Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2001
05/09/2001CN1294365A Power source deoupling circuit design method
05/09/2001CN1294165A Fire resistant adhesion agent and circuit components using same
05/09/2001CN1065564C Cleaning agent, cleaning method and cleaning appts.
05/09/2001CN1065463C Method of wave-solding assembled units and appts. of applicating this method
05/08/2001US6230115 Simulator, simulation method, and medium having simulation program recorded, taking account of timing in electronic component and signal transmission through transmission line on printed-circuit board
05/08/2001US6230067 In-line programming system and method
05/08/2001US6229829 Fourth harmonic generation apparatus
05/08/2001US6229441 Communication devices, radio frequency identification devices, methods of forming a communication device, and methods of forming a radio frequency identification device
05/08/2001US6229420 Proximity switches with mechanical decoupling of connection pins and connection insert
05/08/2001US6229249 Surface-mount type crystal oscillator
05/08/2001US6229248 Tin, antimony, silver, and copper; electronics
05/08/2001US6229223 Flexible printed board
05/08/2001US6229218 Interconnect device and method for mating dissimilar electronic package footprints
05/08/2001US6229210 Device and method for attaching and soldering pre-formed solder spheres to the ball grid array (BGA) integrated circuit package attachment sites in high volume
05/08/2001US6229209 Chip carrier
05/08/2001US6229207 Organic pin grid array flip chip carrier package
05/08/2001US6229124 Inductive self-soldering printed circuit board
05/08/2001US6229100 Low profile socket for microelectronic components and method for making the same
05/08/2001US6229099 Multi-layer circuit board with particular pad spacing
05/08/2001US6229098 Method for forming a thick-film resistor and thick-film resistor formed thereby
05/08/2001US6229095 Multilayer wiring board
05/08/2001US6228677 Vertical surface mount assembly and methods
05/08/2001US6228555 Multilayer; containing melt; carbon black zones with variations in absorption
05/08/2001US6228511 Structure and process for thin film interconnect
05/08/2001US6228500 Adhesive composition and precursor thereof
05/08/2001US6228470 Composite substrate for electronic components
05/08/2001US6228468 High density ceramic BGA package and method for making same
05/08/2001US6228467 Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate
05/08/2001US6228466 Printed wiring board and method for manufacturing the same
05/08/2001US6228465 Process for producing multilayer wiring boards
05/08/2001US6228464 Printed pattern defect repair sheet, and repair device and method for printed pattern defect
05/08/2001US6228246 Removal of metal skin from a copper-Invar-copper laminate
05/08/2001US6228233 Inflatable compliant bladder assembly
05/08/2001US6228197 Assembly method allowing easy re-attachment of large area electronic components to a substrate
05/08/2001US6227907 Surface mounted electrical connector
05/08/2001US6227901 Motor boot for a circuit board
05/08/2001US6227870 Connecting terminal and a connecting terminal assembly
05/08/2001US6227867 Method for performing double-sided SMT
05/08/2001US6227777 High speed drilling spindle with reciprocating shaft and double-gripping centrifugal chuck
05/08/2001US6227437 Solder ball delivery and reflow apparatus and method of using the same
05/08/2001US6227436 Method of fabricating an electronic circuit device and apparatus for performing the method
05/08/2001US6227434 Reworking of a ball grid array module
05/08/2001US6227115 Ignition device for tripping a passenger restraint device in a motor vehicle
05/08/2001US6226864 Process for producing printed circuit boards with at least one metal layer, printed circuit board and use thereof
05/08/2001US6226862 Method for manufacturing printed circuit board assembly
05/05/2001CA2324850A1 A machine for exposing a panel to laser radiation
05/03/2001WO2001031985A1 Insulating agent for multilayer printed wiring board, insulating agent with metal foil and multilayer printed wiring board
05/03/2001WO2001031984A1 Multilayer printed wiring board and method of producing multilayer printed wiring board
05/03/2001WO2001031982A1 Filling printing method for hole-plugging printing for printed wiring board and plate for the same
05/03/2001WO2001031157A1 Electronic control device for controlling electric units of motor vehicle doors which have different equipment
05/03/2001WO2001031095A1 Process and apparatus for the manufacture of high peel-strength copper foil
05/03/2001WO2001030925A1 Ink composition for masking of pcb and masking method using the same
05/03/2001WO2001030509A1 Roll coater for coating and method of manufacturing printed wiring board employing the roll coater
05/03/2001WO2001004567A3 Method and apparatus for three dimensional inspection of electronic components
05/03/2001US20010000763 Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electro-optical device
05/03/2001US20010000762 Enhanced arrangement for supplying power to a circuit board
05/03/2001US20010000744 Thermal transfer element and process for forming organic electroluminescent devices
05/03/2001US20010000648 Method of forming tester substrates
05/03/2001US20010000647 Circuitry testing substrates
05/03/2001US20010000605 Method for machining wiring board with laser beam and device for same
05/03/2001US20010000581 Method of manufacturing laminated ceramic electronic parts
05/03/2001DE19952752A1 Kontakt für Leiterfolien Contact for conductor films
05/03/2001DE19952471A1 Verfahren und Vorrichtung zur Erzeugung einer fehlerfreien Materialbahn sowie fehlerfreie Materialbahn Method and apparatus for generating an error-free and error-free web web
05/03/2001DE19951324A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens Method and apparatus for electrolytic treatment of electrically conductive surfaces of mutually isolated sheet and film material properties as well as application of the method
05/03/2001DE19951164A1 Folienverbund Film composite
05/03/2001DE19947376A1 Cable harness with outer skins, especially for vehicle applications, has conductors screen printed on lower skin and then covered with upper skin
05/03/2001DE19946753A1 Method of detecting and preventing regions critical for etching, e.g. for screen printing plate manufacture
05/03/2001DE19939854A1 Feedthrough filter for circuit board mounting
05/03/2001CA2324913A1 A device for measuring relative position error
05/03/2001CA2324893A1 A device for transferring and supporting panels
05/03/2001CA2324827A1 Embedded metallic deposits
05/02/2001EP1096843A1 Power switching device
05/02/2001EP1096842A2 Method of manufacturing multilayered printed wiring board using adhesive film
05/02/2001EP1096839A2 Method for designing a power supply decoupling circuit
05/02/2001EP1096838A2 Nanolaminated thin film circuitry materials
05/02/2001EP1096674A2 Circuit substrate
05/02/2001EP1096662A2 Oscillator attachment structure preventing interference by beat signal
05/02/2001EP1096622A1 Ic socket
05/02/2001EP1096607A1 Bus bar-connecting structure
05/02/2001EP1096559A2 Method and apparatus for underfilling semiconductor devices
05/02/2001EP1096558A2 Composite laminate and method for manufacturing the same
05/02/2001EP1096516A2 Low profile inductive component
05/02/2001EP1096423A2 Method and apparatus for providing a defect free web and defect free web
05/02/2001EP1096320A2 Contact exposure device provided with a mask and workpiece interval setting means
05/02/2001EP1096134A2 Wiring harness assembly for an intake manifold
05/02/2001EP1096041A2 Etching of multi-layer metallic composite articles
05/02/2001EP1095975A2 Flame-retardant adhesives and circuit materials with the use of the same
05/02/2001EP1095766A2 Apparatus and method for vacuum lamination of adhesive film
05/02/2001EP1095744A1 Plates punching machine
05/02/2001EP1095726A1 Laser beam machining and laser beam machine
05/02/2001EP1095545A1 A thermal management device and method of making such a device
05/02/2001EP1095385A1 Electric component
05/02/2001EP1095313A1 Photopolymerizable thermosetting resin compositions
05/02/2001EP1094915A1 Method for encapsulating solder metal powders and solder metal powders produced according to this method
05/02/2001CN1293831A Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
05/02/2001CN1293823A Method packaging semiconductor device using antisotropic conductive adhesive
05/02/2001CN1293791A Chip card equipped with loop antenna, and assiciated micromodule
05/02/2001CN1293719A Apparatus and method for electrolytically depositing copper on semiconductor workpiece
05/02/2001CN1293534A Transmission belt type vacuum applicator and coating method of printing circuit board anti-corrosion drying film
05/02/2001CN1293467A Chip parts on glass and connecting material used thereof