed as light source |
| 11/29/2000 | EP1055355A1 Process for the preliminary treatment of copper surfaces |
| 11/29/2000 | EP1055255A1 Method and apparatus for coupling circuit components |