| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/17/2001 | US6216938 Machine and process for reworking circuit boards |
| 04/17/2001 | US6216589 Printing paste supply device |
| 04/17/2001 | US6216537 Accelerometer for implantable medical device |
| 04/17/2001 | US6216342 Method for fabricating a matrix switchboard and connection pin |
| 04/17/2001 | CA2025337C Process for directly metallizing circuit boards |
| 04/12/2001 | WO2001026440A1 Device for transferring/holding sheetlike member and its method |
| 04/12/2001 | WO2001026436A1 Method and device for laser drilling organic materials |
| 04/12/2001 | WO2001026435A1 Method and device for laser drilling laminates |
| 04/12/2001 | WO2001026434A1 Wiring board having connector and method of manufacturing the same |
| 04/12/2001 | WO2001026433A1 Flexible circuit board and method for making a flexible circuit board |
| 04/12/2001 | WO2001026179A1 Method of providing a conductive element and a conductive element thereof |
| 04/12/2001 | WO2001026162A1 Photo-interrupter and semiconductor device using it |
| 04/12/2001 | WO2001026079A1 Electrooptic device, method for manufacturing electrooptic device, and electronic apparatus |
| 04/12/2001 | WO2001025775A1 Patterned laminates and electrodes with laser defined features |
| 04/12/2001 | WO2001025318A1 Compositions for high-temperature resistant film coatings |
| 04/12/2001 | WO2001025317A2 Method of treating epoxy resin-cured product |
| 04/12/2001 | WO2001024968A1 Soldering flux, solder paste and method of soldering |
| 04/12/2001 | WO2001024967A1 Method for soft soldering of components and a soft soldered device |
| 04/12/2001 | WO2001024964A1 Method and apparatus for laser drilling |
| 04/12/2001 | WO2000022193A3 Electrodeposition of metals in small recesses using modulated electric fields |
| 04/12/2001 | US20010000207 Coupling a low-power radio frequency power supply to a tuning network by a transmission line; coupling a gas manifold to the plasma chamber; increasing the power to produce a plasma in oxygen; exposing thick-film polymer resistors; etching |
| 04/12/2001 | US20010000206 Coupling radio frequency power supply through coaxial transmission line to tuning network, coupling gas manifold to plasma chamber, increasing power to produce plasma in oxygen mixture gas, exposing polymeric resistors, trimming |
| 04/12/2001 | DE19947914A1 Verfahren zum Weichlöten von Komponenten und weichgelötete Anordnung A method for soft soldering of components and assembly weichgelötete |
| 04/12/2001 | DE19947596A1 Chip card manufacture with transfer element attached to card |
| 04/12/2001 | DE19947395A1 Hochtemperaturbeständige Folien auf Cellulosetriacetat-Basis High temperature resistant films on cellulose triacetate base |
| 04/12/2001 | DE19945794A1 Verfahren zum Herstellen einer Leiterplatte sowie Leiterplatte A method of manufacturing a PCB and PCB |
| 04/12/2001 | DE19945131A1 Elektronisches Bauelement und Beschichtungs-Mittel Electronic component and coating agent |
| 04/12/2001 | DE19944908A1 Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten A method of forming a conductive pattern on dielectric substrates |
| 04/12/2001 | DE19942213A1 Spindelrahmen Spindle frame |
| 04/12/2001 | DE10035990A1 Ceramic electronic component manufacture for production of dielectric resonator, involves forming a glass-ceramic compact, to which a silver conductor pattern is provided and heat treated at specific conditions |
| 04/12/2001 | DE10032676A1 Chip module and insulating carrier card connection method during fabrication of contactless chip card, involves forming contact holes with bent edges and sleeves at different locations on lead frame segment |
| 04/12/2001 | DE10030742A1 Surface mounting type electronic component has extraction ends of internal electrode exposed to end faces of electronic component and exposed sections covered by protective coat |
| 04/11/2001 | EP1091627A1 Process for providing electrical connections on the surface of a semiconductor package using electrical connection bumps |
| 04/11/2001 | EP1091626A1 Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack |
| 04/11/2001 | EP1091406A2 Multilayer Interconnection board for semiconductor device, method of forming the same and mounting the semiconductor chip thereon |
| 04/11/2001 | EP1091401A2 Semiconductor device package and process for production |
| 04/11/2001 | EP1091255A2 Method of aligning mask and workpiece in exposure device |
| 04/11/2001 | EP1091024A1 Method and device for plating substrate |
| 04/11/2001 | EP1091023A2 Alloy composition and plating method |
| 04/11/2001 | EP1090891A1 Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate |
| 04/11/2001 | EP1090706A1 Apparatus and method for bonding conductors |
| 04/11/2001 | EP1090538A1 Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace |
| 04/11/2001 | EP1090537A1 Method and apparatus for drilling microvia holes in electrical circuit interconnection packages |
| 04/11/2001 | EP1090535A1 Flip chip devices with flexible conductive adhesive |
| 04/11/2001 | EP1090401A1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor |
| 04/11/2001 | EP1089799A1 Apparatus and method for recovering photoresist developers and strippers |
| 04/11/2001 | EP0890297A4 Solder bonded electronic module |
| 04/11/2001 | CN1291301A Positive active photodielectric composition |
| 04/11/2001 | CN1291286A Method and device for testing printed circuit board |
| 04/11/2001 | CN1291135A Direct write imaging medium |
| 04/11/2001 | CN1291070A Multilayer flexible wiring board |
| 04/11/2001 | CN1064457C Circuit assemly and process for production thereof |
| 04/11/2001 | CN1064414C Electrolytic copper foil for printed circuit board and its producing method |
| 04/10/2001 | US6215687 Semiconductor device and process for manufacturing the same |
| 04/10/2001 | US6215681 Bus bar heat sink |
| 04/10/2001 | US6215671 Method and apparatus for connecting circuit boards |
| 04/10/2001 | US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/10/2001 | US6215669 Discrete component in-mold mounting |
| 04/10/2001 | US6215663 Printed circuit board assembly with improved thermal performance |
| 04/10/2001 | US6215649 Printed circuit board capacitor structure and method |
| 04/10/2001 | US6215647 Multilayer capacitor |
| 04/10/2001 | US6215548 Nested glass exposure tool registration device |
| 04/10/2001 | US6215454 Multi-layered shielded substrate antenna |
| 04/10/2001 | US6215387 Thick film low value high frequency inductor |
| 04/10/2001 | US6215377 Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format |
| 04/10/2001 | US6215372 Method and apparatus for reducing electrical resonances in power and noise propagation in power distribution circuits employing plane conductors |
| 04/10/2001 | US6215322 Conventionally sized temporary package for testing semiconductor dice |
| 04/10/2001 | US6215321 Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor |
| 04/10/2001 | US6215320 High density printed circuit board |
| 04/10/2001 | US6215269 Method of exposing a path on a curved, or otherwise irregularly shaped, surface |
| 04/10/2001 | US6215210 Motor, structure of stator of the motor and assembly method of the stator |
| 04/10/2001 | US6215184 Optimized circuit design layout for high performance ball grid array packages |
| 04/10/2001 | US6215183 Vertical surface mount assembly and methods |
| 04/10/2001 | US6215181 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 04/10/2001 | US6215101 Electrical unit |
| 04/10/2001 | US6215083 Welded wire termination device and method |
| 04/10/2001 | US6215076 Printed circuit board with noise suppression |
| 04/10/2001 | US6215011 Silane compositions |
| 04/10/2001 | US6214754 Silicon nitride on borosilicate glass matrix with metal oxide with thick film and ceramic powders |
| 04/10/2001 | US6214650 Method and apparatus for sealing a ball grid array package and circuit card interconnection |
| 04/10/2001 | US6214527 Photosensitive conductor paste |
| 04/10/2001 | US6214525 Printed circuit board with circuitized cavity and methods of producing same |
| 04/10/2001 | US6214523 Laser irradiation to remove unwanted areas of green ceramic paste pad positioned onto green ceramic substrate to write a label pattern, then sintering |
| 04/10/2001 | US6214520 Thermal transfer element for forming multilayer devices |
| 04/10/2001 | US6214508 Circuit-forming charging powder and multilayer wiring board using the same |
| 04/10/2001 | US6214460 Adhesive compositions and methods of use |
| 04/10/2001 | US6214446 Resin film and a method for connecting electronic parts by the use thereof |
| 04/10/2001 | US6214445 Printed wiring board that has built-in capacitor in vicinity of an integrated circuit chip to be mounted thereon; simplified fabrication; minimizing loss due to defective capacitor during fabrication |
| 04/10/2001 | US6214444 Reacts to operate buzzer or an alert lamp of detector; used to avoid shoplifting the resonant tags are attached to goods and the like in department stores, discount stores, rental shops for video tapes, compact disk (cd) shops |
| 04/10/2001 | US6214253 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 04/10/2001 | US6214249 Surface modification using an atmospheric pressure glow discharge plasma source |
| 04/10/2001 | US6214218 Soldering apparatus and agent for separating solder and solder oxides |
| 04/10/2001 | US6214155 Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
| 04/10/2001 | US6214135 Clad rolling an aluminum, or alloy thereof, annealing |
| 04/10/2001 | US6214131 Mixed solder pastes for low-temperature soldering process |
| 04/10/2001 | US6213789 Method and apparatus for interconnecting devices using an adhesive |
| 04/10/2001 | US6213786 Electronic device and multi-pin connector therefor |
| 04/10/2001 | US6213747 Package stack via bottom leaded plastic (BLP) packaging |
| 04/10/2001 | US6213386 Method of forming bumps |
| 04/10/2001 | US6213356 Bump forming apparatus and bump forming method |