| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/30/2001 | US6179625 Removable interlockable first and second connectors having engaging flexible members and process of making same |
| 01/30/2001 | US6179200 Method for forming solder bumps of improved height and devices formed |
| 01/30/2001 | US6179198 Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps |
| 01/30/2001 | US6179196 Apparatus for manufacturing circuit boards |
| 01/30/2001 | US6178630 Conductive bonding design and method for aluminum backed circuits |
| 01/30/2001 | CA2222158C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 01/29/2001 | CA2314621A1 Process for obtaining a module including an inductive coil and associated module |
| 01/25/2001 | WO2001006821A1 Encapsulated packaging in between 2 pcbs |
| 01/25/2001 | WO2001006819A1 Optical radiation conducting zones and associated bonding and alignment systems |
| 01/25/2001 | WO2001006818A1 Circuitry with integrated passive components and method for producing same |
| 01/25/2001 | WO2001006631A1 An intrinsically safe universal switching power supply |
| 01/25/2001 | WO2001005602A1 Pc card and method for manufacturing the same |
| 01/25/2001 | WO2001005592A1 Improvements relating to screen printing |
| 01/25/2001 | WO2001005551A1 Excimer laser ablation process control of multilaminate materials |
| 01/25/2001 | WO2001005521A1 Device and method for mounting vibrator |
| 01/25/2001 | WO2001005518A1 Process for plating plastics using a catalytic filler |
| 01/25/2001 | WO2000068620A3 Fibrous supported polymer encapsulated electrical component |
| 01/25/2001 | DE19951916C1 Electronic control device for automobile door electrics has incorporated electronic circuit board for one variation of door electrics modified for different variation via circuit board contained in separate housing |
| 01/25/2001 | DE19940163A1 Strip conductor for microwave applications comprises dielectric made of a relaxed polymer film coated on one side with a self-adhering layer and arranged between a metallic base electrode and a metallic signal conductor |
| 01/25/2001 | DE19933727A1 Lead-free solder for circuit board manufacture has no environmentally harmful lead additives, and constituents have natural affinity for uniform distribution on pure copper |
| 01/25/2001 | DE19933395A1 Adjustment method for board manufacture, involves successively aligning conductor pattern and circuit board relative to each other taking account of first and then other position markers |
| 01/25/2001 | DE19931189A1 Verfahren zur Herstellung von Bauteilen mit darin angeordneten elektrischen Leiterbahnen sowie danach hergestellte Bauteile, insbesondere als Türmodule für Kraftfahrzeuge A process for the production of components having electrical conductor tracks arranged therein and thereafter made components, in particular as a door module for motor vehicles |
| 01/25/2001 | DE19931110A1 Druckkopf zum Ausspritzen eines heißen flüssigen Mediums und Verfahren zur Herstellung einer metallisches Lot umfassenden Verbindungsstelle Printhead for jetting a hot liquid medium and method for producing a metallic solder joint comprising |
| 01/25/2001 | DE19920399C1 Plastic card conductor wire formation method has conductor wires supported in required pattern in clamp frame before pressing into electrically insulating plastic card |
| 01/25/2001 | CA2379904A1 Improvements relating to screen printing |
| 01/24/2001 | EP1071162A1 Junction connector for wire harness |
| 01/24/2001 | EP1071142A2 Method of mounting leds on printed circuit boards |
| 01/24/2001 | EP1070927A2 Continuous dryer for plates or webs |
| 01/24/2001 | EP1070445A1 Hybrid circuit with contact surfaces (solder pads) |
| 01/24/2001 | EP1070444A1 Method and device for producing thin-layer structures |
| 01/24/2001 | EP1070443A1 Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards |
| 01/24/2001 | EP1070375A1 A closed box for electronics equipment |
| 01/24/2001 | EP1070329A1 Support for electronic components |
| 01/24/2001 | EP1070159A1 Electrodeposition of metals in small recesses using modulated electric fields |
| 01/24/2001 | EP1004141A4 A system and method for packaging integrated circuits |
| 01/24/2001 | EP0976309A4 Case for circuit boards |
| 01/24/2001 | EP0861136B1 Method and apparatus for dispensing small amounts of liquid material |
| 01/24/2001 | EP0753180B1 Method of manufacturing a chip card, and chip card thus produced |
| 01/24/2001 | CN1281630A Method of shielding printed board assembly with at least one component and shielding element for shielding components on such printed board assembly |
| 01/24/2001 | CN1281629A Method of manufacturing multilayer printed wiring board |
| 01/24/2001 | CN1281568A Method for making smart cards capable of operating with and without contact |
| 01/24/2001 | CN1281331A Multilayer ceramic supporting base with anchored welding pad |
| 01/24/2001 | CN1281256A Welding pad structure for semi-conductor package |
| 01/24/2001 | CN1281255A Semi conductor device and its manufacturing method |
| 01/24/2001 | CN1281020A Reaction-type flame-retarding adhesive for flexible PCB and its preparing process |
| 01/24/2001 | CN1281008A Thermosetting resin composition used in ink stocking method |
| 01/23/2001 | US6178262 Circle location |
| 01/23/2001 | US6178095 Structure for fixing an element to a printed wiring board, and electronic equipment having the structure |
| 01/23/2001 | US6178093 Information handling system with circuit assembly having holes filled with filler material |
| 01/23/2001 | US6177732 Multi-layer organic land grid array to minimize via inductance |
| 01/23/2001 | US6177729 Rolling ball connector |
| 01/23/2001 | US6177727 Saddle bracket for solid state pressure gauge |
| 01/23/2001 | US6177722 Leadless array package |
| 01/23/2001 | US6177632 Metal case for circuit board for horizontal or vertical mounting |
| 01/23/2001 | US6177490 Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof |
| 01/23/2001 | US6177357 Laminating a resist on a polymeric film, exposing a pattern into the resist, developing resist with a aqueous solution to form an image, etching portions of polymer film not covered by crosslinked resist with a base, then stripping the resist |
| 01/23/2001 | US6177296 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 01/23/2001 | US6177184 Method of making an interface layer for stacked lamination sizing and sintering |
| 01/23/2001 | US6177182 Useful in preparation of lithographic printing plates for computer-to-plate and digital-offset-press technologies; photoresist applications, to rapid prototyping of printed circuit boards and to chemical sensor development |
| 01/23/2001 | US6176996 Tin alloy plating compositions |
| 01/23/2001 | US6176995 Improving the transfer of materials at the surface of the material for treatment consists in generating a large flow of electrolyte at the treatment point by means of rotating electrodes which move synchronously |
| 01/23/2001 | US6176985 Laminated electroplating rack and connection system for optimized plating |
| 01/23/2001 | US6176724 PC card adapter |
| 01/23/2001 | US6176709 Socket and adapter integrated circuit, and integrated circuit assembly |
| 01/23/2001 | US6176706 Subminiature lamp for indication light |
| 01/23/2001 | US6176286 Film applying apparatus |
| 01/23/2001 | US6176179 Screen printer and a screen printing method |
| 01/23/2001 | US6176010 Method for making printed circuits and resulting printed circuit |
| 01/23/2001 | US6176008 Jig for mounting fine metal balls |
| 01/23/2001 | CA2164190C Process for manufacture by endothermic heating of plastic laminates in a continuous band pressed in cycles |
| 01/18/2001 | WO2001005204A1 Method of manufacturing printed-circuit board |
| 01/18/2001 | WO2001005203A1 Underfilling material for semiconductor package |
| 01/18/2001 | WO2001005202A1 Noise suppressor unit |
| 01/18/2001 | WO2001005201A1 Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus |
| 01/18/2001 | WO2001005200A2 Printed circuit fabrication |
| 01/18/2001 | WO2001004988A1 Antenna for contactless cards, hybrid cards and electronic labels |
| 01/18/2001 | WO2001004711A1 A circuit production method |
| 01/18/2001 | WO2001004698A1 Laser for laser machining |
| 01/18/2001 | WO2001004656A1 Multi-axis magnetic field sensing device and methods for fabricating the same |
| 01/18/2001 | WO2001004643A2 Wafer-level burn-in and test cartridge and methods |
| 01/18/2001 | WO2001004641A2 Wafer level burn-in and electrical test system and method |
| 01/18/2001 | WO2001004567A2 Method and apparatus for three dimensional inspection of electronic components |
| 01/18/2001 | WO2001004228A1 Pressure-sensitive adhesive film being easy to peel |
| 01/18/2001 | WO2001004194A1 Method of, and material for, improving thermal conductivity |
| 01/18/2001 | WO2001003856A1 Method of forming a thin metal layer on an insulating substrate |
| 01/18/2001 | DE19933516A1 Soldering apparatus for circuit boards, controls spraying of flux from spray head so that it only reaches circuit boards |
| 01/18/2001 | DE19933083A1 Process for nickel plating copper-plated objects, e.g., circuit boards, comprises initially applying a copper layer to the object, activating the copper layer by applying a thin tin layer, and applying a nickel layer to the copper layer |
| 01/18/2001 | DE19930996A1 SMD-Bauteil mit planaren Kontaktflächen und Verfahren zur Erzeugung planarer Flächen für SMD-Anschlußbeine SMD component with planar contact surfaces and methods for generating planar surfaces for SMD terminal legs |
| 01/18/2001 | DE19929912A1 Trägerelement für einen IC-Baustein A carrier element for an IC module |
| 01/18/2001 | DE19929754A1 Verguß eines Schaltungsaufbaus mit vibrationsdämpfender Einbettungsmasse Casting a circuit construction with vibration damping embedding compound |
| 01/18/2001 | DE19929209A1 Electronic control device for car brake antiblocking systems, comprises carrier in which control connector is fitted and metallic cooling component soldered under it on further side from carrier and encapsulated in plastic |
| 01/18/2001 | DE10034351A1 Mehrstufiger Kontaktaufbau und Verfahren zur Herstellung von dicht gepackten Anschlüssen bei magnetischen Aufzeichnungsköpfen A multi-stage contact structure and method for the production of densely packed connections in magnetic recording heads |
| 01/18/2001 | DE10029025A1 Integrated circuit socket e.g. for ball grid array device, has upper contact pins which are displaceable and mechanically biased to extend beyond upper surface of base |
| 01/18/2001 | DE10025619A1 Fluidmesser Fluid knife |
| 01/17/2001 | EP1069811A2 Multi-layer wiring board and method for manufacturing the same |
| 01/17/2001 | EP1069810A1 Printed circuit with at least one electronic component and method for connecting them |
| 01/17/2001 | EP1069656A2 Electrical connector assembly |
| 01/17/2001 | EP1069655A2 Electrical connector system with cross-talk compensation |
| 01/17/2001 | EP1069651A1 Metal terminal |
| 01/17/2001 | EP1069650A1 Metal terminal |