| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/28/2001 | EP1087261A1 Photosensitive resin composition, multilayer printed wiring board and process for production thereof |
| 03/28/2001 | EP1086814A2 Inkjet recording head and method for manufacturing same |
| 03/28/2001 | EP1086337A1 Control and signaling device or signaling device with a luminous element |
| 03/28/2001 | CN2425066Y Overlapping device for copper sheet clamped steel plate |
| 03/28/2001 | CN2425065Y Automatic clamp-on or-off device for use on PC board ultraviolet/infrared drying conveyer bench |
| 03/28/2001 | CN1289453A Anisotropic conductor film, semiconductor chip, and method of packaging |
| 03/28/2001 | CN1289452A Process for ashing organic materials from substrates |
| 03/28/2001 | CN1289376A Process for method plating liquid crystalline polymers and compositions related thereto |
| 03/28/2001 | CN1289352A Adhesive composition and precursor thereof |
| 03/28/2001 | CN1289273A A method of forming a coating onto a non-random monolayer of particles, and products formed thereby |
| 03/28/2001 | CN1289226A Method for mfg. of laminated circuit assembly and products thereof |
| 03/28/2001 | CN1289225A Electro-deposition copper foil through surface-processing, its mfg. method and use thereof |
| 03/28/2001 | CN1288813A Heat-resisting lining pad for formation squeeze |
| 03/28/2001 | CN1288795A Method and apparatus for recovering solder materials |
| 03/28/2001 | CN1063859C 磁头单元 Head unit |
| 03/28/2001 | CN1063701C Terminal plate resin die casting method for die-casting motor and apparatus thereof |
| 03/27/2001 | US6208525 Process for mounting electronic device and semiconductor device |
| 03/27/2001 | US6208524 Electronic apparatus, battery powerable apparatus, and radio frequency communication device |
| 03/27/2001 | US6208501 Standing axial-leaded surface mount capacitor |
| 03/27/2001 | US6208234 Resistors for electronic packaging |
| 03/27/2001 | US6208225 Filter structures for integrated circuit interfaces |
| 03/27/2001 | US6208220 Multilayer microwave couplers using vertically-connected transmission line structures |
| 03/27/2001 | US6208156 Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems |
| 03/27/2001 | US6208078 Display device and display device assembly |
| 03/27/2001 | US6208031 Circuit fabrication using a particle filled adhesive |
| 03/27/2001 | US6208025 Microelectronic component with rigid interposer |
| 03/27/2001 | US6208023 Lead frame for use with an RF powered semiconductor |
| 03/27/2001 | US6208022 Electronic-circuit assembly |
| 03/27/2001 | US6207906 PCB having holes between terminals and method of making the same |
| 03/27/2001 | US6207550 Method for fabricating bump electrodes with a leveling step for uniform heights |
| 03/27/2001 | US6207522 Formation of thin film capacitors |
| 03/27/2001 | US6207476 Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
| 03/27/2001 | US6207354 Method of making an organic chip carrier package |
| 03/27/2001 | US6207351 Method for pattern seeding and plating of high density printed circuit boards |
| 03/27/2001 | US6207350 Corrosion inhibitor for NiCu for high performance writers |
| 03/27/2001 | US6207346 Waterborne photoresists made from urethane acrylates |
| 03/27/2001 | US6207345 Laminate film and processes for preparing printed wiring board |
| 03/27/2001 | US6207330 Formation of punch inspection masks and other devices using a laser |
| 03/27/2001 | US6207298 Connector surface-treated with a Sn-Ni alloy |
| 03/27/2001 | US6207268 A transfer sheet suitable for forming high-precision patterns for layers such as electrode layers, dielectric or barrier layers in plasma display panels; ink layer consists an glass frit, and a thermoplastic resin |
| 03/27/2001 | US6207265 Non-ionic circuit board masking agent |
| 03/27/2001 | US6207259 Wiring board |
| 03/27/2001 | US6207234 Via formation for multilayer inductive devices and other devices |
| 03/27/2001 | US6207221 Applying copper foil using direct copper bonding process to one side of ceramic layer as first metal coating, forming second coating by applying conductor paste which contains metal of second metal coating, binder, glass, drying, firing |
| 03/27/2001 | US6207220 Dual track stencil/screen printer |
| 03/27/2001 | US6207003 Fabrication of structure having structural layers and layers of controllable electrical or magnetic properties |
| 03/27/2001 | US6206708 Through via plate electrical connector and method of manufacture thereof |
| 03/27/2001 | US6206706 Electrical connector |
| 03/27/2001 | US6206507 Printer |
| 03/27/2001 | US6206272 Alignment weight for floating field pin design |
| 03/27/2001 | US6206267 Full coverage thermal couple |
| 03/27/2001 | US6206265 Temperature control method of solder bumps in reflow furnace, and reflow furnace |
| 03/27/2001 | US6205925 Method for screen position correcting in screen printing |
| 03/27/2001 | US6205660 Method of making an electronic contact |
| 03/27/2001 | US6205656 Automated application of photovoltaic cells to printed circuit boards |
| 03/27/2001 | US6205647 Method of making a surface mountable electronic device |
| 03/27/2001 | US6205646 Method for air-wound coil vacuum pick-up, surface mounting, and adjusting |
| 03/27/2001 | CA2216683C Metal powder and process for preparing the same |
| 03/23/2001 | CA2320412A1 Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same |
| 03/22/2001 | WO2001020957A1 Laminated reflow soldering |
| 03/22/2001 | WO2001020956A1 Method of manufacturing printed-circuit board and method of manufacturing recording device |
| 03/22/2001 | WO2001020955A1 A printed circuit board assembly |
| 03/22/2001 | WO2001020954A1 Method for the production of printed circuit boards from a copper-coated dielectric sheet |
| 03/22/2001 | WO2001020737A1 Component alignment casing system |
| 03/22/2001 | WO2001020660A1 Method of mounting optical and electrical devices, and mounting structure |
| 03/22/2001 | WO2001020623A1 Capacitor component |
| 03/22/2001 | WO2001020619A2 Electrical devices and process for making such devices |
| 03/22/2001 | WO2001020255A1 Device for inspecting a three-dimensional surface structure |
| 03/22/2001 | WO2001020059A2 Method for producing a conductor pattern on a dielectric substrate |
| 03/22/2001 | WO2001019607A1 An adhesion promoting layer for use with epoxy prepregs |
| 03/22/2001 | WO2001019606A1 Treated copper foil and process for making treated copper foil |
| 03/22/2001 | WO2001019602A1 Copper coated polyimide with metallic protective layer |
| 03/22/2001 | WO2001019540A1 Method and device for washing article |
| 03/22/2001 | DE19942931A1 Chip card manufacture, providing adhesive at, at least one contact surface between functional component and gap, and irradiating adhesive with microwave radiation |
| 03/22/2001 | DE19940695A1 Trägerelement für ein elektronisches Mediagerät und elektronisches Mediagerät Support element for an electronic media device and electronic media device |
| 03/22/2001 | DE10045850A1 Heat-resistant upholstered material used in the production of laminated plates or foils for printed circuit boards and decorative veneer sheets has a base layer of a woven or knitted |
| 03/22/2001 | DE10037170A1 Verfahren zum Anbringen eines Korrosionshemmstoffs an einer Schaltungsplatine mit befestigten Bauteilen A method of applying a corrosion inhibitor to a circuit board with components mounted |
| 03/22/2001 | CA2382916A1 Method of forming a conductive pattern on dielectric substrates |
| 03/21/2001 | EP1085794A1 Junction box for electronic components |
| 03/21/2001 | EP1085792A1 Process for manufacturing a circuit board, and circuit board |
| 03/21/2001 | EP1085791A1 Electrical connection system between an electrochemical generator and a printed circuit |
| 03/21/2001 | EP1085790A1 Connecting material |
| 03/21/2001 | EP1085789A2 Method of fabricating a laminated circuit assembly and product thereof |
| 03/21/2001 | EP1085788A2 Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment |
| 03/21/2001 | EP1085787A2 Enclosure for electrical or electronic devices with integrated conducting tracks |
| 03/21/2001 | EP1085611A1 Method for electrically connecting two sets of electrode terminals in array on electronic board units |
| 03/21/2001 | EP1085594A2 High frequency circuit apparatus |
| 03/21/2001 | EP1085571A1 Method for increasing device reliability of a BGA package |
| 03/21/2001 | EP1085567A1 COG Assembly and connecting material to be used therein |
| 03/21/2001 | EP1085539A2 Multilayer capacitor |
| 03/21/2001 | EP1085529A2 Dielectric composition |
| 03/21/2001 | EP1085480A1 Process for producing resonant tag |
| 03/21/2001 | EP1085352A2 Three dimensional structure and method of manufacturing the same |
| 03/21/2001 | EP1085326A2 Multilayer wiring board, manufacturing method thereof, and wafer block contact board |
| 03/21/2001 | EP1085041A1 Porous article and process for producing porous article |
| 03/21/2001 | EP1084792A1 Solder alloy of electrode for joining electronic parts and soldering method |
| 03/21/2001 | EP1084791A1 Solder alloy of electrode for joining electronic parts and soldering method |
| 03/21/2001 | EP1084790A1 A solder composition |
| 03/21/2001 | EP1084498A1 Rigid/flex printed circuit board and manufacturing method therefor |
| 03/21/2001 | EP1083998A1 Device and method for jetting droplets |