| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/13/2001 | US6188582 Flexible interconnection between integrated circuit chip and substrate or printed circuit board |
| 02/13/2001 | US6188579 Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage |
| 02/13/2001 | US6188578 Integrated circuit package with multiple heat dissipation paths |
| 02/13/2001 | US6188565 Multilayer capacitor |
| 02/13/2001 | US6188391 Two-layer capacitive touchpad and method of making same |
| 02/13/2001 | US6188305 Transformer formed in conjunction with printed circuit board |
| 02/13/2001 | US6188299 Dielectric filter and method of manufacturing the same |
| 02/13/2001 | US6188133 Semiconductor with plurality of connecting parts arranged on lower surface of a substrate |
| 02/13/2001 | US6188126 Vertical interconnect process for silicon segments |
| 02/13/2001 | US6188052 Matrix-inductor soldering apparatus and device |
| 02/13/2001 | US6188028 Multilayer structure with interlocking protrusions |
| 02/13/2001 | US6188027 Protection of a plated through hole from chemical attack |
| 02/13/2001 | US6188021 Package stack via bottom leaded plastic (BLP) packaging |
| 02/13/2001 | US6187886 Maleimide containing formulations and uses therefor |
| 02/13/2001 | US6187874 Comprising, as a resin component, two polyimide resins different in glass transition temperature by at least 20 degrees c from each other, and an epoxy resin |
| 02/13/2001 | US6187652 Method of fabrication of multiple-layer high density substrate |
| 02/13/2001 | US6187614 Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| 02/13/2001 | US6187610 Flexible thin film ball grid array containing solder mask |
| 02/13/2001 | US6187452 Ultrathin stainless steel foil |
| 02/13/2001 | US6187418 Multilayer ceramic substrate with anchored pad |
| 02/13/2001 | US6187417 Substrate having high optical contrast and method of making same |
| 02/13/2001 | US6187372 Method for producing large area thick film resistors with uniform thickness |
| 02/13/2001 | US6187114 Solder material and electronic part using the same |
| 02/13/2001 | US6186842 Revenue meter bayonet assembly and method of attachment |
| 02/13/2001 | US6186800 Circuit board grounding and support structure |
| 02/13/2001 | US6186392 Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls |
| 02/13/2001 | US6186390 Solder material and method of manufacturing solder material |
| 02/13/2001 | US6186389 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| 02/13/2001 | US6186388 Soldering |
| 02/13/2001 | US6186316 Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems |
| 02/13/2001 | US6186216 Cast column grid array extraction apparatus and method |
| 02/13/2001 | US6186063 Screen printing machine with improved device for aspirating excess ink |
| 02/13/2001 | US6185973 Rolling mill for metal foil |
| 02/08/2001 | WO2001010178A1 Production method of wiring board and wiring board |
| 02/08/2001 | WO2001010177A1 A circuit singulation system and method |
| 02/08/2001 | WO2001010000A1 Universal energy conditioning interposer with circuit architecture |
| 02/08/2001 | WO2001009980A2 Controlled compliance fine pitch interconnect |
| 02/08/2001 | WO2001009952A2 Interconnect assemblies and methods |
| 02/08/2001 | WO2001009944A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 02/08/2001 | WO2001009682A2 Positive acting photoresist composition and imageable element |
| 02/08/2001 | WO2001009262A1 Method of producing a laminated structure |
| 02/08/2001 | WO2001009226A1 Impregnated glass fiber strands and products including the same |
| 02/08/2001 | WO2001009060A1 Paste for screenprinting electric structures onto carrier substrates |
| 02/08/2001 | WO2001009054A1 Impregnated glass fiber strands and products including the same |
| 02/08/2001 | WO2000075396B1 Electroless coatings formed from organic solvents |
| 02/08/2001 | DE19961187C1 Radio telephone screening profile manufacturing and fitting method has housing component held in contact with mould filled with screening material paste during hardening of latter |
| 02/08/2001 | DE19937843C1 Verfahren zur Herstellung einer selbsttragenden Kupferfolie A process for producing a self-supporting copper foil |
| 02/08/2001 | DE19936594A1 Verfahren zur Herstellung von hochreinen stabilisierten Hydroxylaminlösungen A process for producing high-purity stabilized hydroxylamine |
| 02/08/2001 | DE19935677A1 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten Paste for screen printing of electrical structures to support substrates |
| 02/08/2001 | DE19934709A1 Kontaktelement zum Einpressen in ein Loch einer Leiterplatte Contact element for pressing into a hole of a printed circuit board |
| 02/08/2001 | DE19934205A1 Manufacture of laboratory circuit boards, involves applying conducting tracks on flexible bearer material using ink jet printing, and then chemically connected electrically conducting component |
| 02/08/2001 | DE19907295C1 Electronic and/or optical component mounting method for rear side of flexible printed circuit board has molded material used for encasing components on front side of circuit board before inversion of latter |
| 02/08/2001 | DE10036701A1 Pressure control apparatus for a brake system |
| 02/07/2001 | EP1075172A1 Multilayer printed wiring board having filled-via structure |
| 02/07/2001 | EP1075171A1 Circuit board |
| 02/07/2001 | EP1075170A1 Method for attaching an antenna socket to a circuit board and article produced thereby |
| 02/07/2001 | EP1075169A1 Method for producing components with electrical conductor tracks arranged in them and components produced by this method, in particular as door modules for motor vehicles |
| 02/07/2001 | EP1075076A1 Brush holder plate for an electric motor, method for producing this plate and module for a motor fan unit using such plate |
| 02/07/2001 | EP1075026A2 Multilayer circuit board layout |
| 02/07/2001 | EP1075012A2 Fuse device |
| 02/07/2001 | EP1074889A2 Thermal treatment of imagable coatings |
| 02/07/2001 | EP1074888A1 Aqueous photosolder resist composition |
| 02/07/2001 | EP1074844A2 Testing integrated circuits |
| 02/07/2001 | EP1074369A1 Method for manufacturing highly stressed composite pieces |
| 02/07/2001 | EP1074355A2 Multiaxis punching device |
| 02/07/2001 | EP1074069A1 Simplified microelectronic connector and method of manufacturing |
| 02/07/2001 | EP1074043A1 Process for ashing organic materials from substrates |
| 02/07/2001 | EP1073781A1 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 02/07/2001 | EP1073539A1 Lead-free solder alloy powder paste use in pcb production |
| 02/07/2001 | CN2418648Y Co-axal plastic-conductive armoured heating cable |
| 02/07/2001 | CN1283380A Multilayer printed wiring board |
| 02/07/2001 | CN1283144A Component of printed circuit boards |
| 02/07/2001 | CN1283138A Improved miniature surface mount capacitor and method of making the same |
| 02/07/2001 | CN1283079A Screened cover and electronic device using said cover |
| 02/07/2001 | CN1282953A Circuit base plate for preventing destruction by electrostatic field and magnetic head using said circuit base plate |
| 02/07/2001 | CN1282770A Adhesive coating |
| 02/07/2001 | CN1282645A Nickel alloy film used for reducting the formation of compound between metals in soldering flux |
| 02/07/2001 | CN1282643A Welding method |
| 02/07/2001 | CA2314813A1 Apparatus monitoring the deposition of a liquid-to-pasty medium on a substrate |
| 02/06/2001 | US6185354 Printed circuit board having integral waveguide |
| 02/06/2001 | US6185105 Discharge structure of printed circuit board |
| 02/06/2001 | US6185101 Electronic circuit apparatus and method for assembling the same |
| 02/06/2001 | US6185088 Cardiac rhythm management system having multi-capacitor module |
| 02/06/2001 | US6184965 Circuit connection structure |
| 02/06/2001 | US6184872 Coordinate data input device and method of fabricating the same |
| 02/06/2001 | US6184736 Sinusoidal radio-frequency clock distribution system for synchronization of a computer system |
| 02/06/2001 | US6184699 Photolithographically patterned spring contact |
| 02/06/2001 | US6184697 Semiconductor integrated circuit testing apparatus with reduced installation area |
| 02/06/2001 | US6184658 Battery pack protective circuit with external terminals on opposite side of part mounting surface of circuit board |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/06/2001 | US6184586 Semiconductor device including a ball grid array |
| 02/06/2001 | US6184581 Solder bump input/output pad for a surface mount circuit device |
| 02/06/2001 | US6184577 Electronic component parts device |
| 02/06/2001 | US6184494 Printed circuit board having a heating element and heating method thereof |
| 02/06/2001 | US6184490 Material irradiation apparatus with a beam source that produces a processing beam for a workpiece, and a process for operation thereof |
| 02/06/2001 | US6184479 Multilayer printed circuit board having a concave metal portion |
| 02/06/2001 | US6184478 Printed wiring device with base layer having a grid pattern |
| 02/06/2001 | US6184477 Multi-layer circuit substrate having orthogonal grid ground and power planes |
| 02/06/2001 | US6184476 Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone |
| 02/06/2001 | US6184475 Lead-free solder composition with Bi, In and Sn |