| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/24/2001 | US6222135 Circuit board for preventing solder failures |
| 04/24/2001 | US6222131 Flat cable |
| 04/24/2001 | US6221693 High density flip chip BGA |
| 04/24/2001 | US6221690 Semiconductor package and production method thereof |
| 04/24/2001 | US6221553 Contacting receptor with thermal transfer element having substrate and transfer layer, transfer layer including multicomponent transfer unit, selectively heating transfer element to transfer multicomponent transfer unit to receptor |
| 04/24/2001 | US6221514 Dispersion of metal particles in solder alloy |
| 04/24/2001 | US6221511 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method |
| 04/24/2001 | US6221503 Electrode modification using an unzippable polymer paste |
| 04/24/2001 | US6221459 Controlling the heat expansion of electrical couplings |
| 04/24/2001 | US6221440 Process for plating metal coating |
| 04/24/2001 | US6221427 Interface regions between metal and ceramic in a metal/ceramic substrate |
| 04/24/2001 | US6221269 Removal of extra molybdenum from electronics, applying ceramics, sintering and rinsing |
| 04/24/2001 | US6221268 Plasma chambers, coupling power supply and gas manifold to plasma chamber and exposure of fiber optic cable |
| 04/24/2001 | US6221229 Connecting regions that can be soldered and/or bonded, metallization by laser to form a conductive pattern applying electrolysis resistant coating |
| 04/24/2001 | US6221193 Defect reduction method for screened greensheets and article produced therefrom |
| 04/24/2001 | US6221176 Surface treatment of copper to prevent microcracking in flexible circuits |
| 04/24/2001 | US6221162 Apparatus for forming a resist layer over an electroconductive substrate |
| 04/24/2001 | US6220875 Electrical connection box |
| 04/24/2001 | US6220871 Electrical connector and contact construction therefor |
| 04/24/2001 | US6220503 Rework and underfill nozzle for electronic components |
| 04/24/2001 | US6220501 Metallic substrates are coated with an undercoat alloy of tin and zinc and contacted with each other through a mixture containing zinc and tin and flux, heating substrate to melt the solder, solidififying to join metallic member |
| 04/24/2001 | US6220499 Method for assembling a chip carrier to a semiconductor device |
| 04/24/2001 | US6220093 Vibratory gyroscope |
| 04/24/2001 | US6219912 Method for manufacture electronic component device |
| 04/24/2001 | US6219911 Flip chip mounting technique |
| 04/24/2001 | US6219908 Method and apparatus for manufacturing known good semiconductor die |
| 04/24/2001 | US6219899 Panel positioning method |
| 04/24/2001 | CA2236193C Semiconductor microwave amplifier |
| 04/24/2001 | CA2142055C Annular circuit components coupled with printed circuit board through-hole |
| 04/19/2001 | WO2001028303A1 Electromagnetic shield wiring structure of wiring board |
| 04/19/2001 | WO2001028302A1 Electronic card for an electrical system of a vehicle |
| 04/19/2001 | WO2001028293A1 Thermally controlled circuit using planar resistive elements |
| 04/19/2001 | WO2001028043A1 Miniaturised electrical interconnection system |
| 04/19/2001 | WO2001027983A1 Method and apparatus for forming interconnection |
| 04/19/2001 | WO2001027941A1 Conductor composition |
| 04/19/2001 | WO2001027665A1 Method control system and apparatus for ablating high-density array of vias or indentation in surface of object |
| 04/19/2001 | WO2001027358A1 Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces |
| 04/19/2001 | WO2001027356A1 Method for electrochemically metallising an insulating substrate |
| 04/19/2001 | WO2001009054A8 Impregnated glass fiber strands and products including the same |
| 04/19/2001 | DE19944383A1 Gehäuse für elektrische oder elektronische Vorrichtungen mit integrierten Leiterbahnen Housings for electrical or electronic devices with integrated conductor tracks |
| 04/19/2001 | DE19930207A1 Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte- und Fixierelement zur Verwendung bei diesem Verfahren A method of manufacturing substrates with structured metallizations as well as the holding and fixing element for use in this method |
| 04/19/2001 | DE10041602A1 Connector fixing structure for printed circuit board, includes hook formed in leading end of terminal, which is penetrated via through-hole formed in PCB |
| 04/18/2001 | EP1093329A2 Wiring circuit substrate and manufacturing method therefor |
| 04/18/2001 | EP1093328A2 Laser imaging of thin layer electronic circuitry material |
| 04/18/2001 | EP1093327A2 An improved method to embed passive components |
| 04/18/2001 | EP1093326A2 Printed-circuit board module |
| 04/18/2001 | EP1093325A2 Multilayer assembly with electrical connecting pins |
| 04/18/2001 | EP1093197A1 Electrical connector with continous strip contacts |
| 04/18/2001 | EP1093189A1 Electrical interconnection system |
| 04/18/2001 | EP1093163A2 Electronic interconnect structure |
| 04/18/2001 | EP1093160A2 Connecting material for anisotropically electroconductive connection |
| 04/18/2001 | EP1093082A2 Combination card having an IC chip module |
| 04/18/2001 | EP1093020A2 Composite photosensitive element |
| 04/18/2001 | EP1092739A1 Epoxy resin composition and uses thereof |
| 04/18/2001 | EP1092676A1 Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
| 04/18/2001 | EP1092339A1 Molded housing with integral heatsink |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/18/2001 | EP1092248A1 Pcb to metallic ground connection method |
| 04/18/2001 | EP1091845A1 Press pads |
| 04/18/2001 | EP1091830A1 Method and device for cleaning a printed-circuit board mask or a printed-circuit board |
| 04/18/2001 | CN1291963A Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling fabric |
| 04/18/2001 | CN1291858A Multilayer printing distribution board and its making method |
| 04/18/2001 | CN1291789A Manufacturing method of lead-wire frame and resin sealing type semiconductor device |
| 04/18/2001 | CN1291556A Technology for making glass able to regulate light locally and instantaneously and its structure mode |
| 04/18/2001 | CN1064809C Electrochemical fine machining method based on ionic conductance and its device |
| 04/18/2001 | CN1064788C Power pad/power delivery system |
| 04/18/2001 | CA2323295A1 Silicon dioxide-coated polyolefin resin and process for its production |
| 04/17/2001 | US6219253 Molded electronic package, method of preparation using build up technology and method of shielding |
| 04/17/2001 | US6219247 Control unit for a motor vehicle |
| 04/17/2001 | US6219240 Three-dimensional electronic module and a method of its fabrication and repair |
| 04/17/2001 | US6219220 Ceramic electronic component having terminal electrode that includes a second porous layer |
| 04/17/2001 | US6218851 Method and apparatus for testing a printed circuit |
| 04/17/2001 | US6218850 Apparatus for selecting high-reliability integrated circuits |
| 04/17/2001 | US6218847 Test pattern for use in measuring thickness of insulating layer and method for using the same |
| 04/17/2001 | US6218736 Circuit board and semiconductor device, and method of manufacturing the same |
| 04/17/2001 | US6218729 Apparatus and method for an integrated circuit having high Q reactive components |
| 04/17/2001 | US6218630 Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch |
| 04/17/2001 | US6218629 Module with metal-ion matrix induced dendrites for interconnection |
| 04/17/2001 | US6218628 Foil circuit boards and semifinished products and method for the manufacture thereof |
| 04/17/2001 | US6218083 Patternwise exposure to radiation |
| 04/17/2001 | US6218074 Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuits |
| 04/17/2001 | US6218031 Method of forming an anticorrosive film for contacts for electronic parts |
| 04/17/2001 | US6218030 Soldered product |
| 04/17/2001 | US6218022 Resin etching solution and process for etching polyimide resins |
| 04/17/2001 | US6217990 Multilayer circuit board having no local warp on mounting surface thereof |
| 04/17/2001 | US6217989 Conductive line features for enhanced reliability of multi-layer ceramic substrates |
| 04/17/2001 | US6217988 Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
| 04/17/2001 | US6217987 A solder resist comprises an acrylate of novolac type epoxy resin and an imidazole curing agent, has a specific viscosity adjusted with glycol ether comprising diethylene glycol dimethyl ether or dimethyl ether of triethylene glycol |
| 04/17/2001 | US6217821 Applying conductive material to green ceramic tape |
| 04/17/2001 | US6217787 The printed circuit board, together with an electrode, is placed in an electrolytic liquid, voltages of different potential are applied to circuit board and the electrode, and electroconductive material is removed from the circuit board |
| 04/17/2001 | US6217783 Method for strengthening air bridge circuits |
| 04/17/2001 | US6217736 Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment |
| 04/17/2001 | US6217671 No-clean flux composition for use in soldering consisting essentially of dicarboxylic acid, organic solvent, acetic acid in specified concentration |
| 04/17/2001 | US6217669 Cleaning apparatus and cleaning method |
| 04/17/2001 | US6217665 Method of cleaning substrate using ultraviolet radiation |
| 04/17/2001 | US6217362 Electrical connector having improved contact elements |
| 04/17/2001 | US6217349 Holder and method for manufacturing the same |
| 04/17/2001 | US6217348 Electrical connector |
| 04/17/2001 | US6217346 Solderless pin connection |
| 04/17/2001 | US6217265 Printed circuit board drilling machine and its maintenance method |