| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/06/2001 | US6196876 Assembly of shielded connectors and a board having plated holes |
| 03/06/2001 | US6196871 Method for adjusting differential thermal expansion between an electrical socket and a circuit board |
| 03/06/2001 | US6196852 Contact arrangement |
| 03/06/2001 | US6196444 Method and apparatus for soldering ball grid array modules to substrates |
| 03/06/2001 | US6196443 Pb-In-Sn tall C-4 for fatigue enhancement |
| 03/06/2001 | US6196096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 03/06/2001 | US6195883 Full additive process with filled plated through holes |
| 03/06/2001 | US6195882 Method for producing printed wiring boards |
| 03/06/2001 | US6195881 Multiple coated substrates |
| 03/06/2001 | US6195879 Method for mounting wire-wound component on a printed circuit board |
| 03/01/2001 | WO2001015505A1 Wiring-connecting material and process for producing circuit board with the same |
| 03/01/2001 | WO2001015504A1 Method for making hybrid smart cards and smart cards obtained by said method |
| 03/01/2001 | WO2001015503A1 Component for assembly on a printed circuit board |
| 03/01/2001 | WO2001015502A1 Printed circuit substrate with controlled placement covercoat layer |
| 03/01/2001 | WO2001015501A1 Printed circuit substrate with photoimageable covercoat layer |
| 03/01/2001 | WO2001015500A1 Copper-clad plate and laser machining for copper-clad plate |
| 03/01/2001 | WO2001015498A1 Bidirectional interface tool for pwb development |
| 03/01/2001 | WO2001015228A1 Wiring board, method of manufacturing wiring board, electronic device, method of manufacturing electronic device, circuit board and electronic apparatus |
| 03/01/2001 | WO2001015179A1 Method and device for insulating electro-technical components |
| 03/01/2001 | WO2001015074A1 Method for producing a chip card and chip card produced according to said method |
| 03/01/2001 | WO2001014612A1 Process for selective deposition of copper substrates |
| 03/01/2001 | WO2001014484A1 Adhesive agent, method for connecting wiring terminals and wiring structure |
| 03/01/2001 | WO2001014463A1 Etchant composition for polyimide resin and method of etching |
| 03/01/2001 | WO2001014190A1 Electrical contact between actuators or sensors and the contacts of a circuit carrier and braking pressure regulator or active suspension or damping system and housing for said brake pressure regulator or active suspension or damping system |
| 03/01/2001 | WO2001014135A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/01/2001 | WO2001014096A1 Multiple ultraviolet beam solid-state laser systems and methods |
| 03/01/2001 | WO2001014093A1 Solder ball delivery and reflow apparatus and method of using the same |
| 03/01/2001 | WO2000074023A8 Electrical connection structure and flat display device |
| 03/01/2001 | DE19941352A1 Kombiinstrument Instrument cluster |
| 03/01/2001 | DE19940847A1 Selbstklebender Verbund Self-adhesive composite |
| 03/01/2001 | DE19937387C1 Vorrichtung zur Überwachung eines Auftrags eines flüssigen bis pastenförmigen Mediums auf ein Substrat Apparatus for monitoring the deposition of a liquid-to-pasty medium on a substrate |
| 03/01/2001 | DE19933975A1 Stamped-grid-type electronically commutated electric motor e.g. for motor vehicle applications, uses stamped-grid structure for retaining and electrically-contacting the electrical |
| 03/01/2001 | CA2387985A1 Component for assembly on a printed circuit board |
| 02/28/2001 | EP1079677A2 Ultrasonic manufacturing apparatus, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| 02/28/2001 | EP1079676A2 Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards |
| 02/28/2001 | EP1079673A2 Surface mount circuit assembly |
| 02/28/2001 | EP1079476A2 Method of mounting an electric part on a circuit board |
| 02/28/2001 | EP1079467A1 Component for mounting on a circuit board |
| 02/28/2001 | EP1079432A1 Electronic module and method of manufacturing such a module |
| 02/28/2001 | EP1079427A2 Encapsulated electronic part and method of fabricating thereof |
| 02/28/2001 | EP1079397A1 Method of making an electroconductive pattern on a support |
| 02/28/2001 | EP1079379A2 Optical pickup having circuit pattern formed by mid technique on main insulative base |
| 02/28/2001 | EP1079357A1 Display panel |
| 02/28/2001 | EP1079203A1 Capacitive monitoring of the application of an adhesive on a substrate with complex permittivity |
| 02/28/2001 | EP1078776A1 Self-adhesive composite |
| 02/28/2001 | EP1078758A2 Substrate unit for liquid discharging head, method for producting the same, liquid discharging head, cartridge, and image forming apparatus |
| 02/28/2001 | EP1078735A2 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board |
| 02/28/2001 | EP1078734A2 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board |
| 02/28/2001 | EP1078721A2 Method for punching brittle material and punching die to be used therefor |
| 02/28/2001 | EP1078426A1 Display device |
| 02/28/2001 | EP1078398A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
| 02/28/2001 | EP1078012A1 Composition and method for producing polythioethers having pendent methyl chains |
| 02/28/2001 | EP1077836A1 Electric junction box for an automotive vehicle |
| 02/28/2001 | CN1286013A Method of manufacturing multilayer wiring boards |
| 02/28/2001 | CN1285968A An improved connector scheme for power pod power delivery system |
| 02/28/2001 | CN1285631A Electronic assembly and plug |
| 02/28/2001 | CN1285628A Electric connector and method of making same |
| 02/28/2001 | CN1285619A Electronic parts and making method thereof |
| 02/28/2001 | CN1285615A Probe card for testing semiconductor chip with many semiconductor device and method thereof |
| 02/28/2001 | CN1285614A Method for preparation of printed IC board |
| 02/27/2001 | US6195613 Method and system for measuring equivalent series resistance of capacitors and method for decoupling power distribution systems |
| 02/27/2001 | US6195264 Laminate substrate having joining layer of photoimageable material |
| 02/27/2001 | US6195257 Apparatus and method of adapting a rectifier module to enhance cooling |
| 02/27/2001 | US6195256 Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink |
| 02/27/2001 | US6195248 Comprising tin and at least one additive metal selected from the group consisting of bismuth, nickel, silver, zinc, and cobalt; lead-free; capacitors |
| 02/27/2001 | US6195244 Electronic circuit with a screening case to attenuate high-frequency interference |
| 02/27/2001 | US6195148 Structure of liquid crystal display device for easy assembly and easy disassembly |
| 02/27/2001 | US6194990 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 02/27/2001 | US6194906 Inspection adapter board for printed board, method for inspecting printed board, and method and apparatus for producing information for fabricating the inspection adapter board |
| 02/27/2001 | US6194788 Flip chip with integrated flux and underfill |
| 02/27/2001 | US6194785 Method for circuitizing through-holes by photo-activated seeding |
| 02/27/2001 | US6194782 Mechanically-stabilized area-array device package |
| 02/27/2001 | US6194777 Leadframes with selective palladium plating |
| 02/27/2001 | US6194668 Multi-layer circuit board |
| 02/27/2001 | US6194667 Receptor pad structure for chip carriers |
| 02/27/2001 | US6194656 Mounting structure for a relay arranged on a printed circuit board |
| 02/27/2001 | US6194523 Comprising polyesterpolyurethane and an epoxy resin |
| 02/27/2001 | US6194492 Anisotropic conductive film |
| 02/27/2001 | US6194291 Microelectronic assemblies with multiple leads |
| 02/27/2001 | US6194247 Warp-resistent ultra-thin integrated circuit package fabrication method |
| 02/27/2001 | US6194127 Resistive sheet patterning process and product thereof |
| 02/27/2001 | US6194119 Thermal transfer donor element with light to heat conversion layer, interlayer, and thermal transfer layer including release layer, cathode layer, light emitting polymer layer, small molecule hole transport layer and anode layer |
| 02/27/2001 | US6194085 Optical color tracer identifier in metal paste that bleed to greensheet |
| 02/27/2001 | US6194076 Method of forming adherent metal components on a polyimide substrate |
| 02/27/2001 | US6194053 Apparatus and method fabricating buried and flat metal features |
| 02/27/2001 | US6194024 Connecting two circuit carriers; filling hole with solder sphere |
| 02/27/2001 | US6193911 Combustion chemical vapor deposition (ccvd) solution in which is dissolved an additive which forms an electroconductivity adjusting metal oxide in the resulting thin film resistor |
| 02/27/2001 | US6193910 Paste for through-hole filling and printed wiring board using the same |
| 02/27/2001 | US6193899 System and method for optically aligning films and substrates used in printed circuit boards |
| 02/27/2001 | US6193863 Product conveyance mechanism for electroplating apparatus |
| 02/27/2001 | US6193789 Electroless copper plating solution and method for electroless copper plating |
| 02/27/2001 | US6193762 Surface for use on an implantable device |
| 02/27/2001 | US6193568 Mid connector with extending solder creeping paths |
| 02/27/2001 | US6193564 Electric connecting configuration |
| 02/27/2001 | US6193144 Paste providing method, soldering method and apparatus and system therefor |
| 02/27/2001 | US6193143 Solder bump forming method and mounting apparatus and mounting method of solder ball |
| 02/27/2001 | US6192599 Drying process for woven fabric intended for use as a reinforcing laminate in printed circuit boards |
| 02/27/2001 | US6192581 Method of making printed circuit board |
| 02/27/2001 | US6192580 Method of making laminate printed circuit board with leads for plating |
| 02/27/2001 | US6192563 Apparatus having improved cycle time for removing a PC board from a panel |