| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/15/2001 | US6232212 Flip chip bump bonding |
| 05/15/2001 | US6232149 Sockets for “springed” semiconductor devices |
| 05/15/2001 | US6232047 Applying conductive metal paste on substrate, firing |
| 05/15/2001 | US6232042 Microelectronics; resistor on substrate |
| 05/15/2001 | US6231775 Process for ashing organic materials from substrates |
| 05/15/2001 | US6231717 Plastic molding unsealing apparatus |
| 05/15/2001 | US6231707 Method of forming a multilayer ceramic substrate with max-punched vias |
| 05/15/2001 | US6231691 Eutectic mixture of tin, silver and copper |
| 05/15/2001 | US6231684 Air pollution control |
| 05/15/2001 | US6231619 Electroplating process |
| 05/15/2001 | US6231370 Electrical connector for leaded electronic component |
| 05/15/2001 | US6231367 Method for achieving substantially uniform expansion of dielectric plate and electrical connector made in accordance therewith |
| 05/15/2001 | US6231354 System for modifying printed wiring connections after installation |
| 05/15/2001 | US6231333 Apparatus and method for vacuum injection molding |
| 05/15/2001 | US6231279 Drilling machine with at least two machining heads for machining printed circuit boards |
| 05/15/2001 | US6230963 Method and apparatus using colored foils for placing conductive preforms |
| 05/15/2001 | US6230619 Printing method and printing apparatus |
| 05/15/2001 | US6230403 Interconnection system |
| 05/15/2001 | US6230402 Electrical contact termination for a flexible circuit |
| 05/15/2001 | US6230401 Method and an arrangement in an electronics system |
| 05/15/2001 | US6230397 Method of constructing an electrical connector |
| 05/15/2001 | US6230392 System for mounting an electrical connector on a printed wiring board |
| 05/15/2001 | CA2326082A1 Connector |
| 05/15/2001 | CA2198088C Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 05/10/2001 | WO2001033927A1 Inter-circuit encapsulated packaging for power delivery |
| 05/10/2001 | WO2001033926A2 Electronic control device |
| 05/10/2001 | WO2001033925A1 Method fabricating a laminated printed circuit board |
| 05/10/2001 | WO2001033924A1 Substrate manufacturing plant having minimum footprint skinned lines |
| 05/10/2001 | WO2001033673A1 Connecting device to be soldered to circuit boards for connection of electrical conductors, a method for production of the connecting device and a device for connecting conductors to the connecting device |
| 05/10/2001 | WO2001033672A1 Circuit board apparatus with pin connectors |
| 05/10/2001 | WO2001033630A2 Methods and compositions for detection and treatment of breast cancer, based on breast cancer-associated polypeptides |
| 05/10/2001 | WO2001033301A1 Printing method |
| 05/10/2001 | WO2001032964A1 Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same |
| 05/10/2001 | WO2001032963A1 Stainproof capable of protecting copper foil |
| 05/10/2001 | WO2001032958A2 Multilayer metal composite structures for semiconductor circuitry and method of manufacture |
| 05/10/2001 | WO2001032555A1 Substrate with feedthrough and method for manufacturing the same |
| 05/10/2001 | WO2001032418A1 Method and device for manufacturing laminated plate |
| 05/10/2001 | WO2001032351A1 Composition for preventing creeping of a flux for soldering and use thereof |
| 05/10/2001 | WO2001032323A1 Cleaning processes using hydrofluorocarbon and/or hydrochlorofluorocarbon compounds |
| 05/10/2001 | US20010001084 Novel zero insertion force sockets using negative thermal expansion materials |
| 05/10/2001 | US20010001071 Mold structure used in method of molding circuitry |
| 05/10/2001 | US20010000988 Single-piece molded module housing |
| 05/10/2001 | US20010000925 Method of forming BGA interconnections having mixed solder profiles |
| 05/10/2001 | US20010000915 Mechanically-stabilized area-array device package |
| 05/10/2001 | US20010000906 Paste providing method, soldering method and apparatus and system therefor |
| 05/10/2001 | US20010000905 Method and apparatus for soldering ball grid array modules to substrates |
| 05/10/2001 | US20010000897 Surface modification using an atmospheric pressure glow discharge plasma source |
| 05/10/2001 | US20010000884 Protection of a plated through hole from chemical attack |
| 05/10/2001 | DE19953191A1 Elektronisches Steuergerät Electronic control unit |
| 05/10/2001 | DE19951325A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens Method and apparatus for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of electrically insulating foil material, as well as applications of the method |
| 05/10/2001 | DE19951077C1 Stellantrieb zum Verstellen eines Stellglieds in zumindest zwei Freiheitsgraden Actuator for displacing an actuator in at least two degrees of freedom |
| 05/10/2001 | DE10054100A1 Soldering machine has solder spraying openings in several rows in relation to the direction in which the substrate is transported |
| 05/10/2001 | DE10053769A1 Monolithic ceramic electronic component e.g. ceramic capacitor, varistor has inner electrode layers distributed alternately between ceramic layers, with suitable coarseness at crossover area |
| 05/10/2001 | DE10042909A1 Multilayered ceramic substrate comprises substrate ceramic layers each containing a ceramic material that sinters at a low temperature, a shrinkage-preventing layer containing an inorganic material in the non-sintered state and wiring cable |
| 05/10/2001 | DE10041506A1 Production of a conductive pattern on a printed circuit comprises applying a solution containing conducting particles onto the circuit, drying, heating, removing the particles, screening a section and producing a conducting film |
| 05/10/2001 | CA2389712A1 Inter-circuit encapsulated packaging for power delivery |
| 05/10/2001 | CA2389457A1 Cleaning processes using hydrofluorocarbon and/or hydrochlorofluorocarbon compounds |
| 05/09/2001 | EP1098559A1 Transport and holding device for panels |
| 05/09/2001 | EP1098558A1 Multilayer printed wiring board and production method thereof |
| 05/09/2001 | EP1098557A1 Laser exposure device for plates |
| 05/09/2001 | EP1098556A1 Device for measuring a positioning error |
| 05/09/2001 | EP1098403A1 Device for processing a plurality of laser beams |
| 05/09/2001 | EP1098395A2 Contact for conductive film |
| 05/09/2001 | EP1098368A1 Module component and method of manufacturing the same |
| 05/09/2001 | EP1098361A2 Particle material, anisotropic conductive connection and anisotropic conductive connection material |
| 05/09/2001 | EP1098223A1 Dry film photopolymerizable compositions |
| 05/09/2001 | EP1098000A2 Embedded metallic deposits forming an electrode set for an electrochemical sensor strip |
| 05/09/2001 | EP1097978A1 Tackified pressure sensitive adhesives |
| 05/09/2001 | EP1097959A1 High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these |
| 05/09/2001 | EP1097806A2 Copper-clad board, method of making hole in said copper-clad board and printing wiring board comprising said copper-clad board |
| 05/09/2001 | EP1097619A1 Integrated circuit module having springy contacts of at least two different types for reduced stress, and subassembly for such module |
| 05/09/2001 | EP1097618A1 Post-treatment for copper on printed circuit boards |
| 05/09/2001 | EP1097617A1 Interconnect assembly for printed circuit boards and method of fabrication |
| 05/09/2001 | EP1097616A1 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures |
| 05/09/2001 | EP1097615A1 Method for joining copper films and separating sheets of metal |
| 05/09/2001 | EP1097614A1 Method for coating printed circuit boards or similar substrates |
| 05/09/2001 | EP1097478A2 Semiconductor component in a chip format and method for the production thereof |
| 05/09/2001 | EP1097476A2 Curved ceramic moulded part |
| 05/09/2001 | EP1097029A2 Device for the automated machining of workpieces |
| 05/09/2001 | EP1097023A1 Device for the laser processing of workpieces |
| 05/09/2001 | EP1097020A1 Solder ball placement apparatus |
| 05/09/2001 | EP1004027A4 Magnetic current sensing and short circuit detection in plate structure |
| 05/09/2001 | EP0938754B1 Battery connector and battery holder for printed circuit boards |
| 05/09/2001 | CN2429991Y Cured glue screen printing frame for electric circuit boards |
| 05/09/2001 | CN2429990Y Automatic precisively fitting device for special drill tips for printed circuit boards |
| 05/09/2001 | CN2429500Y Vertical PC plate conveying clippers |
| 05/09/2001 | CN2429290Y Electromagnet pump style single-double spike generator for liquid metal brazing |
| 05/09/2001 | CN1294835A Multilayer printed wiring board having filled-via structure |
| 05/09/2001 | CN1294756A Semiconductor device, circuit board, method of mfg. circuit board, and electronic device |
| 05/09/2001 | CN1294749A Hybrid circuit arrangement with thermal release |
| 05/09/2001 | CN1294730A Display panel |
| 05/09/2001 | CN1294729A Method for mounting TCP film to display panel |
| 05/09/2001 | CN1294700A Liquid crystal display and mfg. thereof |
| 05/09/2001 | CN1294669A Control and signaling device or signaling device with luminous element |
| 05/09/2001 | CN1294639A Method for producing printed conductor structures |
| 05/09/2001 | CN1294484A 印刷电路板结构 A printed circuit board structure |
| 05/09/2001 | CN1294483A Plastic substrate containing metal frame for package and its making method |
| 05/09/2001 | CN1294482A Circuit board |
| 05/09/2001 | CN1294412A Plastic substrate with heat dissipation function for package and its making method |
| 05/09/2001 | CN1294395A One-chip ceramic electronic parts and mfg. method thereof |