| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/13/2001 | US6201215 Method of making a thick film low value high frequency inductor |
| 03/13/2001 | US6201213 Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering |
| 03/13/2001 | US6201194 Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric |
| 03/13/2001 | US6201193 Printed circuit board having a positioning marks for mounting at least one electronic part |
| 03/13/2001 | US6201185 Substrate for mounting electronic part having conductive projections and process for manufacturing the same |
| 03/13/2001 | US6201094 Phenol-novolacs with improved optical properties |
| 03/13/2001 | US6200829 Microelectronic assembly with connection to a buried electrical element, and method for forming same |
| 03/13/2001 | US6200733 Photosensitive composition for sandblasting and photosensitive film comprising the same |
| 03/13/2001 | US6200632 Methods and apparatus for applying liquid fluoropolymer solutions to substrates |
| 03/13/2001 | US6200630 Producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
| 03/13/2001 | US6200451 Method for enhancing the solderability of a surface |
| 03/13/2001 | US6200405 Method of manufacturing laminated ceramic electronic parts |
| 03/13/2001 | US6200392 Sheet cleaning apparatus with cartridge roller assembly and method of use |
| 03/13/2001 | US6200146 Right angle connector |
| 03/13/2001 | US6200143 Low insertion force connector for microelectronic elements |
| 03/13/2001 | US6200074 Method for drilling circuit boards |
| 03/13/2001 | US6200073 Combination chamfering and milling tool |
| 03/13/2001 | US6199751 Polymer with transient liquid phase bondable particles |
| 03/13/2001 | US6199741 Enhanced pad design for substrate |
| 03/13/2001 | US6199464 Method and apparatus for cutting a substrate |
| 03/13/2001 | US6199290 Method and apparatus for automatic loading and registration of PCBs |
| 03/13/2001 | US6199273 Method of forming connector structure for a ball-grid array |
| 03/13/2001 | US6199243 Device for cleaning screen plate used in screen printing |
| 03/08/2001 | WO2001017327A1 Low cost conformal emi/rfi shield |
| 03/08/2001 | WO2001017324A1 Bottom or top jumpered foldable electronic assembly, and method for manufacture |
| 03/08/2001 | WO2001017323A1 Method and article for the connection and repair of flex and other circuits |
| 03/08/2001 | WO2001017322A1 Multi-connectable printed circuit board |
| 03/08/2001 | WO2001017321A1 Flex circuit having repairable connector tail |
| 03/08/2001 | WO2001017320A1 Current carrying structure using voltage switchable dielectric material |
| 03/08/2001 | WO2001017069A1 Control device and soldering method |
| 03/08/2001 | WO2001017011A2 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 03/08/2001 | WO2001016876A2 Chip card and a method for producing a chip card |
| 03/08/2001 | WO2001016864A1 Carrier element for an electronic media apparatus |
| 03/08/2001 | WO2001016643A1 Connector arrangement |
| 03/08/2001 | WO2001016402A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 03/08/2001 | WO2001015896A1 Releasing laminated film |
| 03/08/2001 | WO2000033089A3 Lithographic contact elements |
| 03/08/2001 | DE19942631A1 Verfahren zum Bestücken einer Leiterplatte A method of assembling a printed circuit board |
| 03/08/2001 | DE19942579A1 Koaxial-Steckverbinder Coaxial connector |
| 03/08/2001 | DE19942028A1 Soldering method for circuit board components uses solder mixture which is free of environmental pollutant materials and corresponding solder stop |
| 03/08/2001 | DE19941637A1 Chipkarte und Verfahren zur Herstellung einer Chipkarte Chip card and method for manufacturing a smart card |
| 03/08/2001 | DE19940480A1 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte Conductor carrier layer for Einlaminierung in a smart card, chip card having a conductor carrier layer and method for manufacturing a smart card |
| 03/08/2001 | DE19939760A1 Verfahren und Vorrichtung zur Isolierung elektrotechnischer Bauteile Method and device for isolating electrical components |
| 03/08/2001 | DE19625139C2 Verfahren zur Erzeugung von Lothügeln auf einem Substrat A process for the production of solder bumps on a substrate |
| 03/08/2001 | DE10042344A1 Printed circuit board has conductive elements fitted in openings in insulation layer for providing connections between electrode layers on opposite sides of insulation layer |
| 03/08/2001 | DE10036976A1 Bonding thermoplastic resin material to a substrate, in particular for connecting rigid and flexible circuit boards, involves heating the resin, substrate and film between them to create a low modulus interface |
| 03/08/2001 | DE10034840A1 Flux transfer apparatus for wafer, has drive unit which is controlled to rotate transfer pin within horizontal surface during flux transfer |
| 03/08/2001 | DE10033984A1 Hybridlaminat und Verfahren zur Herstellung desselben Hybrid laminate and method of manufacturing the same |
| 03/07/2001 | EP1081992A2 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
| 03/07/2001 | EP1081991A2 Flexible wiring board, electro-optical device and electronic equipment |
| 03/07/2001 | EP1081990A2 A method for forming a solder ball |
| 03/07/2001 | EP1081989A2 High frequency wiring board and its connecting structure |
| 03/07/2001 | EP1081251A1 Electrodeposited precious metal finishes having wear resistant particles therein |
| 03/07/2001 | EP1081201A1 Sealing material composition for cards and process for producing cards using the composition |
| 03/07/2001 | EP1080977A2 Combined instrument |
| 03/07/2001 | EP1080889A2 Method and apparatus fpr controlling pressure applied to printing material |
| 03/07/2001 | EP1080823A2 High-strength solder joint |
| 03/07/2001 | EP1080787A2 Method and apparatus for measuring and adjusting a liquid spray pattern |
| 03/07/2001 | EP1080616A1 Method for improving the manufacturing safety of weld joints |
| 03/07/2001 | EP1080615A1 Multiple printed panel for electronics components, and method for constructing bumps, soldering frames, spacers and similar on said multiple printed panel. |
| 03/07/2001 | EP1080603A1 Apparatus having an electroacoustic transducer mounted on a p.c. board with the aid of a holding means |
| 03/07/2001 | EP1080497A1 Display device |
| 03/07/2001 | EP1080252A1 Method for electro copperplating substrates |
| 03/07/2001 | EP1080247A2 Method for producing metallized substrate materials |
| 03/07/2001 | EP1080244A1 Anti-adherent coating and method for the production thereof |
| 03/07/2001 | CN2422792Y Soldering tin stove |
| 03/07/2001 | CN2422732Y High density electric connector |
| 03/07/2001 | CN1286763A Diazo-contg. photosensitive meterial |
| 03/07/2001 | CN1286734A Printed circuit mfg. process using tin-mickel plating |
| 03/07/2001 | CN1286701A Phenol-novolacs with improved optical properties |
| 03/07/2001 | CN1286655A Unleaded solder powder and production method therefor |
| 03/07/2001 | CN1286591A Method for mfg. flexible base board, and flexible base board |
| 03/07/2001 | CN1286496A Substrate provided with spherical grate array type circuit portion, and installation method therefor |
| 03/07/2001 | CN1286412A Liquid crystal device and electronic machine |
| 03/07/2001 | CN1286283A Antirust precoating paint for printed circuit board |
| 03/07/2001 | CN1286145A Method and device for coating with paste |
| 03/06/2001 | US6198634 Electronic package with stacked connections |
| 03/06/2001 | US6198619 Capacitor network |
| 03/06/2001 | US6198525 System for contact imaging both sides of a substrate |
| 03/06/2001 | US6198519 Liquid crystal display panels including alignment patterns and related methods |
| 03/06/2001 | US6198393 Foil/ink composite inductor |
| 03/06/2001 | US6198362 Printed circuit board with capacitors connected between ground layer and power layer patterns |
| 03/06/2001 | US6198184 Brushless motor |
| 03/06/2001 | US6198172 Semiconductor chip package |
| 03/06/2001 | US6198166 Power semiconductor mounting package containing ball grid array |
| 03/06/2001 | US6198161 Semiconductor device |
| 03/06/2001 | US6198067 Plasma processing device for circuit supports |
| 03/06/2001 | US6198052 Circuit board with terminal accommodating level differences |
| 03/06/2001 | US6198044 Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained |
| 03/06/2001 | US6197664 Method for electroplating vias or through holes in substrates having conductors on both sides |
| 03/06/2001 | US6197452 Prevents an exposure failure in a wiring pattern element of small dimensions |
| 03/06/2001 | US6197435 Substrate |
| 03/06/2001 | US6197433 Rolled copper foil for flexible printed circuit and method of manufacturing the same |
| 03/06/2001 | US6197425 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
| 03/06/2001 | US6197407 Circuit board and method of manufacturing the same |
| 03/06/2001 | US6197222 Lead free conductive composites for electrical interconnections |
| 03/06/2001 | US6197208 Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid |
| 03/06/2001 | US6197181 Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
| 03/06/2001 | US6197149 Providing resin varnish containing electrical insulating whiskers, adding ion absorbent or organic reagent for preventing injury from copper to resin varnish |
| 03/06/2001 | US6197145 Method of laminating a flexible circuit to a substrate |