| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/09/2001 | US6172731 Display device including reinforcing plate between circuit substrate and display panel |
| 01/09/2001 | US6172730 Liquid crystal display apparatus having stepped section in glass substrate |
| 01/09/2001 | US6172480 Compact fast battery charger |
| 01/09/2001 | US6172331 Method and apparatus for laser drilling |
| 01/09/2001 | US6172330 Method and apparatus for forming a through hole in a ceramic green sheet |
| 01/09/2001 | US6172308 Terminal for circuit assembly having a cradle portion to prevent tottering of the terminal |
| 01/09/2001 | US6172307 Feedthrough via connection on solder resistant layer |
| 01/09/2001 | US6172306 Solder cracking resistant I/O pin connections |
| 01/09/2001 | US6172305 Multilayer circuit board |
| 01/09/2001 | US6172139 Carrier liquid, nonfibrillated fluoropolymer, and filler silica particles, glass beads or microspheres, glass fibers, titanium dioxide or barium titanate particles, of given maximum linear dimension; for casting electrical substrate |
| 01/09/2001 | US6171987 Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof |
| 01/09/2001 | US6171946 Pattern formation method for multi-layered electronic components |
| 01/09/2001 | US6171921 Method for forming a thick-film resistor and thick-film resistor formed thereby |
| 01/09/2001 | US6171714 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| 01/09/2001 | US6171514 Polishing method for planarizing a substrate |
| 01/09/2001 | US6171468 Electroconductive carbon coating on nonconductive surface |
| 01/09/2001 | US6171399 Apparatus and method for deposition of a viscious material on a substrate |
| 01/09/2001 | US6171151 Isolation module for RJ-45 modular jack |
| 01/09/2001 | US6171133 Contact-making device |
| 01/09/2001 | US6171116 Pin terminal alignment system |
| 01/09/2001 | US6171114 Low insertion force array connector for providing a removable high density electrical interconnect to a flexible circuit |
| 01/09/2001 | US6170760 Compact spray valve |
| 01/09/2001 | US6170737 Solder ball placement method |
| 01/09/2001 | US6170647 Conveyor and reflow device using the same |
| 01/09/2001 | US6170394 Method of preparing and using a plastic mask for paste printing |
| 01/09/2001 | US6170155 System of components to be hybridized and hybridization process allowing for thermal expansions |
| 01/09/2001 | CA2016529C Method of forming a pattern on a surface |
| 01/04/2001 | WO2001001740A1 Microfiber dielectrics which facilitate laser via drilling |
| 01/04/2001 | WO2001001739A1 Solder paste stenciling apparatus and method of use for rework |
| 01/04/2001 | WO2001001738A1 A printed circuit board |
| 01/04/2001 | WO2001001589A1 Radio apparatus unit and radio apparatus housing |
| 01/04/2001 | WO2001001487A1 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 01/04/2001 | WO2001001453A2 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |
| 01/04/2001 | WO2001001451A2 Microwave circuit packages having a reduced number of vias in the substrate |
| 01/04/2001 | WO2001001341A1 Support element for an integrated circuit module |
| 01/04/2001 | WO2001001199A1 Methods and materials for selective modification of photopatterned polymer films |
| 01/04/2001 | WO2001000911A1 Non-crimping polyester monofilament and process for producing same |
| 01/04/2001 | WO2001000659A1 Benzimidazolone peptidomimetics as thrombin receptor antagonists |
| 01/04/2001 | WO2001000508A1 Semiconductor package clad material and semiconductor package using the same |
| 01/04/2001 | DE19930782A1 Verfahren zum selektiven Beschichten keramischer Oberflächenbereiche A process for selectively coating ceramic surface regions |
| 01/04/2001 | DE19926941A1 Carrier material with conducting tracks and printed solder connections, has thickness of solder connection coating staged differently depending on solder connection cross-sectional area |
| 01/04/2001 | DE10029396A1 Electric circuit has circuit board inclined so power semiconducting component e.g. MOSFET, drops out if solder melts owing to heat generated by component, and stopper parts to stop component falling out |
| 01/04/2001 | CA2378282A1 Microfiber dielectrics which facilitate laser via drilling |
| 01/04/2001 | CA2378252A1 A printed circuit board |
| 01/03/2001 | EP1065916A2 Resin sealed electronic device |
| 01/03/2001 | EP1065915A2 Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part |
| 01/03/2001 | EP1065768A2 Connection structure for bus bars |
| 01/03/2001 | EP1065753A2 Multipole angled conductor device |
| 01/03/2001 | EP1065719A2 Power semiconductor mounting package containing ball grid array |
| 01/03/2001 | EP1065717A2 Multilayer circuit boards |
| 01/03/2001 | EP1065554A1 Liquid crystal display and manufacture thereof |
| 01/03/2001 | EP1064421A1 Base webs for printed circuit board production using the foam process and aramid fibers |
| 01/03/2001 | EP1064417A1 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 01/03/2001 | EP0876306B1 Method of applying a silver layer to a glass substrate |
| 01/03/2001 | CN1278874A Method for producing very small metal ball |
| 01/03/2001 | CN1278612A Low temperature metalization process of preparing thick film photoetching glue |
| 01/03/2001 | CN1060114C Method and device for placing film |
| 01/02/2001 | US6169663 Integrated circuit connection using an electrically conductive adhesive |
| 01/02/2001 | US6169605 Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
| 01/02/2001 | US6169530 Display apparatus and assembly of its driving circuit |
| 01/02/2001 | US6169354 Thin film electric motors |
| 01/02/2001 | US6169328 Semiconductor chip assembly |
| 01/02/2001 | US6169325 Semiconductor device |
| 01/02/2001 | US6169323 Semiconductor device with improved leads |
| 01/02/2001 | US6169254 Three axis sensor package on flexible substrate |
| 01/02/2001 | US6169253 Solder resist window configurations for solder paste overprinting |
| 01/02/2001 | US6169022 Method of forming projection electrodes |
| 01/02/2001 | US6168976 Socketable BGA package |
| 01/02/2001 | US6168971 Method of assembling thin film jumper connectors to a substrate |
| 01/02/2001 | US6168910 Charging a laser beam at the whole for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the edges and inside of the whole formed in resin layer of printed board |
| 01/02/2001 | US6168898 Positive acting photodielectric composition |
| 01/02/2001 | US6168854 Method of making a printed circuit board having a tin/lead coating |
| 01/02/2001 | US6168836 Process for plating upon a polymeric surface |
| 01/02/2001 | US6168725 Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates |
| 01/02/2001 | US6168703 Copper foil and laminate containing a hydrogen inhibitor |
| 01/02/2001 | US6168663 Thin sheet handling system cross-reference to related applications |
| 01/02/2001 | US6168454 Removable pin stabilizer and assembly |
| 01/02/2001 | US6168442 Anisotropic conductivity sheet with positioning portion |
| 01/02/2001 | US6168070 Method for soldering DPAK-type electronic components to circuit boards |
| 01/02/2001 | US6168068 Method for preventing a gold plate connector on a PCB from being contaminated |
| 01/02/2001 | US6168065 Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
| 01/02/2001 | US6168064 Method and apparatus for controlling a time/temperature profile of a reflow oven |
| 01/02/2001 | US6168063 Ultrasonic vibration bonding machine |
| 01/02/2001 | US6167615 Method for producing circuit board assemblies using surface mount components with finely spaced leads |
| 01/02/2001 | US6167614 Method of manufacturing and testing an electronic device, and an electronic device |
| 01/02/2001 | CA2297686A1 Multi-pole angle connecting device |
| 01/02/2001 | CA2169547C Multiple layer printed circuit boards and method of manufacture |
| 01/02/2001 | CA2128734C Process for preparing photohardenable elastomeric element having increased exposure latitude |
| 01/02/2001 | CA2111352C Electrical connectors |
| 12/28/2000 | WO2000079858A1 Tooling fixture |
| 12/28/2000 | WO2000079853A1 Process for connecting electroconducing tracks which are separated by a laminar insulating material and printed circuit obtained |
| 12/28/2000 | WO2000079852A1 Process for interconnecting predetermined points of two electroconducting layers which are separated by a laminar insulating material, and printed circuit board obtained |
| 12/28/2000 | WO2000079849A1 High performance ball grid array substrates |
| 12/28/2000 | WO2000079848A1 Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| 12/28/2000 | WO2000079847A1 Transition between asymmetric stripline and microstrip in cavity |
| 12/28/2000 | WO2000079846A1 Transition between symmetric stripline and asymmetric stripline |
| 12/28/2000 | WO2000079845A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 12/28/2000 | WO2000079638A1 Electrical transmission arrangement |
| 12/28/2000 | WO2000079637A1 Electrical transmission arrangement |
| 12/28/2000 | WO2000079590A1 Electronic device with flexible contacting points |