| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/10/2001 | US6212769 Process for manufacturing a printed wiring board |
| 04/10/2001 | US6212768 Flip chip mounting method and apparatus therefor |
| 04/08/2001 | CA2322270A1 Apparatus and method for bonding conductors |
| 04/05/2001 | WO2001024245A1 Process for ashing organic materials from substrates |
| 04/05/2001 | WO2001023646A1 An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
| 04/05/2001 | WO2001023466A1 Electrically conductive adhesive containing epoxide-modified polyurethane |
| 04/05/2001 | WO2001023131A1 Laser drilling method and laser drilling device |
| 04/05/2001 | US20010000100 Method for mounting devices on a printed circuit board despite misalignment of resist |
| 04/05/2001 | DE19947047A1 Method of detecting defects as "X-Out" identified circuit boards in circuit board manufacturing output enables more cost-effective detection than by conventional methods |
| 04/05/2001 | DE19946745C1 Surface bonding, for use in e.g. circuit boards, uses laid adhesive strand between surfaces forming sealed zone where pressure difference is formed through surface opening to press surfaces together without mechanical or manual pressures |
| 04/05/2001 | DE19946451A1 Component, especially an electrical component such as a coil, with separate contact element, for mounting on circuit board, has contact zone at bottom of contact element for provision of locating recesses for fixing of coil ends |
| 04/05/2001 | DE19946195C1 Removal of alumina particle layer sintered onto sintered multilayer ceramic substrate, employs two stages of dry grit blasting followed by electrostatic repulsion of submicron residue |
| 04/05/2001 | DE19943251A1 Kondensatorbauelement Capacitor device |
| 04/05/2001 | DE19941690A1 Steuergerät und Lötverfahren Control unit and soldering |
| 04/05/2001 | DE19939584A1 Zur Montage auf eine Leiterplatte ausgelegtes Bauteil For mounting on a printed circuit board out blank component |
| 04/05/2001 | DE10044429A1 Elektronische Keramikkomponente Ceramic electronic component |
| 04/05/2001 | DE10041343A1 Siebdruckvorrichtung Screen printing apparatus |
| 04/05/2001 | DE10038429A1 Verbundlaminat und Verfahren zur Herstellung desselben A composite laminate and method of manufacturing the same |
| 04/05/2001 | DE10038424A1 Lead terminal structure for electronic components e.g. piezoresonator, has round bar-like terminals mounted at mounting sections of component, which has bent sections formed between mounting section and outer end |
| 04/05/2001 | DE10037169A1 Verfahren zum Anbringen eines Haftmaterials an einer Schaltungsplatine mit befestigten Bauteilen A method of applying an adhesive material to a circuit board with components mounted |
| 04/05/2001 | DE10035446A1 Micro bore hole generation method involves determining substrate position using interferometer; computer system processes position signal into table position |
| 04/05/2001 | DE10030757A1 Process for protecting a printed circuit board comprises preparing a protecting composition based on a thermoplastic resin, melting the composition by heating, and applying the composition to the board |
| 04/05/2001 | DE10026187A1 Verfahren und Vorrichtung zum Herstellen einer elektronischen Komponente Method and apparatus for manufacturing an electronic component |
| 04/04/2001 | EP1089603A2 Copper foil bonding treatment with improved bond strength and resistance to undercutting |
| 04/04/2001 | EP1089336A2 Integrated circuit packages with improved EMI characteristics |
| 04/04/2001 | EP1089334A2 Ceramic circuit board |
| 04/04/2001 | EP1089331A2 Flip chip technology using electrically conductive polymers and dieletrics |
| 04/04/2001 | EP1089129A1 Positive type photosensitive resin composition, process for producing pattern and electronic parts |
| 04/04/2001 | EP1089113A2 Transfer body and method using the same |
| 04/04/2001 | EP1088848A1 Porous materials |
| 04/04/2001 | EP1088802A1 Method for producing ceramic green sheet |
| 04/04/2001 | EP1088615A2 Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
| 04/04/2001 | EP1088470A1 Ic stack utilizing flexible circuits with bga contacts |
| 04/04/2001 | EP1088371A1 Solder ball terminal |
| 04/04/2001 | EP1088345A1 System and method for determining the desired decoupling components for power distribution systems using a computer system |
| 04/04/2001 | EP1088344A1 Method for determining the desired decoupling components for power distribution systems |
| 04/04/2001 | EP1088121A2 Method for metal coating of substrates |
| 04/04/2001 | EP1088117A2 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 04/04/2001 | EP1087844A1 Apparatus and method for coating a multilayer article |
| 04/04/2001 | EP1053580A4 An improved connector scheme for a power pod power delivery system |
| 04/04/2001 | EP1047552A4 Direct write imaging medium |
| 04/04/2001 | EP0734576B1 Anisotropic, electrically conductive adhesive film |
| 04/04/2001 | CN1290472A Method for joining copper films and separating sheets of metal |
| 04/04/2001 | CN1290228A Machine for treating sheet-shaped goods with various media, and goods carrier for use in such a machine |
| 04/04/2001 | CN1290122A Long-insertion welding method without cleaning |
| 04/04/2001 | CN1290121A Printed circuit board and display device |
| 04/04/2001 | CN1290066A Flat electronic device and installating structure thereof |
| 04/04/2001 | CN1290033A Ultrasonic generator, multi-layer flexible circuit board and manufacture thereof |
| 04/04/2001 | CN1290003A Object lens activator and manufacture thereof |
| 04/04/2001 | CN1289945A Method for electrically connecting two sets of electrode terminals of arrays on electronic board unit |
| 04/04/2001 | CN1289680A Ink jetting head and manufacture thereof |
| 04/03/2001 | US6212078 Nanolaminated thin film circuitry materials |
| 04/03/2001 | US6212076 Enhanced heat-dissipating printed circuit board package |
| 04/03/2001 | US6212057 Flexible thin film capacitor having an adhesive film |
| 04/03/2001 | US6211942 Double-sided exposure system |
| 04/03/2001 | US6211936 Liquid crystal display device and method of making the same |
| 04/03/2001 | US6211935 Alignment device for an IC-mounted structure |
| 04/03/2001 | US6211785 Method of manufacturing and testing an electronic device, and an electronic device |
| 04/03/2001 | US6211690 Apparatus for electrically testing bare printed circuits |
| 04/03/2001 | US6211564 Integrated circuit package having stepped terminals |
| 04/03/2001 | US6211488 Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| 04/03/2001 | US6211487 Printed circuit board and method of manufacturing the same |
| 04/03/2001 | US6211485 Blind via laser drilling system |
| 04/03/2001 | US6211469 Printed circuit substrate with comb-type electrodes capable of improving the reliability of the electrode connections |
| 04/03/2001 | US6211468 Flexible circuit with conductive vias having off-set axes |
| 04/03/2001 | US6211261 Thermosetting pressure-sensitive adhesive and adhesive sheet thereof |
| 04/03/2001 | US6211080 Repair of dielectric-coated electrode or circuit defects |
| 04/03/2001 | US6211076 Bus line wiring structure in a semiconductor device and method of manufacturing the same |
| 04/03/2001 | US6210781 Method for photoselective seeding and metallization of three-dimensional materials |
| 04/03/2001 | US6210771 Electrically active textiles and articles made therefrom |
| 04/03/2001 | US6210746 Method of fabricating a solder resist mask |
| 04/03/2001 | US6210592 Deposition of resistor materials directly on insulating substrates |
| 04/03/2001 | US6210556 Electrolyte and tin-silver electroplating process |
| 04/03/2001 | US6210555 Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating |
| 04/03/2001 | US6210547 Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties |
| 04/03/2001 | US6210537 Forming solution comprising pyrrole monomer and an electron acceptor; evenly applying film of solution onto substrate; photochemically polymerizing portions of film to form electronically conducting polymer; removing solution |
| 04/03/2001 | US6210522 Adhesive bonding laminates |
| 04/03/2001 | US6210518 Method and fixture for manufacturing flexible printed circuit board |
| 04/03/2001 | US6210480 Device for wet coating, in particular printed circuit boards, with lacquer |
| 04/03/2001 | US6210175 Socket rails for stacking integrated circuit components |
| 04/03/2001 | US6209196 Method of mounting bumped electronic components |
| 03/29/2001 | WO2001022786A1 Conductor structure on a dielectric material, and method for producing such a conductor structure |
| 03/29/2001 | WO2001022785A1 Solder-bearing wafer for use in soldering operations |
| 03/29/2001 | WO2001022501A1 Electronic component and coating agent |
| 03/29/2001 | WO2001022489A2 Control device, particularly for use in automotive engineering |
| 03/29/2001 | WO2001022449A1 Electronic device of ceramic |
| 03/29/2001 | WO2001022446A1 Split inductor with fractional turn of each winding and pcb including same |
| 03/29/2001 | WO2001021859A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 03/29/2001 | WO2001021399A1 Pressure laminator apparatus and non-woven fabric formed thereby |
| 03/29/2001 | DE19939586A1 Electrical press-in connection for PCB assembly has press-in contact that is pressed into orifice on printed circuit board to connect component to printed circuit board |
| 03/29/2001 | DE19939582A1 Zur Montage auf eine Leiterplatte ausgelegtes Bauteil For mounting on a printed circuit board out blank component |
| 03/29/2001 | DE10048132A1 Aromatic polyimide laminate, useful for flexible plates with printed circuits, comprises polyimide laminate and metal films and separating foil |
| 03/29/2001 | DE10041622A1 Siebdruckvorrichtung Screen printing apparatus |
| 03/28/2001 | EP1087652A1 Improvements in cooled electrical assemblies, especially for a control module for a discharge head lamp of a vehicle |
| 03/28/2001 | EP1087649A2 Printed wiring board and display apparatus |
| 03/28/2001 | EP1087648A2 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 03/28/2001 | EP1087647A2 Thin integral resistor/capacitor/inductor package, method of manufacture |
| 03/28/2001 | EP1087440A2 Modeling technique to increase device reliability |
| 03/28/2001 | EP1087436A2 Adhesive material and electronic circuit connection method |
| 03/28/2001 | EP1087411A2 Multilayer capacitor |