Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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12/20/2000 | EP1061784A1 Radio-electronic unit |
12/20/2000 | EP1061783A2 Ceramic-metal substrate, particularly multiple substrate |
12/20/2000 | EP1061608A2 Board to board electrical connectors |
12/20/2000 | EP1061576A2 Semiconductor package and its manufacturing method |
12/20/2000 | EP1061574A1 Semiconductor device and method for manufacturing the same |
12/20/2000 | EP1061569A2 Method for manufacturing ceramic substrate and non-fired ceramic substrate |
12/20/2000 | EP1061536A2 Chip capacitor |
12/20/2000 | EP1061535A2 Surface mount rc device |
12/20/2000 | EP1061417A2 Method and apparatus for overlay measurement |
12/20/2000 | EP1061101A2 Cationally hardenable compositions and polymers therefrom |
12/20/2000 | EP1060647A1 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
12/20/2000 | EP1060646A1 Method for manufacturing a resistor |
12/20/2000 | EP1060644A2 Backplane having reduced lc product |
12/20/2000 | EP1060574A2 A differential line driver |
12/20/2000 | EP1060557A1 Electric drive unit for units of a motor vehicle |
12/20/2000 | EP1060494A1 Electroluminescent lamp devices and their manufacture |
12/20/2000 | EP1060299A1 Method of etching |
12/20/2000 | EP1060297A2 Electrolytic copper foil having a modified shiny side |
12/20/2000 | EP1060144A1 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
12/20/2000 | EP1060141A1 Impregnated glass fiber strands and products including the same |
12/20/2000 | EP1060080A1 Method and apparatus for transporting substrates |
12/20/2000 | EP0838100B1 Separable electrical connector assembly having a planar array of conductive protrusions |
12/20/2000 | EP0815622A4 Cross-connect method and apparatus |
12/20/2000 | CN1277797A Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |
12/20/2000 | CN1277796A Thin-laminate panels for capacative printed-circuit boards ance methods for making the same |
12/20/2000 | CN1277736A Method for producing electrically conductive cross connections between two layers of wiring on a substrate |
12/20/2000 | CN1277734A Articles or compositions comprising nanoscale particles, methods of utilizing or producing such particles |
12/20/2000 | CN1277538A Chemical-corrosive process for substrate |
12/20/2000 | CN1277537A Liquid distrubuting system and method for raising contact area between liquid and substrate |
12/20/2000 | CN1277458A Producing method of relay base plate for installation of semi-conductor elements |
12/19/2000 | US6163462 Stress relief substrate for solder ball grid array mounted circuits and method of packaging |
12/19/2000 | US6163461 Terminal mounting structure for a printed circuit board |
12/19/2000 | US6163460 Housing for electronic assemblies including board-mounted components and separate discrete components |
12/19/2000 | US6163456 Hybrid module and methods for manufacturing and mounting thereof |
12/19/2000 | US6163443 Actuator having MR element protecting means |
12/19/2000 | US6163233 Waveguide with signal track cross-over and variable features |
12/19/2000 | US6163070 Semiconductor package utilizing a flexible wiring substrate |
12/19/2000 | US6163069 Semiconductor device having pads for connecting a semiconducting element to a mother board |
12/19/2000 | US6163028 Imaging support for removably mounting an imaging device |
12/19/2000 | US6162997 Circuit board with primary and secondary through holes |
12/19/2000 | US6162996 Insulating foil circuit board with rigid and flexible sections |
12/19/2000 | US6162889 Curable resin composition for overcoat of flexible circuit |
12/19/2000 | US6162779 Cold cleaning composition based on alkanes or cycloalkanes and an organic compound comprising a ketone group |
12/19/2000 | US6162664 Method for fabricating a surface mounting type semiconductor chip package |
12/19/2000 | US6162661 Spacer plate solder ball placement fixture and methods therefor |
12/19/2000 | US6162569 Manufacturing the fine pattern used for forming a color liquid crystal display element used for a display unit |
12/19/2000 | US6162503 Process for improving the adhesion of polymeric materials to metal surfaces |
12/19/2000 | US6162381 Method for producing a molded unit with electrodes embedded therein |
12/19/2000 | US6162366 Preparing an etchant containing ferric chloride and an anticorrosive agent for cu, and etching with said etchant a multilayer metal structure including a cu layer and an ni layer |
12/19/2000 | US6162365 Pd etch mask for copper circuitization |
12/19/2000 | US6162319 Fixing method for electronics |
12/19/2000 | US6162065 Button and dovetail connector actuation mechanism |
12/19/2000 | US6162064 Method and apparatus for elastomer connection between a bonding shelf and a substrate |
12/19/2000 | US6161915 Identification of thermal inkjet printer cartridges |
12/19/2000 | US6161889 Ribbed trim panel for thermal spraying of electrical circuit |
12/19/2000 | US6161748 Process for manufacturing electronic circuits |
12/19/2000 | US6161281 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections |
12/19/2000 | US6161280 Method for manufacturing a device for burning off thermal energy produced by electronic components embedded in a printed circuit card, and resulting device |
12/19/2000 | US6161276 Method for producing a transponder coil |
12/14/2000 | WO2000076281A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
12/14/2000 | WO2000076280A1 Pattern design for electronic components on a 400 micron copper layer in printed circuits |
12/14/2000 | WO2000076279A1 Process for producing printed wiring board, ic card and printed wiring substrate |
12/14/2000 | WO2000075944A1 A contactor |
12/14/2000 | WO2000075940A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
12/14/2000 | WO2000075932A1 Aqueous carbon composition and method for coating a non conductive substrate |
12/14/2000 | WO2000075728A1 Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition |
12/14/2000 | WO2000075396A1 Electroless coatings formed from organic solvents |
12/14/2000 | WO2000074935A1 Barrier laminate |
12/14/2000 | DE4109363C2 Klebverbindung zwischen einem elektronischen Bauteil und einem Substrat sowie Verfahren zur Herstellung der Klebverbindung Adhesive connection between an electronic component and a substrate and methods for producing the adhesive bond |
12/14/2000 | DE19913367C1 Verfahren zur Herstellung einer elektrischen Schaltung A method of producing an electrical circuit |
12/14/2000 | DE19835517C1 Contact device for automobile control device or electrical component uses plug rail with projecting contacts inserted in circuit board bores via intermediate guide plate |
12/14/2000 | DE10025899A1 Jet solder delivery device has protruding sections around each jet opening in corrugated plate |
12/13/2000 | EP1059833A2 Heat transferring printed wiring board |
12/13/2000 | EP1059538A2 Printed circuit board testing apparatus |
12/13/2000 | EP1059019A1 Components with releasable leads |
12/13/2000 | EP1058697A1 Polymeric films having controlled viscosity response to temperature and shear |
12/13/2000 | CN2410848Y Water-stopping roller of transporting system in process of making printed circuit board |
12/13/2000 | CN2410847Y Automatic cutter for printed circuit board |
12/13/2000 | CN1276699A Electronic module |
12/13/2000 | CN1276648A Electronic component having circuit arrangement packed and mfg. method thereof |
12/13/2000 | CN1276587A Multichip installation structure, electrooptical device and electronic machine |
12/13/2000 | CN1276530A Probe unit for inspection of base board for assemblying semiconductor chip |
12/13/2000 | CN1059515C Conductive ball carrying device |
12/12/2000 | US6160962 Camera with lens barrier apparatus |
12/12/2000 | US6160714 Molded electronic package and method of preparation |
12/12/2000 | US6160713 Circuit in a selective call radio with improved electromechanical interconnects |
12/12/2000 | US6160710 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
12/12/2000 | US6160647 Optoelectronic transmitter with improved control circuit and laser fault latching |
12/12/2000 | US6160469 Large value buried inductors in low temperature co-fired ceramic circuit boards |
12/12/2000 | US6160239 Laser soldering procedure applicable to the joining of pins over printed circuit boards |
12/12/2000 | US6160224 Solder material containing from 0.01 to 4.99% by weight of iron, 0.01 to 4.99% by weight of nickel, 0.1 to 8.0% by weight of at least one of silver and indium; 0 to 70% by weight of lead, balance containing tin; heat fatigue resistance |
12/12/2000 | US6159772 Packaging electrical circuits |
12/12/2000 | US6159770 Method and apparatus for fabricating semiconductor device |
12/12/2000 | US6159769 Use of palladium in IC manufacturing |
12/12/2000 | US6159663 Ion vapor depositing an aluminum containing mixture on the member, covering with a photoresist layer, photolithographic process, coating a metal corrosion inhibiting layer, electroless plating |
12/12/2000 | US6159611 Used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors |
12/12/2000 | US6159586 Multilayer wiring substrate and method for producing the same |
12/12/2000 | US6159323 Process for selective transfer of a microstructure formed on an initial substrate to a final substrate |
12/12/2000 | US6159322 Photosensitive ceramic green sheet, ceramic package, and process for producing the same |
12/12/2000 | US6159294 Apparatus for coating board-shaped articles, especially printed circuit boards |