Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2001
02/06/2001US6184464 Protective containment apparatus for potted electronic circuits
02/06/2001US6184140 Methods of making microelectronic packages utilizing coining
02/06/2001US6184133 Method of forming an assembly board with insulator filled through holes
02/06/2001US6184065 Photolithographically patterned spring contact
02/06/2001US6184062 Process for forming cone shaped solder for chip interconnection
02/06/2001US6184061 Electrode of semiconductor device, method of manufacturing thereof, and the semicondutor device
02/06/2001US6183934 Negative photosensitive resin composition, method of forming a pattern and electronic parts
02/06/2001US6183880 Composite foil of aluminum and copper
02/06/2001US6183875 Composite material which is prepared by directly solidifying molten aluminum or aluminum alloy on at least portion of ceramic substrate
02/06/2001US6183839 Stencil for depositing and portioning variously thick spot layers of viscous material and method
02/06/2001US6183588 Process for transferring a thin-film structure to a substrate
02/06/2001US6183272 Compressible elastomeric contact and mechanical assembly therewith
02/06/2001US6183267 Ultra-miniature electrical contacts and method of manufacture
02/06/2001US6183190 Method of stacking packs of printed circuit boards and relative pack loading and unloading device for a machine tool
02/06/2001US6182884 Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards
02/06/2001US6182883 Method and apparatus for precisely registering solder paste in a printed circuit board repair operation
02/06/2001US6182359 Manufacturing process for printed circuits
02/06/2001US6182358 Process for producing a metal-ceramic substrate
02/06/2001US6182357 Method and apparatus for dicing electronic substrate
02/06/2001US6182356 Apparatus for solder ball mold loading
02/02/2001CA2314734A1 Method for attaching an antenna to a circuit board and article produced thereby
02/02/2001CA2314049A1 Method for forming an electrical conductive pattern on a substrate
02/01/2001WO2001008458A1 Via-on-via structure of wiring board
02/01/2001WO2001008457A1 Method of manufacturing wiring board
02/01/2001WO2001008267A1 Contact element for press-fitting into a printed circuit board hole
02/01/2001WO2001008219A1 Semiconductor module
02/01/2001WO2001008187A1 Reconfiguragle multichip module stack interface
02/01/2001WO2001008177A1 Method of manufacturing ceramic electronic components
02/01/2001WO2001007964A1 Laser for laser machining
02/01/2001WO2001007963A1 Laser for laser machining
02/01/2001WO2001007851A1 Acoustic and vibrational energy for assisted cleaning and drying of solder stencils and electronic modules
02/01/2001WO2001007257A1 Method and apparatus for dispensing viscous material
02/01/2001WO2001007256A1 Method and apparatus for dispensing viscous material
02/01/2001WO2001007255A1 Solder-paste printing device and printing method
02/01/2001WO2001007254A1 Method and apparatus for dispensing viscous material
02/01/2001WO2001007195A1 Method of producing microbore holes
02/01/2001WO2001007192A1 Method and apparatus for dispensing viscous material
02/01/2001DE19936198A1 Leiterplatte Circuit board
02/01/2001DE19934487A1 Durchlauftrockner für Platten oder Bahnen Continuous dryers for plates and sheets
02/01/2001DE19932600A1 Embossed products fabrication method, for electric drive motor cable harness, involves treating metal foil band on one side to provide cauliflower structure for coating with black oxide layer
02/01/2001DE19931004A1 Chipmodul, insbesondere BGA-Package, mit einem Interconnect zur stressfreien Lötverbindung mit einer Leiterplatte Chip module, in particular BGA package, with an interconnect for stress-free soldered to a circuit board
02/01/2001DE19913904C1 Process for sealing ducts on connecting elements of a base body against liquids and gases, for soldered components, includes a sealing compound
02/01/2001DE10036934A1 Mother-board as backplane e.g. for 32-bit or 64-bit microcomputer, has several connector elements installed on plate carrying the bus-line
02/01/2001CA2380106A1 Method and apparatus for dispensing viscous material
01/2001
01/31/2001EP1073322A1 A method of extending life expectancy of surface mount components
01/31/2001EP1073321A2 Processing method of printed wiring board
01/31/2001EP1073319A2 Substrate material for wiring and substrate material for printed circuit using the same
01/31/2001EP1073111A2 Method and apparatus for forming a solder bump
01/31/2001EP1073072A1 Method of making a module with an inductive winding and corresponding module
01/31/2001EP1073068A1 Ptc thermistor chip
01/31/2001EP1072664A1 Adhesive sheets
01/31/2001EP1072433A1 Stencil mask for paste screening
01/31/2001EP1072390A1 Vacuum film laminating apparatus
01/31/2001EP1072176A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
01/31/2001EP1072058A2 Device for electronic packaging, pin jig fixture
01/31/2001EP1046093A4 An improved power contact for testing a power delivery system
01/31/2001EP0857085A4 Circuit board screener spot suppressor
01/31/2001EP0855037A4 Loaded board drop pin fixture
01/31/2001CN1282503A Hybrid circuit with heat dissipation system
01/31/2001CN1282286A Pb-free solder-connected structure and electronic device
01/31/2001CN1282203A Printed-wiring board processing method
01/31/2001CN1282202A Engraving method of circuit board and its equipment
01/31/2001CN1282124A Connector for printed wiring board
01/31/2001CN1282122A Electric connector and manufacturing method threrof
01/31/2001CN1282084A Electronic component with external terminal electrode and its manufacturing method
01/31/2001CN1281754A Coating method and device for flate-plate coated material
01/31/2001CN1061299C Single side metalfoil-cladding laminated board
01/30/2001US6181950 Radiotelephones with coplanar antenna connectors and related assembly methods
01/30/2001US6181571 Printed-wiring board and electronic device having the same wiring board
01/30/2001US6181569 Low cost chip size package and method of fabricating the same
01/30/2001US6181567 Method and apparatus for securing an electronic package to a circuit board
01/30/2001US6181562 Device and method for mounting electronic components on printed circuit boards
01/30/2001US6181551 Pin soldering enhancement and method
01/30/2001US6181544 Ceramic electronic component
01/30/2001US6181526 Suspension with flexible circuit welded thereto via metal pads
01/30/2001US6181404 Apparatus and method for mounting a liquid crystal display (LCD) assembly onto a printed circuit board
01/30/2001US6181278 Antenna-integral high frequency circuit electromagnetically coupling feeder circuit connected to high frequency circuit to microstrip antenna via slot coupling hole
01/30/2001US6181219 Printed circuit board and method for fabricating such board
01/30/2001US6181033 Printed circuit assembly for a dynamoelectric machine
01/30/2001US6180962 Chip type semiconductor light emitting device having a solder preventive portion
01/30/2001US6180912 Fan-out beams for repairing an open defect
01/30/2001US6180876 Apparatus and method for RF shielding of a printed circuit board
01/30/2001US6180504 Method for fabricating a semiconductor component with external polymer support layer
01/30/2001US6180261 On which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an ni--fe-based alloy foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin
01/30/2001US6180226 Method of forming a monolayer of particles, and products formed thereby
01/30/2001US6180221 Conductive elastomer for grafting to thermoplastic and thermoset substrates
01/30/2001US6180215 Phenolic resin-laminated paper
01/30/2001US6180171 Method of producing a plated product having recesses
01/30/2001US6180055 Copper, nickel, tin alloy
01/30/2001US6180045 Method of forming an overmolded electronic assembly
01/30/2001US6180009 For reuse; ultrafiltration, reverse osmosis, pervaporization,distillation
01/30/2001US6179990 Laminate electrically coupled to a negative terminal of the power supply, conductive anode electrically coupled to a positive terminal of the power supply, turning on the power, immersing the cfc laminate in acid
01/30/2001US6179984 Circuit arrangement for supplying pulse current to electrolytic cells connected in parallel; method is used for electroplating of printed circuit boards in vertical dipping systems and in vertical and horizontal feed through systems
01/30/2001US6179954 Apparatus and method for etching printed circuit board
01/30/2001US6179947 Method for manufacturing laminates
01/30/2001US6179927 Decontamination of electronic cards from copper salts
01/30/2001US6179645 High density electrical connector adaptable to the wires of different diameters and the method of making the same
01/30/2001US6179632 Electrical connector
01/30/2001US6179631 Electrical contact for a printed circuit board
01/30/2001US6179628 Electric connection box