Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2000
12/20/2000EP1061784A1 Radio-electronic unit
12/20/2000EP1061783A2 Ceramic-metal substrate, particularly multiple substrate
12/20/2000EP1061608A2 Board to board electrical connectors
12/20/2000EP1061576A2 Semiconductor package and its manufacturing method
12/20/2000EP1061574A1 Semiconductor device and method for manufacturing the same
12/20/2000EP1061569A2 Method for manufacturing ceramic substrate and non-fired ceramic substrate
12/20/2000EP1061536A2 Chip capacitor
12/20/2000EP1061535A2 Surface mount rc device
12/20/2000EP1061417A2 Method and apparatus for overlay measurement
12/20/2000EP1061101A2 Cationally hardenable compositions and polymers therefrom
12/20/2000EP1060647A1 Method of making microwave, multifunction modules using fluoropolymer composite substrates
12/20/2000EP1060646A1 Method for manufacturing a resistor
12/20/2000EP1060644A2 Backplane having reduced lc product
12/20/2000EP1060574A2 A differential line driver
12/20/2000EP1060557A1 Electric drive unit for units of a motor vehicle
12/20/2000EP1060494A1 Electroluminescent lamp devices and their manufacture
12/20/2000EP1060299A1 Method of etching
12/20/2000EP1060297A2 Electrolytic copper foil having a modified shiny side
12/20/2000EP1060144A1 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric
12/20/2000EP1060141A1 Impregnated glass fiber strands and products including the same
12/20/2000EP1060080A1 Method and apparatus for transporting substrates
12/20/2000EP0838100B1 Separable electrical connector assembly having a planar array of conductive protrusions
12/20/2000EP0815622A4 Cross-connect method and apparatus
12/20/2000CN1277797A Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it
12/20/2000CN1277796A Thin-laminate panels for capacative printed-circuit boards ance methods for making the same
12/20/2000CN1277736A Method for producing electrically conductive cross connections between two layers of wiring on a substrate
12/20/2000CN1277734A Articles or compositions comprising nanoscale particles, methods of utilizing or producing such particles
12/20/2000CN1277538A Chemical-corrosive process for substrate
12/20/2000CN1277537A Liquid distrubuting system and method for raising contact area between liquid and substrate
12/20/2000CN1277458A Producing method of relay base plate for installation of semi-conductor elements
12/19/2000US6163462 Stress relief substrate for solder ball grid array mounted circuits and method of packaging
12/19/2000US6163461 Terminal mounting structure for a printed circuit board
12/19/2000US6163460 Housing for electronic assemblies including board-mounted components and separate discrete components
12/19/2000US6163456 Hybrid module and methods for manufacturing and mounting thereof
12/19/2000US6163443 Actuator having MR element protecting means
12/19/2000US6163233 Waveguide with signal track cross-over and variable features
12/19/2000US6163070 Semiconductor package utilizing a flexible wiring substrate
12/19/2000US6163069 Semiconductor device having pads for connecting a semiconducting element to a mother board
12/19/2000US6163028 Imaging support for removably mounting an imaging device
12/19/2000US6162997 Circuit board with primary and secondary through holes
12/19/2000US6162996 Insulating foil circuit board with rigid and flexible sections
12/19/2000US6162889 Curable resin composition for overcoat of flexible circuit
12/19/2000US6162779 Cold cleaning composition based on alkanes or cycloalkanes and an organic compound comprising a ketone group
12/19/2000US6162664 Method for fabricating a surface mounting type semiconductor chip package
12/19/2000US6162661 Spacer plate solder ball placement fixture and methods therefor
12/19/2000US6162569 Manufacturing the fine pattern used for forming a color liquid crystal display element used for a display unit
12/19/2000US6162503 Process for improving the adhesion of polymeric materials to metal surfaces
12/19/2000US6162381 Method for producing a molded unit with electrodes embedded therein
12/19/2000US6162366 Preparing an etchant containing ferric chloride and an anticorrosive agent for cu, and etching with said etchant a multilayer metal structure including a cu layer and an ni layer
12/19/2000US6162365 Pd etch mask for copper circuitization
12/19/2000US6162319 Fixing method for electronics
12/19/2000US6162065 Button and dovetail connector actuation mechanism
12/19/2000US6162064 Method and apparatus for elastomer connection between a bonding shelf and a substrate
12/19/2000US6161915 Identification of thermal inkjet printer cartridges
12/19/2000US6161889 Ribbed trim panel for thermal spraying of electrical circuit
12/19/2000US6161748 Process for manufacturing electronic circuits
12/19/2000US6161281 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections
12/19/2000US6161280 Method for manufacturing a device for burning off thermal energy produced by electronic components embedded in a printed circuit card, and resulting device
12/19/2000US6161276 Method for producing a transponder coil
12/14/2000WO2000076281A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
12/14/2000WO2000076280A1 Pattern design for electronic components on a 400 micron copper layer in printed circuits
12/14/2000WO2000076279A1 Process for producing printed wiring board, ic card and printed wiring substrate
12/14/2000WO2000075944A1 A contactor
12/14/2000WO2000075940A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method
12/14/2000WO2000075932A1 Aqueous carbon composition and method for coating a non conductive substrate
12/14/2000WO2000075728A1 Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition
12/14/2000WO2000075396A1 Electroless coatings formed from organic solvents
12/14/2000WO2000074935A1 Barrier laminate
12/14/2000DE4109363C2 Klebverbindung zwischen einem elektronischen Bauteil und einem Substrat sowie Verfahren zur Herstellung der Klebverbindung Adhesive connection between an electronic component and a substrate and methods for producing the adhesive bond
12/14/2000DE19913367C1 Verfahren zur Herstellung einer elektrischen Schaltung A method of producing an electrical circuit
12/14/2000DE19835517C1 Contact device for automobile control device or electrical component uses plug rail with projecting contacts inserted in circuit board bores via intermediate guide plate
12/14/2000DE10025899A1 Jet solder delivery device has protruding sections around each jet opening in corrugated plate
12/13/2000EP1059833A2 Heat transferring printed wiring board
12/13/2000EP1059538A2 Printed circuit board testing apparatus
12/13/2000EP1059019A1 Components with releasable leads
12/13/2000EP1058697A1 Polymeric films having controlled viscosity response to temperature and shear
12/13/2000CN2410848Y Water-stopping roller of transporting system in process of making printed circuit board
12/13/2000CN2410847Y Automatic cutter for printed circuit board
12/13/2000CN1276699A Electronic module
12/13/2000CN1276648A Electronic component having circuit arrangement packed and mfg. method thereof
12/13/2000CN1276587A Multichip installation structure, electrooptical device and electronic machine
12/13/2000CN1276530A Probe unit for inspection of base board for assemblying semiconductor chip
12/13/2000CN1059515C Conductive ball carrying device
12/12/2000US6160962 Camera with lens barrier apparatus
12/12/2000US6160714 Molded electronic package and method of preparation
12/12/2000US6160713 Circuit in a selective call radio with improved electromechanical interconnects
12/12/2000US6160710 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
12/12/2000US6160647 Optoelectronic transmitter with improved control circuit and laser fault latching
12/12/2000US6160469 Large value buried inductors in low temperature co-fired ceramic circuit boards
12/12/2000US6160239 Laser soldering procedure applicable to the joining of pins over printed circuit boards
12/12/2000US6160224 Solder material containing from 0.01 to 4.99% by weight of iron, 0.01 to 4.99% by weight of nickel, 0.1 to 8.0% by weight of at least one of silver and indium; 0 to 70% by weight of lead, balance containing tin; heat fatigue resistance
12/12/2000US6159772 Packaging electrical circuits
12/12/2000US6159770 Method and apparatus for fabricating semiconductor device
12/12/2000US6159769 Use of palladium in IC manufacturing
12/12/2000US6159663 Ion vapor depositing an aluminum containing mixture on the member, covering with a photoresist layer, photolithographic process, coating a metal corrosion inhibiting layer, electroless plating
12/12/2000US6159611 Used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors
12/12/2000US6159586 Multilayer wiring substrate and method for producing the same
12/12/2000US6159323 Process for selective transfer of a microstructure formed on an initial substrate to a final substrate
12/12/2000US6159322 Photosensitive ceramic green sheet, ceramic package, and process for producing the same
12/12/2000US6159294 Apparatus for coating board-shaped articles, especially printed circuit boards