Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2001
02/24/2001CA2316532A1 Bare ic chip for multichip module, multichip module, electronic equipment and method for producing multichip module
02/22/2001WO2001013688A1 Method and apparatus for manufacturing multilayer printed wiring board
02/22/2001WO2001013687A1 Method for assembling electronic components on a support and resulting device
02/22/2001WO2001013686A1 Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device
02/22/2001WO2001013685A1 Stamped grid
02/22/2001WO2001013405A1 Ion reflectron comprising a flexible printed circuit board
02/22/2001WO2001012880A2 Method for the production of a self-supporting copper foil
02/22/2001WO2001012874A1 Surface preparation of a substrate for thin film metallization
02/22/2001WO2001012702A1 Impregnated glass fiber strands and products including the same
02/22/2001WO2001012701A1 Impregnated glass fiber strands and products including the same
02/22/2001WO2001012433A2 Nanostructure coatings
02/22/2001WO2000076770A3 Squeegee or sealing means
02/22/2001WO1999064195A3 Curved ceramic moulded part
02/22/2001DE19939770A1 Mounting active or passive electrical components on circuit board by aligning with previously assembled component section
02/22/2001DE10040143A1 Resonator for band-pass filter has two similar conductor patterns facing each other on two dielectric substrates joined by adhesive layer
02/22/2001CA2381959A1 Ion reflectron comprising a flexible printed circuit board
02/22/2001CA2381171A1 Impregnated glass fiber strands and products including the same
02/21/2001EP1077482A2 Semiconductor contacting device
02/21/2001EP1077381A2 Probe card and method of testing wafer having a plurality of semiconductor devices
02/21/2001EP1076927A1 Method for mechanically tuning a voltage controlled oscillator
02/21/2001EP0988029A4 Device and methods for wound treatment
02/21/2001CN2420247Y Switching device between PC plate slope and translation transport table
02/21/2001CN1285035A Method and apparatus for measuring positioning error using index mark, and machining apparatus that corrects error based on measured result
02/21/2001CN1284835A Multi-layer printed circuit board
02/21/2001CN1284789A Electronic element with conductor and lead terminal
02/21/2001CN1284746A Electronic Package for electronic element and manufacturing method thereof
02/21/2001CN1062366C Welding structure of magnetic hand and its production method
02/20/2001US6192509 Method and apparatus for automatically removing acid traps from a hatched fill in a printed circuit board design
02/20/2001US6191955 Encapsulation and enclosure of electronic modules
02/20/2001US6191954 Controlled low impedance high current circuit board interconnect
02/20/2001US6191934 High dielectric constant embedded capacitors
02/20/2001US6191933 Ceramic capacitor
02/20/2001US6191838 Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electro-optical device
02/20/2001US6191506 Method of manufacturing a dynamoelectric machine
02/20/2001US6191494 Semiconductor device and method of producing the same
02/20/2001US6191493 Resin seal semiconductor package and manufacturing method of the same
02/20/2001US6191486 Technique for producing interconnecting conductive links
02/20/2001US6191474 Vertically mountable interposer assembly and method
02/20/2001US6191370 Ball grid array semiconductor package and method of fabricating the same
02/20/2001US6191369 Printed circuit board having a marker trace for component alignment
02/20/2001US6191367 Wiring construction body with conductive lines in a resin binder
02/20/2001US6191366 Board for IC card having component mounting recess
02/20/2001US6191022 Fine pitch solder sphere placement
02/20/2001US6190997 Device for mechanically aligning a carrier substrate for electronic circuits
02/20/2001US6190941 Method of fabricating a circuit arrangement with thermal vias
02/20/2001US6190940 Flip chip assembly of semiconductor IC chips
02/20/2001US6190834 First resin being an epoxy resin, and a second epoxy resin having an n-substituted carbamic acid ester group and a radical polymeric unsaturated bond in its side chain
02/20/2001US6190833 Radiation-sensitive resin composition
02/20/2001US6190823 Diazo-containing photosensitive material
02/20/2001US6190759 Electronic package comprising dielectric layer and conductive layer, said dielectric layer including reinforcing material, resin material selected from epoxy, cyanate and bismaleimide resins, coloring agent, and fluorescing agent
02/20/2001US6190734 Immersing metal surface in alcoholic solution consisting essentially of an alcohol, a compound of the azole family in the quantity of 0.005 to 3 mol/liter and about 0.1 to 0.3 vol % surfactant, rinsing, drying in nitrogen atmosphere
02/20/2001US6190731 Method for isolating ultrafine and fine particles and resulting particles
02/20/2001US6190578 Comprising copper alloy powders having specified oxygen content range, wherein a copper oxide and/or a copper hydroxide exists on the surfaces of the particles, and an organic binder; use in panels of liquid crystal displays
02/20/2001US6190509 Blend of dielectric and electroconductive particles; applying electromagnetic waves
02/20/2001US6190493 Thin-film multilayer wiring board and production thereof
02/20/2001US6190477 Method and apparatus for preparing a release layer of ceramic particulates
02/20/2001US6190214 Conforming press-fit contact pin for printed circuit board
02/20/2001US6190213 Contact element support in particular for a thin smart card connector
02/20/2001US6189772 Method of forming a solder ball
02/20/2001US6189771 Method of forming solder bump and method of mounting the same
02/20/2001US6189767 Method of securing an electric contact to a ceramic layer as well as a resistance element thus manufactured
02/20/2001US6189448 Dual image stencil apparatus having stencil including sections with curled edges
02/20/2001US6189210 Fixture for clamping the leads of a circuit component for soldering
02/20/2001US6189203 Method of manufacturing a surface mountable power supply module
02/20/2001US6189201 Method of tuning a high frequency printed resonance circuit
02/15/2001WO2001011932A1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
02/15/2001WO2001011931A1 Arrangement and method for connecting in orthogonal position an auxiliary board to a double face or multilayer printed circuit base board
02/15/2001WO2001011676A2 Sputtering process
02/15/2001WO2001011662A2 Vapor phase connection techniques
02/15/2001WO2001011426A1 Method of forming a masking pattern on a surface
02/15/2001WO2001011104A1 Ion beam processing of a substrate
02/15/2001WO2001010777A1 Method for preparing highly stabilised hydroxylamine solutions
02/15/2001WO2001010594A1 Device for treating a substrate with laser radiation
02/15/2001WO2001010572A1 Diffusion barrier and adhesive for parmod application to rigi d printed wiring boards
02/15/2001WO2000052982A3 Multifonctional laminate structure and process
02/15/2001DE19955603C1 Integrated control device for motor vehicle especially for automatic transmission
02/15/2001DE19939347C1 Chip card manufacture, of e.g. credit cards or admission cards, which allows for fitting with displays or keys, involves laminating circuit board with several perforated layers and machining cut-outs
02/15/2001DE19937284A1 Electrically conducting multi layered structure comprises a first layer made of a metal material, especially chromium and a second layer made of gold or gold alloy applied on the first layer by PVD
02/15/2001DE19937267A1 Vorrichtung zur Behandlung eines Substrates mittels Laserstrahlung An apparatus for treating a substrate by means of laser radiation
02/15/2001DE19738118C2 Montageverfahren für ein Halbleiterbauelement A mounting method of a semiconductor device
02/15/2001DE10037183A1 Process for joining circuit boards comprises overlapping the connecting surface of the first board with the connecting surface of the second board to form a connecting section and heating
02/15/2001DE10035638A1 Manufacture of electrically conductive circuit pattern on substrate e.g. for inductive heating element, by cutting conductive material and covering layer and coating with insulating layer
02/15/2001DE10032253A1 Heat resistance cushioning material used in fancy plywood, has adhesive sheets adhered on both sides in half cured state and coarse cloth stuck on adhesive sheets
02/15/2001CA2381199A1 Sputtering process
02/15/2001CA2380826A1 Method for preparing highly stabilised hydroxylamine solutions
02/15/2001CA2375365A1 Method of forming a masking pattern on a surface
02/14/2001EP1076480A2 Mask-printing method and mask-printing apparatus
02/14/2001EP1076479A1 Integrated sensor/controller assembly and method of manufacturing same
02/14/2001EP1076082A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
02/14/2001EP1075783A1 Air-wound coil for vacuum pick-up, surface mounting, and adjusting
02/14/2001EP1075782A1 Adapted electrically conductive layer
02/14/2001EP0864119B1 Photosensitive composition
02/14/2001EP0747507B1 Pretreatment solution for electroless plating, electroless plating bath and electroless plating method
02/14/2001EP0723736B1 Bonding inner layers in printed circuit board manufacture
02/14/2001CN2419790Y Transferring structure for X-ray PCB drill
02/14/2001CN2419789Y X-ray generator installating structure for PCB drill
02/14/2001CN1284159A Improved chemical drying and cleaning system
02/14/2001CN1283954A Printed circuit board and mask of screen printing such printed circuit bard
02/14/2001CN1283549A Composite laminated plate and its mfg process
02/13/2001US6188583 Contact bridge arrangement for conductively interconnecting circuit boards