| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/28/2000 | WO2000079475A2 High-reliability touch panel |
| 12/28/2000 | WO2000079023A1 Method for printing a catalyst on substrates for electroless deposition |
| 12/28/2000 | WO2000078887A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 12/28/2000 | WO2000078873A1 Process for preparing green pigment composition containing no halogen |
| 12/28/2000 | WO2000078549A1 Wiper blades for screen printing |
| 12/28/2000 | DE19953841A1 Dual processor adapter card has two processor sockets with some interconnected pins and other pins corresponding to pins in a processor socket in a main circuit board |
| 12/28/2000 | DE19927749A1 Electronic arrangement used as a semiconductor chip has electrical contacts on a first surface with a flexible elevation made of an insulating material |
| 12/28/2000 | DE19927046A1 Keramik-Metall-Substrat, insbesondere Mehrfachsubstrat A ceramic-metal substrate, in particular multiple substrate |
| 12/28/2000 | DE19726510C2 Vorrichtung und Verfahren zur elektrolytischen Metallabscheidung mittels Pulsstrom Apparatus and method for electrolytic metal deposition by means of pulse current |
| 12/28/2000 | DE10016060A1 Motherboard structure has linearly distributed through-holes which are mutually formed at predetermined interval such that through-holes on alternate linearity are linear |
| 12/28/2000 | CA2375993A1 Tooling fixture |
| 12/28/2000 | CA2375284A1 Wiper blades for screen printing |
| 12/27/2000 | EP1063873A2 Process for manufacturing substrates with patterned metallizations and holding and fixing element used in the process |
| 12/27/2000 | EP1063872A2 Electrical circuit arrangements |
| 12/27/2000 | EP1063737A2 Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules |
| 12/27/2000 | EP1063736A1 Electrical connector and method of soldering cable to such a connector |
| 12/27/2000 | EP1063700A2 Substrate for high voltage modules |
| 12/27/2000 | EP1063699A1 Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module |
| 12/27/2000 | EP1063283A1 Cold cleaning microemulsion compositions |
| 12/27/2000 | EP1063048A2 Laser hole boring apparatus |
| 12/27/2000 | EP1062850A2 Method for producing printed conductor structures |
| 12/27/2000 | EP1062849A1 Circuit board features with reduced parasitic capacitance and method therefor |
| 12/27/2000 | EP1062848A2 Integrated circuit connection using an electrically conductive adhesive |
| 12/27/2000 | EP1062695A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 12/27/2000 | EP1062634A1 Chip card equipped with a loop antenna, and associated micromodule |
| 12/27/2000 | EP1062545A1 Positive acting photodielectric composition |
| 12/27/2000 | EP1062383A1 Electrolyte and tin-silver electroplating process |
| 12/27/2000 | EP1062289A1 Luminescent electroconductive adhesive |
| 12/27/2000 | EP0827627B1 A method of selectively metallising an inner, electrically insulating surface of an open body, and a scan velocity modulator manufactured using such a method |
| 12/27/2000 | EP0818061B1 Process for producing electrically conductive connecting structures |
| 12/27/2000 | CN2412293Y Doctor for fixing tin ball on chip |
| 12/27/2000 | CN1278369A Edge interface electrical connectors |
| 12/27/2000 | CN1277899A Soldering flux jetting device and soldering method therewith |
| 12/27/2000 | CN1060008C Printed board retaining structure |
| 12/27/2000 | CN1059982C Method for welding packaged integrated circuit plate |
| 12/27/2000 | CN1059913C Method of adhesion to a polymide surface by formation of covalent bonds |
| 12/26/2000 | US6167149 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| 12/26/2000 | US6166915 Electronic circuits and circuit boards |
| 12/26/2000 | US6166911 Semiconductor integrated circuit card assembly |
| 12/26/2000 | US6166711 Plasma addressed electro-optical display |
| 12/26/2000 | US6166620 Resistance wiring board and method for manufacturing the same |
| 12/26/2000 | US6166334 Plating process for fine pitch die in wafer form |
| 12/26/2000 | US6166333 Bumps with plural under-bump dielectric layers |
| 12/26/2000 | US6166328 Package stack via bottom leaded plastic (BLP) packaging |
| 12/26/2000 | US6166245 Meth(acrylate) functionality is separated from the half-ester linkage by at least two alkoxylate groups and at least one ring opened lactone or lactam group |
| 12/26/2000 | US6165912 Electroless metal deposition of electronic components in an enclosable vessel |
| 12/26/2000 | US6165911 Method of patterning a metal layer |
| 12/26/2000 | US6165892 Method of planarizing thin film layers deposited over a common circuit base |
| 12/26/2000 | US6165885 Method of making components with solder balls |
| 12/26/2000 | US6165820 Package for electronic devices |
| 12/26/2000 | US6165819 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
| 12/26/2000 | US6165817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections |
| 12/26/2000 | US6165659 Method of manufacturing ceramic electronic parts |
| 12/26/2000 | US6165658 Nonlinear image distortion correction in printed circuit board manufacturing |
| 12/26/2000 | US6165629 Compensator with metal layer having etched opening with knife edge configuration and conforming polymer coating; dimensional stability |
| 12/26/2000 | US6165617 Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| 12/26/2000 | US6165596 Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components |
| 12/26/2000 | US6165595 Component mounting board, process for producing the board, and process for producing the module |
| 12/26/2000 | US6165544 Method of exposure of photo-curing resin applied to printed circuit board |
| 12/26/2000 | US6165386 Conductive paste comprising photosetting resin and conductive powder containing both dendritic and scaly powders in specified weight ratio |
| 12/26/2000 | US6165330 Continuous plating apparatus |
| 12/26/2000 | US6165309 Method for improving the adhesion of metal films to polyphenylene ether resins |
| 12/26/2000 | US6165278 Providing substantially water free solution comprising alcohol and neutral ammonium salt of organic acid; immersing electronic card in water-free solution for predetermined period of time to remove thermal grease |
| 12/26/2000 | US6164993 Zero insertion force sockets using negative thermal expansion materials |
| 12/26/2000 | US6164984 Electrical connecting element |
| 12/26/2000 | US6164983 High density connector |
| 12/26/2000 | US6164979 System for providing a removable high density electrical interconnect for flexible circuits |
| 12/26/2000 | US6164634 Adjustable tooling pins |
| 12/26/2000 | US6164571 Recovery of precious metals from circuit boards |
| 12/26/2000 | US6164520 Robust thick film conductors |
| 12/26/2000 | US6164515 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same |
| 12/26/2000 | US6164357 Apparatus for manufacturing adhesive layer, apparatus for manufacturing double-sided substrate, and apparatus for manufacturing multi-layered substrate |
| 12/26/2000 | US6164160 Integrated solenoid circuit assembly |
| 12/26/2000 | US6163957 Multilayer laminated substrates with high density interconnects and methods of making the same |
| 12/21/2000 | WO2000078109A1 Improved bga solder ball shear strength |
| 12/21/2000 | WO2000078108A1 Mounting material, mounting circuit using it and printed wiring board using it |
| 12/21/2000 | WO2000078107A1 High density substrate and methods for manufacturing same |
| 12/21/2000 | WO2000078105A1 Multi-connection via |
| 12/21/2000 | WO2000078104A1 Split via surface mount connector and related techniques |
| 12/21/2000 | WO2000077907A1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 12/21/2000 | WO2000077883A1 Ablative method for forming rf ceramic block filters |
| 12/21/2000 | WO2000077881A1 Multilayer microwave couplers using vertically-connected stripline |
| 12/21/2000 | WO2000077854A1 Method for making all or part of an electronic device by material jet spraying |
| 12/21/2000 | WO2000077850A1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 12/21/2000 | WO2000077526A1 Wedge mount for integrated circuit sensors |
| 12/21/2000 | WO2000077278A1 Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover |
| 12/21/2000 | WO2000077116A1 Adhesive bonding laminates |
| 12/21/2000 | WO2000077112A1 Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part |
| 12/21/2000 | WO2000076770A2 Squeegee or sealing means |
| 12/21/2000 | WO2000076708A1 Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| 12/21/2000 | WO2000047025A3 Method for forming printed circuit board electrical interconnects |
| 12/21/2000 | DE19944518A1 Soldering integrated circuit or integrated circuit housing onto circuit board having conducting pathway uses lacquer or film mask with non-circular openings |
| 12/21/2000 | DE19927949A1 Kationisch härtende Masse, ihre Verwendung sowie Verfahren zur Herstellung gehärteter Polymermassen Cationic curing compound, use thereof and processes for the production of cured polymer masses |
| 12/21/2000 | DE19926746A1 Multiple arrangement of circuit boards fitted with LEDs has connecting elements with electrical wiring conductor(s) via which circuits on adjacent boards are electrically connected |
| 12/21/2000 | DE19925961A1 Verfahren zum Aushärten von thermisch aushärtbarem Unterfüllmaterial A method for curing thermally curable underfill material |
| 12/21/2000 | DE10009042A1 Sheet metal component for dual pattern conductor connection for PCB,has conducting, coupling, top regions, region to be soldered in one piece, and conducting region passes through connecting hole |
| 12/21/2000 | CA2375687A1 Multilayer microwave couplers using vertically-connected stripline |
| 12/21/2000 | CA2374863A1 High density substrate and methods for manufacturing same |
| 12/21/2000 | CA2312413A1 Cold cleaning microemulsion compositions |
| 12/20/2000 | EP1061785A2 High-density multi-layered printed wiring board having highly reliably through hole and method of producing said printed wiring board |