| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/21/2001 | EP0976010A4 Waterborne photoresists made from urethane acrylates |
| 03/21/2001 | CN1288591A Semiconductor device and method of prodn. thereof and semiconductor mounting structure and method |
| 03/21/2001 | CN1288481A Curable epoxy-based compositions |
| 03/21/2001 | CN1288171A composite and flexible circuit distributing plate, and it mfg method, photo electrc device, electronic device |
| 03/21/2001 | CN1288164A Method for mfg. resonance label, and the reconance label |
| 03/20/2001 | US6205364 Method and apparatus for registration control during processing of a workpiece particularly during producing images on substrates in preparing printed circuit boards |
| 03/20/2001 | US6205032 Low temperature co-fired ceramic with improved registration |
| 03/20/2001 | US6204558 Two ball bump |
| 03/20/2001 | US6204554 Surface mount semiconductor package |
| 03/20/2001 | US6204552 Semiconductor device |
| 03/20/2001 | US6204490 Method and apparatus of manufacturing an electronic circuit board |
| 03/20/2001 | US6204480 Vacuum deposition of bus bars onto conductive transparent films |
| 03/20/2001 | US6204471 Parts soldering apparatus and method |
| 03/20/2001 | US6204456 Filling open through holes in a multilayer board |
| 03/20/2001 | US6204455 Microelectronic component mounting with deformable shell terminals |
| 03/20/2001 | US6204454 Wiring board and process for the production thereof |
| 03/20/2001 | US6204453 Two signal one power plane circuit board |
| 03/20/2001 | US6204356 Polybenzoxazole resin and precursor thereof |
| 03/20/2001 | US6204299 Foaming agents used to prepare closed cell polyurethane foams |
| 03/20/2001 | US6203967 Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 03/20/2001 | US6203952 Articles such as radio frequency identification tags; absence of heat distortion, debris, photoresis, undercut image |
| 03/20/2001 | US6203929 Gold plated solder material and method of fluxless soldering using solder |
| 03/20/2001 | US6203926 Corrosion resistant multilayer metal structure with cushionsand diffusion barriers then gold layer and encapsulation |
| 03/20/2001 | US6203912 Thin film of triazine fluoropolymers by trimerization of cyano groups with fluoropolymers |
| 03/20/2001 | US6203891 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| 03/20/2001 | US6203691 Electrolytic cleaning of conductive bodies |
| 03/20/2001 | US6203685 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 03/20/2001 | US6203684 Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates |
| 03/20/2001 | US6203655 Thin electronic circuit component and method and apparatus for producing the same |
| 03/20/2001 | US6203652 Method of forming a via in a substrate |
| 03/20/2001 | US6203406 Aerosol surface processing |
| 03/20/2001 | US6203386 Terminal blades mounted on flexible substrates |
| 03/20/2001 | US6203356 Device and method for protecting pins of an electrical component |
| 03/20/2001 | US6202918 Method and apparatus for placing conductive preforms |
| 03/20/2001 | US6202917 Co-processing of adhesive curing and solder reflow in an electronic assembly operation |
| 03/20/2001 | US6202916 Method of wave soldering thin laminate circuit boards |
| 03/20/2001 | US6202551 Screen printing apparatus |
| 03/20/2001 | US6202297 Socket for engaging bump leads on a microelectronic device and methods therefor |
| 03/20/2001 | CA2243253C Organic solderability preservative compositions |
| 03/20/2001 | CA2083340C Efficient conductor routing for inkjet printhead |
| 03/15/2001 | WO2001019149A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 03/15/2001 | WO2001019148A1 Printed wiring board and method of producing the same |
| 03/15/2001 | WO2001019147A1 Method of forming transferable printed pattern, and glass with printed pattern |
| 03/15/2001 | WO2001019146A1 Method for treating multiple-layer substrates |
| 03/15/2001 | WO2001018748A1 Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
| 03/15/2001 | WO2001018600A1 Vacuum copier |
| 03/15/2001 | WO2001018553A1 Conductive contact |
| 03/15/2001 | DE19954973A1 Process for applying conducting pathways to plastic surfaces, e.g. in vehicles comprises applying a melt acting in the cold state as conducting pathways onto the plastic surface, and applying an insulating material to the melt |
| 03/15/2001 | DE19943388A1 Vorrichtung zum Prüfen von Leiterplatten An apparatus for testing printed circuit boards |
| 03/15/2001 | DE19936013A1 Manufacturing method for circuit boards and electronic components fixture devices, involves breaking out part of circuit board provided with nominal rupture point before breakout |
| 03/15/2001 | DE19930190A1 Soldering process comprises applying a solder metal and/or solder metal alloy and a solder paste containing metallic grains onto the metal parts to be joined, and heating to form an intermetallic phase |
| 03/15/2001 | DE10039392A1 Multilayered conductor printed circuit board used in IC's and LSI's comprises bulk layers laminated on the upper and lower sides of a power source layer having wiring via first insulating material layers |
| 03/15/2001 | DE10036086A1 Elektrische Verbindung von Aktuatoren oder Sensoren mit Kontakten eines Schaltungsträgers und Bremsdruckregelvorrichtung oder aktives Feder-oder Dämpfungssystem sowie Gehäuse für die Bremsdruckregelvorrichtung oder das aktive Feder -oder Dämpfungssystem Electrical connection of sensors or actuators with contacts of a circuit carrier and brake pressure control device or an active or spring-damping system and housing for the braking pressure control device or the active damping system spring -or- |
| 03/14/2001 | EP1083779A1 Printed circuit board and method of production thereof |
| 03/14/2001 | EP1083778A1 Process for mounting components on a printed circuit board |
| 03/14/2001 | EP1083633A2 Connecting terminal for a flat circuit |
| 03/14/2001 | EP1083630A1 Coaxial plug connector |
| 03/14/2001 | EP1083594A2 Fired body for and manufacture of a substrate |
| 03/14/2001 | EP1083578A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| 03/14/2001 | EP1083434A2 Apparatus for testing printed circuit boards |
| 03/14/2001 | EP1083249A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 03/14/2001 | EP1083248A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use therof |
| 03/14/2001 | EP1083245A2 Fluid delivery systems for electronic device manufacture |
| 03/14/2001 | EP1082884A1 Method for producing wirings having solder bumps |
| 03/14/2001 | EP1082883A1 Apparatus and method for drilling microvia holes in electrical circuit interconnection packages |
| 03/14/2001 | EP1082882A1 Method of manufacturing resistors |
| 03/14/2001 | EP1082783A1 Double adherent electrically conductive tape |
| 03/14/2001 | EP1082777A1 Wideband rf port structure using coplanar waveguide and bga i/o |
| 03/14/2001 | EP1082765A1 Opto-electronic element |
| 03/14/2001 | EP1082734A1 Transformer bobbin |
| 03/14/2001 | EP1082732A1 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 03/14/2001 | EP1082471A1 Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer |
| 03/14/2001 | EP0799558B1 Method for depositing a protective coating on the components of an electronic board |
| 03/14/2001 | CN1287771A Manufacturing method of wiring circuit board, and wiring circuit board |
| 03/14/2001 | CN1287687A Semiconductor device and manufacturing method thereof, semiconductor module, circuit board and electronic equipment |
| 03/14/2001 | CN1287686A Method of manufacturing a multi-layered ceramic substrate |
| 03/14/2001 | CN1287672A Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and ceramic electronic part |
| 03/14/2001 | CN1287517A Apparatus and method for inerting a wave soldering installation |
| 03/14/2001 | CN1287471A Element mounting base plate and its producing method |
| 03/14/2001 | CN1287470A Equipment capable of forming homogenous etching liquid film |
| 03/14/2001 | CN1287469A Electro-deposition copper foil through surface processing and its producing method and use |
| 03/14/2001 | CN1287382A Semiconductor apparatus and its mounting structure |
| 03/14/2001 | CN1287285A Flexible wiring base plate, electrooptical apparatus and electronic apparatus |
| 03/14/2001 | CN1287159A Micro-emulsion cold-cleaning composition |
| 03/14/2001 | CN1287139A Sealing material composition for cards and process for producing cards therewith |
| 03/14/2001 | CN1287045A Cutting blade |
| 03/14/2001 | CN1287035A High-strength welding head |
| 03/14/2001 | CN1287025A Coating method for resin type protection composition, glue spreader using the same method and the same composition |
| 03/14/2001 | CN1063269C Single-group spectral imaging liquid soldering inhibitor and its producing process |
| 03/13/2001 | US6201908 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 03/13/2001 | US6201707 Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate |
| 03/13/2001 | US6201706 Power supply device with externally disconnectable “Y” capacitors |
| 03/13/2001 | US6201701 Integrated substrate with enhanced thermal characteristics |
| 03/13/2001 | US6201689 Electronic appliance |
| 03/13/2001 | US6201683 Ceramic electronic part and mounting structure for the same |
| 03/13/2001 | US6201682 Thin-film component |
| 03/13/2001 | US6201667 Magnetic disk drive having a relaying flexible printed circuit sheet |
| 03/13/2001 | US6201304 Flip chip adaptor package for bare die |
| 03/13/2001 | US6201300 Printed circuit board with thermal conductive structure |
| 03/13/2001 | US6201286 Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same |