Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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05/22/2001 | US6236572 Controlled impedance bus and method for a computer system |
05/22/2001 | US6236565 Chip stack with active cooling system |
05/22/2001 | US6236446 Methods for cutting electric circuit carrying substrates and for using cut substrates in display panel fabrication |
05/22/2001 | US6236442 Method of making liquid crystal display having patterned conductive images |
05/22/2001 | US6236289 Broadband microwave choke with a hollow conic coil filled with powdered iron in a leadless carrier |
05/22/2001 | US6236145 High thermal resistivity crystal resonator support structure and oscillator package |
05/22/2001 | US6236111 Hybrid circuit substrate mountable micro-electromechanical component |
05/22/2001 | US6236015 Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding |
05/22/2001 | US6235996 Interconnection structure and process module assembly and rework |
05/22/2001 | US6235995 Flexible printed cable with ground plane and required impedance |
05/22/2001 | US6235994 Thermal/electrical break for printed circuit boards |
05/22/2001 | US6235991 Recessed mechanical fasteners for circuit boards |
05/22/2001 | US6235986 Electromagnetic interference gasket |
05/22/2001 | US6235555 Reel-deployed printed circuit board and method for manufacturing chip-on-board packages |
05/22/2001 | US6235412 Multilayer electroplated metal film |
05/22/2001 | US6235411 Process for coating a substrate with metallic layer |
05/22/2001 | US6235404 Printed circuits |
05/22/2001 | US6235208 Mixing with separation agent; removal floating solder oxide on melt |
05/22/2001 | US6235182 Solution for pretreatment of electrically non-conductive surfaces, and method of coating the surfaces with solid material particles |
05/22/2001 | US6235179 Electroplated structure for a flat panel display device |
05/22/2001 | US6235114 Interdigitized disk waveform baffle system for directing fluid stream against substrate sheet |
05/22/2001 | US6234382 Method and device for bonding solder balls to a substrate |
05/22/2001 | US6234380 Apparatus and method for inerting a wave soldering installation |
05/22/2001 | US6234373 Electrically conductive elevation shaping tool |
05/22/2001 | US6234080 Method and apparatus for cleaning screen used in screen printing machine |
05/22/2001 | US6234077 Method and apparatus for screen printing |
05/22/2001 | US6233821 Processes for manufacturing flexible printed wiring boards |
05/22/2001 | US6233820 Method for manufacturing of a multilayer microwave board and boards obtained on the basis of this method |
05/22/2001 | US6233819 Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit |
05/22/2001 | US6233818 Method and device for bonding a wire conductor |
05/22/2001 | CA2206643C Chemically grafted electrical devices |
05/22/2001 | CA2153999C Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating |
05/17/2001 | WO2001035708A2 Method and apparatus for holding a printed circuit board in a precise position during processing |
05/17/2001 | WO2001035704A1 Multi-layer double-sided wiring board and method of fabricating the same |
05/17/2001 | WO2001035703A1 Improvements in solder printers |
05/17/2001 | WO2001035458A1 Method and apparatus for assembling ball grid array and chip scale array |
05/17/2001 | WO2001035456A1 Dip formation of flip-chip solder bumps |
05/17/2001 | WO2001035051A2 X-ray tomography bga (ball grid array) inspections |
05/17/2001 | WO2001035006A2 Metal-infiltrated ceramic seal |
05/17/2001 | WO2001034881A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
05/17/2001 | WO2001034880A1 Electrolytic copper foil with carrier foil and method for manufacturing the same |
05/17/2001 | WO2001034879A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil |
05/17/2001 | WO2001034668A1 Ultraviolet absorbing electrically conductive anisotropic adhesive |
05/17/2001 | WO2001034335A1 Compact reflow and cleaning apparatus |
05/17/2001 | WO2001011662A3 Vapor phase connection techniques |
05/17/2001 | US20010001258 Ceramic capacitor |
05/17/2001 | US20010001214 Technique for producing interconnecting conductive links |
05/17/2001 | US20010001192 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
05/17/2001 | DE19954365A1 Imagewise thermoresists exposure for manufacture of integrated circuits, involves performing two dimensional scanning of image of light valve across surface of resist with optical system set at different focus settings |
05/17/2001 | DE19847521C2 Geschoß mit schockgedämpft eingebauter Schaltungsplatine Basement with built-in shock-damped circuit board |
05/17/2001 | DE10049604A1 Dielectric ceramic composition used in a computer includes a glass component containing silicon oxide and boron oxide mixed with a dielectric ceramic component |
05/17/2001 | DE10043401A1 Permanent magnet for surface mounted devices kept in packaging suitable for surface mounted device assemblies activates magnetically sensitive components while using surface mounted device pick-and-place machines |
05/17/2001 | DE10036114A1 Ball mount apparatus has ball inspection apparatus which performs inspection of ball adsorbed by mount head, arranged perpendicular to elongated direction of workpiece |
05/17/2001 | CA2390587A1 Compact reflow and cleaning apparatus |
05/17/2001 | CA2390068A1 Inspection method utilizing vertical slice imaging |
05/16/2001 | EP1100298A1 Ceramic circuit board and method of manufacture thereof |
05/16/2001 | EP1100297A2 Releasably contacting a contactlead onto a conductive path of a circuit board |
05/16/2001 | EP1100296A1 Wiring method and wiring device |
05/16/2001 | EP1100295A2 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
05/16/2001 | EP1100294A2 Bus bar heat sink |
05/16/2001 | EP1100291A1 Composite substrate, thin film el element using it, and method of producing the same |
05/16/2001 | EP1100123A1 Dip formation of flip-chip solder bumps |
05/16/2001 | EP1100096A1 Electronic device and manufacture thereof |
05/16/2001 | EP1099551A2 Simplified screen printing machine |
05/16/2001 | EP1099534A2 Three-dimensional printing techniques |
05/16/2001 | EP1099507A1 Solder powder and method for preparing the same and solder paste |
05/16/2001 | EP1099362A1 A device and method for mounting electronic components on printed circuit boards |
05/16/2001 | EP1099361A1 Improved method for forming conductive traces and printed circuits made thereby |
05/16/2001 | EP1099254A1 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
05/16/2001 | EP1099247A1 Method for transferring solder to a device and/or testing the device |
05/16/2001 | CN1295782A Surface mount technology compatible EMI gasket and method of installing EMI gasket on ground trace |
05/16/2001 | CN1295596A Process for production of prepregs and laminated sheets |
05/16/2001 | CN1295594A Composition and method for producing polythioethers having pendent methyl chains |
05/16/2001 | CN1295541A Impregnated glass fiber strands and products including the same |
05/16/2001 | CN1295528A Device for treating plate-shaped work pieces, especially printed-circuit boards |
05/16/2001 | CN1295432A Printed circuit board capable of suppressing electromagnetic interference and its laminating method |
05/16/2001 | CN1295431A Laminating method and product of 8-layer printed circuit board |
05/16/2001 | CN1295430A Laminating method and product of 8-layer printed circuit board |
05/16/2001 | CN1295429A Laminating method and product of 8-layer printed circuit board |
05/16/2001 | CN1295428A Printed circuit board capable of suppressing electromagnetic interference and its laminating method |
05/16/2001 | CN1295427A Laminating method and product of 8-layer printed circuit board |
05/16/2001 | CN1295426A Copper foil for printed circuit and its manufacture |
05/16/2001 | CN1295305A Machine for exposing plate to laser radiation |
05/16/2001 | CN1295268A Device for measuring relative position error |
05/16/2001 | CN1295265A Component installation method and manufacture of electro-optical device thereof |
05/16/2001 | CN1295262A Device for generating several laser beams |
05/16/2001 | CN1295152A Exothermal infrared paper and its production process |
05/16/2001 | CN1295021A System for conveying and supporting sheets |
05/16/2001 | CN1065798C Flux composition and corresponding soldering method |
05/15/2001 | US6233159 Bracket for supporting and aligning a circuit component with respect to a circuit board |
05/15/2001 | US6233157 Printed circuit board and method for wiring signal lines on the same |
05/15/2001 | US6233154 Single-piece molded module housing |
05/15/2001 | US6233153 Subassembly having a housing with an integral electrical plug unit |
05/15/2001 | US6233122 Capacitance controlled flexible circuit suspension |
05/15/2001 | US6232849 RF waveguide signal transition apparatus |
05/15/2001 | US6232559 Multi-layer printed circuit board registration |
05/15/2001 | US6232558 Electronic component mounting base board having heat slug with slits and projections |
05/15/2001 | US6232555 Crimp connection |
05/15/2001 | US6232399 Flame retardant |
05/15/2001 | US6232398 Alkali or acid corrodible organic or composite particles in resin matrix |