| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/02/2001 | CN1293383A Water-dispersible negative photosensitive composition |
| 05/02/2001 | CN1293218A Epoxy resin composition, adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 05/02/2001 | CN1293216A Polyolefinic resin for coating silicon dioxide and its preparation method |
| 05/02/2001 | CN1293096A Floating device of hot-press welder |
| 05/02/2001 | CN1065408C Method for welding copper coil for conducting heavy current of circuit board |
| 05/02/2001 | CN1065182C Diffusion patterning process and screen therefor |
| 05/02/2001 | CA2324910A1 "a device for generating a plurality of laser beams" |
| 05/01/2001 | US6226778 Method and apparatus for determining locations of circuit elements including sequential circuit elements |
| 05/01/2001 | US6226535 Cellular telephone with an improved LCD supporting frame |
| 05/01/2001 | US6226183 Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement |
| 05/01/2001 | US6226171 Power conducting substrates with high-yield integrated substrate capacitor |
| 05/01/2001 | US6226169 Multilayer capacitor |
| 05/01/2001 | US6225817 Loaded-board, guided-probe test fixture |
| 05/01/2001 | US6225764 Linearity correction coil device and video display apparatus using the same |
| 05/01/2001 | US6225702 Ball grid array to prevent shorting between a power supply and ground terminal |
| 05/01/2001 | US6225700 Package for a semiconductor element having depressions containing solder terminals |
| 05/01/2001 | US6225687 Chip package with degassing holes |
| 05/01/2001 | US6225681 Microelectronic interconnect structures and methods for forming the same |
| 05/01/2001 | US6225573 Method for mounting terminal on circuit board and circuit board |
| 05/01/2001 | US6225572 Connecting an electronic card point to a printed circuit on a metal substrate with a capsule |
| 05/01/2001 | US6225571 Heatsink with high thermal conductivity dielectric |
| 05/01/2001 | US6225570 Circuit board having electric component and its manufacturing method |
| 05/01/2001 | US6225569 Wiring substrate and method of manufacturing the same |
| 05/01/2001 | US6225206 Flip chip C4 extension structure and process |
| 05/01/2001 | US6225205 Method of forming bump electrodes |
| 05/01/2001 | US6225035 Method for forming a thick-film resistor |
| 05/01/2001 | US6225031 That avoids introducing dimensional changes and does not adversely impact the dimensional stability |
| 05/01/2001 | US6225028 Fiberglass-reinforced epoxy resins, fr4, or polytetrafluorethylene (e.g., teflon), in lieu of ceramic materials. |
| 05/01/2001 | US6224991 Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process |
| 05/01/2001 | US6224965 Microfiber dielectrics which facilitate laser via drilling |
| 05/01/2001 | US6224951 Depositing a copper layer on the metal layer of a polyimide film strip and, to the other side, a tiecoat metal to which a non-flowing adhesive is applied and cured completely in the interior and partially outside; continuous processing |
| 05/01/2001 | US6224936 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
| 05/01/2001 | US6224722 Method and apparatus for sequentially metalizing polymeric films and products made thereby |
| 05/01/2001 | US6224721 Electroplating apparatus |
| 05/01/2001 | US6224703 Method of making laminate ceramic substrate with domed pads |
| 05/01/2001 | US6224425 Simplified microelectronic connector and method of manufacturing |
| 05/01/2001 | US6224399 Surface-mount electrical connection device |
| 05/01/2001 | US6224396 Compliant, surface-mountable interposer |
| 05/01/2001 | US6224393 Assembly with dual purpose connector |
| 05/01/2001 | US6224389 Component for contacting a measuring unit and method for its production |
| 05/01/2001 | US6223973 Apparatus and method for connecting printed circuit boards through soldered lap joints |
| 05/01/2001 | US6223969 Method and machine for wave soldering or tinning |
| 05/01/2001 | US6223799 Foil transfer apparatus |
| 05/01/2001 | US6223636 Low-cost high-density gang punch |
| 05/01/2001 | US6223431 Method for providing an electrical ground connection between a printed circuit board and a metallic substrate |
| 05/01/2001 | US6223419 Method of manufacture of an improved monolithic inductor |
| 04/26/2001 | WO2001030123A1 Flexible electronic circuitry and method of making same |
| 04/26/2001 | WO2001029929A1 Solder ball terminal |
| 04/26/2001 | WO2001029928A2 Device for electrically and mechanically connecting two printed circuit boards |
| 04/26/2001 | WO2001029878A2 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| 04/26/2001 | WO2001029616A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon |
| 04/26/2001 | WO2001029290A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | WO2001029289A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 04/26/2001 | WO2001029288A2 Conveyorized electroplating device |
| 04/26/2001 | WO2001029103A1 Radiation curable hot melt composition and a process for the application thereof |
| 04/26/2001 | WO2001028738A1 Separating and milling device |
| 04/26/2001 | WO2001003856A8 Method of forming a thin metal layer on an insulating substrate |
| 04/26/2001 | US20010000518 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
| 04/26/2001 | US20010000396 Apparatus for depositing a metal film, comprising a holder that positions the substrate so seed layer contacts an electrolyte solution, and electric contact which contacts second side or edge of substrate; uniform current density |
| 04/26/2001 | DE19950885A1 Production of elastic contacts comprises partially anisotropically plasma etching a polymer film located below a copper-etched hole |
| 04/26/2001 | DE19950757A1 Electrical and mechanical connector between flexible circuit board and second circuit board, has support region of contact pin clamping part which presses against track of circuit board |
| 04/26/2001 | DE19946497A1 Joint for connecting semiconductor chips to circuit boards comprises a first coupling element fixed to a first surface and a second coupling element in the form of a step running along a plane |
| 04/26/2001 | DE19946198A1 Thick film circuit has temperature-dependent resistors and conducting pathways connected to switching function units on an insulating substrate |
| 04/26/2001 | DE10046303A1 Electronic chip component e.g. piezoelectric resonator, has electrode areas of different width formed on side and lower surfaces of monolithic resonator body |
| 04/26/2001 | CA2387815A1 Radiation curable hot melt composition and a process for the application thereof |
| 04/26/2001 | CA2384249A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | CA2384244A1 Method and device for the electrolytic treatment of electrolytically conducting structures which are insulated from each other |
| 04/25/2001 | EP1094694A1 Method of manufacturing method of ceramic multilayer board |
| 04/25/2001 | EP1094693A2 Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| 04/25/2001 | EP1094692A2 Printed circuit board and manufacturing process thereof |
| 04/25/2001 | EP1094566A1 Clip for coupling component to connector contacts |
| 04/25/2001 | EP1094548A1 Device for fixing and connecting of a battery |
| 04/25/2001 | EP1094547A2 Electrical connector with strain relief |
| 04/25/2001 | EP1094474A2 Low temperature-curable connecting material for anisotropically electroconductive connection |
| 04/25/2001 | EP1094472A2 Conductive composition, conductive adhesive, and their mounting structure |
| 04/25/2001 | EP1094090A2 Silicon dioxide-coated polyolefin resin and process for its production |
| 04/25/2001 | EP1093970A2 Actuator for controlling an element along at least two degrees of freedom |
| 04/25/2001 | EP1093909A2 Composite film |
| 04/25/2001 | EP1093880A1 Method and apparatus for selective heating of components |
| 04/25/2001 | EP1093503A1 Fine pitch anisotropic conductive adhesive |
| 04/25/2001 | EP0947125B1 Method of making a printed circuit board having a tin/lead coating |
| 04/25/2001 | EP0917495A4 Composition and method for coating metals by dip autopolymerization |
| 04/25/2001 | CN1292834A Electrolytic copper foil having modified shiny side |
| 04/25/2001 | CN1292804A Polymeric films having controlled viscosity response to temp. and shear |
| 04/25/2001 | CN1292636A Printed circuit board with built-in electronic inductor and manufacturing method, and electronic inductor |
| 04/25/2001 | CN1292635A 布线电路衬底及其制造方法 The wiring circuit substrate and manufacturing method thereof |
| 04/25/2001 | CN1292556A 介电组合物 Dielectric compositions |
| 04/25/2001 | CN1292498A Equipment for monitoring adhesion condition of liquid-paste medium on adherend object |
| 04/25/2001 | CN1292403A Electronic material composition, and method for using electronic appliance and electronic material composition |
| 04/24/2001 | US6223091 Alarm event generator apparatus, means and system |
| 04/24/2001 | US6222740 Multilayer circuit board having at least one core substrate arranged therein |
| 04/24/2001 | US6222738 Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof |
| 04/24/2001 | US6222737 Universal package and method of forming the same |
| 04/24/2001 | US6222734 Clamping heat sinks to circuit boards over processors |
| 04/24/2001 | US6222379 Conventionally sized temporary package for testing semiconductor dice |
| 04/24/2001 | US6222280 Test interconnect for semiconductor components having bumped and planar contacts |
| 04/24/2001 | US6222277 Non-collapsing interconnection for semiconductor devices |
| 04/24/2001 | US6222272 Film carrier and semiconductor device using same |
| 04/24/2001 | US6222156 Laser repair process for printed wiring boards |
| 04/24/2001 | US6222136 Printed circuit board with continuous connective bumps |