| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/17/2001 | EP1069617A2 Multilayer wiring board |
| 01/17/2001 | EP1069616A2 Multi-layer flexible printed wiring board |
| 01/17/2001 | EP1069607A2 Release member for use in producing a multi-layer package |
| 01/17/2001 | EP1069212A1 Electrochemical deposition for high aspect ratio structures using electrical pulse modulation |
| 01/17/2001 | EP1069210A1 Process for electrochemical deposition of high aspect ratio structures |
| 01/17/2001 | EP1069209A1 Process for plating plastics using a catalytic filler |
| 01/17/2001 | EP1068639A1 Wire bond attachment of a integrated circuit package to a heat sink |
| 01/17/2001 | EP1068626A1 Hybrid circuit arrangement with a thermal release |
| 01/17/2001 | EP1068277A1 Adhesive composition and precursor thereof |
| 01/17/2001 | EP1068029A1 Method and apparatus for two layered coating of copper foils with meltable coating |
| 01/17/2001 | EP0916237B1 Process for producing connecting conductors |
| 01/17/2001 | EP0800753A4 Microelectronic bonding with lead motion |
| 01/17/2001 | CN2415468Y Array connector |
| 01/17/2001 | CN1280718A Surface mount LC filter with polymer layers |
| 01/17/2001 | CN1280702A Microelectronic Component carrier and method of its manufacture |
| 01/17/2001 | CN1280455A Method for producing electronic device and electronic device and resin filling method |
| 01/17/2001 | CN1280370A Flexible wiring base unit and wiring board |
| 01/17/2001 | CN1280316A Explosure device for double side printed circuit board |
| 01/17/2001 | CN1280056A Multilager base plate |
| 01/16/2001 | US6175509 Space efficient local regulator for a microprocessor |
| 01/16/2001 | US6175508 Form factor-configured channel bank card containing form factor non-conformal printed circuit board |
| 01/16/2001 | US6175506 Multilayer printed circuit board |
| 01/16/2001 | US6175500 Surface mount thermal connections |
| 01/16/2001 | US6175480 Thermal trip arrangements |
| 01/16/2001 | US6175422 Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
| 01/16/2001 | US6175161 System and method for packaging integrated circuits |
| 01/16/2001 | US6175151 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
| 01/16/2001 | US6175088 Multi-layer printed-wiring boards with inner power and ground layers |
| 01/16/2001 | US6175087 Composite laminate circuit structure and method of forming the same |
| 01/16/2001 | US6175086 Method for mounting terminal on circuit board and circuit board |
| 01/16/2001 | US6175085 Solder mask configuration for a printed wiring board with improved breakdown voltage performance |
| 01/16/2001 | US6175084 Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
| 01/16/2001 | US6175077 Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same |
| 01/16/2001 | US6174647 Providing circuit layer comprising photoresist and via opening; roughening; adsorbing compound having ligand for palladium on photoresist; applying photoresist; catalyzing; metallized exposed palladium compound to form metal pad |
| 01/16/2001 | US6174606 Nitrogen-containing heterocycle such as benzotriazole on the conductive composite to reduce silver(ag) dissolution and ion mobility by forming a water insoluble complex with the ag ion; reduced electrochemical mobility of ag due to moisture |
| 01/16/2001 | US6174591 Separators with direct heating medium and method for manufacturing thermally curable laminates thereof |
| 01/16/2001 | US6174562 Manufacturing of solder stop in at least one through plated hole |
| 01/16/2001 | US6174561 Composition and method for priming substrate materials |
| 01/16/2001 | US6174462 Conductive paste composition including conductive metallic powder |
| 01/16/2001 | US6174418 Continuous plating apparatus |
| 01/16/2001 | US6174417 Electroplating machine |
| 01/16/2001 | US6174353 Alkali solution, a reducing agent and a complexing agent |
| 01/16/2001 | US6174344 Copper fine powder and method for preparing the same |
| 01/16/2001 | US6174271 High throughput hole forming system with multiple spindles per station |
| 01/16/2001 | US6174225 Dry ice pellet surface removal apparatus and method |
| 01/16/2001 | US6174113 Method and apparatus for machining a cavity in a smart card |
| 01/16/2001 | US6173887 Method of making electrically conductive contacts on substrates |
| 01/16/2001 | US6173883 Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium |
| 01/16/2001 | US6173490 Method for forming a panel of packaged integrated circuits |
| 01/16/2001 | US6173489 Organic substrate (PCB) slip plane “stress deflector” for flip chip devices |
| 01/16/2001 | CA2160501C Laminar stackable circuit board structure and manufacture |
| 01/14/2001 | CA2277686A1 An intrinsically safe universal switching power supply |
| 01/11/2001 | WO2001003479A1 Smd component with planar contact surfaces and method for producing planar surfaces for smd connecting legs |
| 01/11/2001 | WO2001003478A1 Printed wiring board and prepreg for printed wiring board |
| 01/11/2001 | WO2001003185A1 Method for making and testing electronic micromodules, in particular for chip cards |
| 01/11/2001 | WO2001003175A1 Electrical-mechanical connection between electronic circuit systems and substrates and method for the production thereof |
| 01/11/2001 | WO2001003174A1 Method for selectively coating ceramic surfaces |
| 01/11/2001 | WO2001002887A1 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 01/11/2001 | WO2001002622A2 Method of coating ceramics using ccvd |
| 01/11/2001 | WO2001002486A1 Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same |
| 01/11/2001 | WO2001002468A1 Composites of powdered fillers and polymer matrix and process for preparing them |
| 01/11/2001 | WO2001002454A1 Phenol-novolacs with improved optical properties |
| 01/11/2001 | WO2001002149A1 Method for making a dashboard subassembly in particular a motor vehicle dashboard console |
| 01/11/2001 | WO2001002123A1 Printhead for jetting a hot liquid medium and method of producing a joint that comprises a metallic solder |
| 01/11/2001 | WO2001002122A1 Print chip for a printing head working according to the ink printing principle |
| 01/11/2001 | WO2000055907A3 Compensation model and registration simulator apparatus and method for manufacturing of printed circuit boards |
| 01/11/2001 | DE19957517C1 Perforation method for ceramic green sheets e.g. for printed circuit board manufacture, has pressurized gas pulses directed onto surface of ceramic green sheet for removal of plug of ceramic material |
| 01/11/2001 | DE19938867C1 Blanking grid for forming metal conductor paths to electrical component of fully integrated circuits |
| 01/11/2001 | DE19934054C1 Reflow soldering procedure for joining of contact pads of electrical components to printed circuit board (PCB) pads |
| 01/11/2001 | DE19930639A1 Method to separate glass ceramic substrates for electronic circuits; involves holding substrate on support, guiding cutting wheel through slit in support to form score line and bending substrate |
| 01/11/2001 | DE19929179A1 Flexible circuit board manufacturing method |
| 01/11/2001 | DE19928576A1 Surface mount LED component with improved heat removal has leads fed towards mounting plane on outer surface of opposing sides, connected mounting surfaces partly in plane |
| 01/11/2001 | DE19928225A1 Process for increasing the gas permeability of ceramic bodies, especially silicon carbide setter plates, comprises treatment with a chemical reactive solution or a reactive gas |
| 01/11/2001 | DE19916467C1 Verfahren zur Herstellung von elektrisch leitenden Schichten an der Oberfläche von Kunststoff-Formteilen durch Laserenergie und damit hergestellter Gegenstand A process for producing electrically conductive layers on the surface of plastic molded parts by laser energy and thus good produced |
| 01/11/2001 | DE10031260A1 Waste disposal method involves reducing waste containing circuit boards to fragments, then sorting and separating circuit board fragments from rest of waste, and sorting iron magnetically |
| 01/11/2001 | CA2346238A1 Phenol-novolacs with improved optical properties |
| 01/10/2001 | EP1067830A1 A chemical solution treatment equipment |
| 01/10/2001 | EP1067603A2 Chip carrier |
| 01/10/2001 | EP1067601A1 Chip module, in particular BGA package, with chip carrier for stress free solder connection to printed wiring board |
| 01/10/2001 | EP1067598A1 Method of packaging semiconductor device using anisotropic conductive adhesive |
| 01/10/2001 | EP1067438A1 Exposure device for double-sided printed circuit boards |
| 01/10/2001 | EP1067436A1 Image forming composition, image recording material comprising the same, and process of image formation |
| 01/10/2001 | EP1066942A2 Heat-resistant thermally conductive silicone rubber composite sheet and method of producing the same |
| 01/10/2001 | EP1066932A2 Die structure |
| 01/10/2001 | EP1066740A1 Moulded part and flexible film with a protected printed conductor, and method for producing the same |
| 01/10/2001 | EP1066650A1 No clean flux for flip chip assembly |
| 01/10/2001 | EP1066209A1 Device for treating plate-shaped work pieces, especially printed-circuit boards |
| 01/10/2001 | CN2414586Y Screen printing machine for printing double-side circuit board |
| 01/10/2001 | CN2414585Y Noise silencer for multi-layer printed circuit board |
| 01/10/2001 | CN1279821A Stress relaxation electronic part, stress relaxation wiring board and stress relaxation electronic part mounted body |
| 01/10/2001 | CN1279635A Method for transferring a picture to a surface |
| 01/10/2001 | CN1279578A Surface mounted electronic elements |
| 01/10/2001 | CN1279577A Electronic device, dielectric filter, dielectric duplex device and manufacture of eletronic device |
| 01/10/2001 | CN1279533A Surface mounted RC device |
| 01/10/2001 | CN1279251A Semiconductor having themosetting dielectric material and manufacture thereof |
| 01/10/2001 | CN1279157A Multi-layer substrates |
| 01/10/2001 | CN1279153A Thermal pressing composite heat resistance pads |
| 01/09/2001 | US6172881 Method of interconnecting frame grounds in housing, and electronic equipment with structure interconnected by the method |
| 01/09/2001 | US6172879 BGA pin isolation and signal routing process |
| 01/09/2001 | US6172878 Multi-element module and production process thereof |