| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/29/2001 | US6239488 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 05/29/2001 | US6239485 Reduced cross-talk noise high density signal interposer with power and ground wrap |
| 05/29/2001 | US6239393 Contact device and a tool for handling it |
| 05/29/2001 | US6239387 Sinusoidal radio-frequency clock distribution system for synchronization of a computer system |
| 05/29/2001 | US6239386 Electrical connections with deformable contacts |
| 05/29/2001 | US6239385 Surface mountable coaxial solder interconnect and method |
| 05/29/2001 | US6239383 Ball-grid array IC packaging frame |
| 05/29/2001 | US6239382 Device and method of controlling the bowing of a soldered or adhesively bonded assembly |
| 05/29/2001 | US6239381 Circuit board for a semiconductor device and method of making the same |
| 05/29/2001 | US6239380 Singulation methods and substrates for use with same |
| 05/29/2001 | US6239372 Electrical connection of a movably disposed electrical component with a flexible, elastic conductor track carrier |
| 05/29/2001 | US6239248 Phenol-novolacs with improved optical properties |
| 05/29/2001 | US6239013 Method for transferring particles from an adhesive sheet to a substrate |
| 05/29/2001 | US6239012 Vertically mountable semiconductor device and methods |
| 05/29/2001 | US6238953 Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
| 05/29/2001 | US6238952 Low-pin-count chip package and manufacturing method thereof |
| 05/29/2001 | US6238841 Resin obtained by introducing a styrylpyridinium, styrylquinolinium or methylolamide group into a polyvinyl alcohol polymer; prepolymer having carboxyl group and at least two ethylenically unsaturated groups in molecule; epoxide |
| 05/29/2001 | US6238840 Curable solder resist comprising a photosensitive resin having one or more carboxyl groups, a phenolic diglycidyl ether epoxy curing agent, and a photoinitiator; adhesion, heat resistance, resolution |
| 05/29/2001 | US6238802 Laminate for sealing capsules |
| 05/29/2001 | US6238779 Laminated electric part |
| 05/29/2001 | US6238778 Component of printed circuit boards |
| 05/29/2001 | US6238777 Printed-circuit board |
| 05/29/2001 | US6238749 Method of providing a metal pattern on an electrically insulating substrate in an electroless process |
| 05/29/2001 | US6238741 Single mask screening process |
| 05/29/2001 | US6238599 Adhesive paste comprising a network of interconnected particles adhered through a coating of fusible material, having spaces therebetween containing a thermoplastic epoxy resin or an allyl alcohol-styrene copolymer |
| 05/29/2001 | US6238597 Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate |
| 05/29/2001 | US6238529 Device for electrolytic treatment of printed circuit boards and conductive films |
| 05/29/2001 | US6238508 Bonding method using fast hardening UV adhesive and slower hardening adhesive |
| 05/29/2001 | US6238228 Locking assembly for securing semiconductor device to carrier substrate |
| 05/29/2001 | US6238223 Method of depositing a thermoplastic polymer in semiconductor fabrication |
| 05/29/2001 | US6238221 Circuit connection structure for a junction block |
| 05/29/2001 | US6237490 Screen printing method and screen printing apparatus |
| 05/29/2001 | US6237219 Method of mounting conductive ball |
| 05/29/2001 | US6237218 Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board |
| 05/29/2001 | US6237176 Substrate or sheet surface cleaning apparatus |
| 05/29/2001 | CA2274577C Injection molding encapsulation for an electronic device directly onto a substrate |
| 05/29/2001 | CA2202576C Electronic circuit assembly |
| 05/29/2001 | CA2182438C Circuit connector |
| 05/25/2001 | WO2001037624A1 Apparatus and method for connecting printed circuit boards through soldered lap joints |
| 05/25/2001 | WO2001037623A1 Method for producing conductive patterns |
| 05/25/2001 | WO2001037622A2 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer |
| 05/25/2001 | WO2001037620A1 Resistor structure of wiring board |
| 05/25/2001 | WO2001037378A1 Connector |
| 05/25/2001 | WO2001036349A1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body |
| 05/25/2001 | WO2001036231A1 Control device for a motor vehicle and method for producing the same |
| 05/25/2001 | WO2001036199A2 Printing device for simultaneously imprinting both sides of arc-shaped rigid or flexible substrates or substrate webs |
| 05/25/2001 | WO2001036181A1 Method of dry-etching resin film and device therefor |
| 05/25/2001 | WO2001036171A2 A method and apparatus using printer means for manufacturing an item |
| 05/25/2001 | WO2001002622A3 Method of coating ceramics using ccvd |
| 05/25/2001 | WO2000041893A8 Thermal transfer element and process for forming organic electroluminescent devices |
| 05/24/2001 | US20010001840 Method and apparatus for registration control during processing of a workpiece, particularly during producing images on substrates in preparing printed circuit boards |
| 05/24/2001 | US20010001747 Multi-connectable printed circuit board |
| 05/24/2001 | US20010001594 Electronic package with stacked connections and method for making same |
| 05/24/2001 | US20010001593 Electronic package with stacked connections and method for making same |
| 05/24/2001 | US20010001508 Enhanced pad design for substrate |
| 05/24/2001 | US20010001505 Tape ball grid array with interconnected ground plane |
| 05/24/2001 | US20010001464 Apparatus and method for bonding conductors using induction heating |
| 05/24/2001 | US20010001428 Circuit board and semiconductor device, and method of manufacturing the same |
| 05/24/2001 | US20010001406 Embossing a channel or opening into the green tape of the desired size under heat and pressure, screen printing an ink of conductive material to fill embossed channel or openings, firing the green tape |
| 05/24/2001 | US20010001343 Multilayer microwave couplers using vertically-cinnected transmission line structures |
| 05/23/2001 | EP1102525A1 Printed wiring board and method for producing the same |
| 05/23/2001 | EP1102524A1 Double-sided printed wiring board and method for manufacturing multilayer printed wiring board having three or more layers |
| 05/23/2001 | EP1102523A1 Printed-circuit board and method of manufacture thereof |
| 05/23/2001 | EP1102522A2 Substrate coated with a conductive layer and manufacturing method thereof |
| 05/23/2001 | EP1102355A2 Electrical connecting element and method of producing the same |
| 05/23/2001 | EP1102351A1 A wire laying plate assembly and a molding process for an insulation plate |
| 05/23/2001 | EP1102338A1 Ptc element, ptc element-mounted pcb board, secondary cell protection circuit device and secondary cell assembly |
| 05/23/2001 | EP1102236A2 Display apparatus and assembly of its driving circuit |
| 05/23/2001 | EP1101750A1 Method of preparing an aluminum nitride substrate for bonding with a copper layer |
| 05/23/2001 | EP1101608A1 Articles having imageable coatings |
| 05/23/2001 | EP1101607A1 Article having imageable coatings |
| 05/23/2001 | EP1101555A2 Spindle drilling head for machine tools for machining panels |
| 05/23/2001 | EP1101393A1 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor |
| 05/23/2001 | EP1101232A1 Electric component formed from sheet metal, provided with a welding abutment and that can be welded on the contact surfaces of a circuit substrate |
| 05/23/2001 | EP1101228A1 Polymer thick-film resistor printed on planar circuit board surface |
| 05/23/2001 | EP1100647A1 Device for the laser processing of flat workpieces |
| 05/23/2001 | EP1100644A1 Method for brazing by solder reflow electronic components and brazing device therefor |
| 05/23/2001 | EP0750532B1 Cleaning process |
| 05/23/2001 | EP0730500B1 Ammonia-free deposition of copper by disproportionation |
| 05/23/2001 | EP0672334B1 Process for production of printed circuit boards and use thereby |
| 05/23/2001 | DE19949429A1 Through-hole-plated printed circuit board with a printed circuit board hole has an inner contact removed in the printed circuit board hole to prevent solder from flowing off and any later contact layer from forming in a gap. |
| 05/23/2001 | DE10055506A1 Etching agent for copper or copper alloys in the manufacture of printed circuits comprises an alkanolamine, a copper ion source as copper, a halide ion source as halide, an aliphatic carboxylic acid and a balance of water |
| 05/23/2001 | DE10039684A1 Solution for selective etching of nickel or alloy from material also contain other metals, useful in e.g. semiconductor device or circuit board manufacture, contains nitric and sulfuric acids, oxidant, chloride ions and water |
| 05/23/2001 | DE10026067A1 Düsen-Lotzufuhrgerät und Lötverfahren Nozzle Lotzufuhrgerät and soldering |
| 05/23/2001 | DE10007108C1 Galvanically producing microstructures on substrate comprises immersing substrate in electrolyte solution and forming contact sites on surface of substrate |
| 05/23/2001 | CN2431681Y Output circuit for high power rated microphone |
| 05/23/2001 | CN2431263Y Jointing strip for elements stuck strips |
| 05/23/2001 | CN1296728A Thin film transferable electric components |
| 05/23/2001 | CN1296652A Display device |
| 05/23/2001 | CN1296641A 显示装置 Display device |
| 05/23/2001 | CN1296640A Anisotropic conductor film, semiconductor chip, and method of packaging |
| 05/23/2001 | CN1296629A Support for electronic components |
| 05/23/2001 | CN1296626A Chip type PTC thermistor |
| 05/23/2001 | CN1296568A Power contact for testing power source |
| 05/23/2001 | CN1296375A Method for filling through hole |
| 05/23/2001 | CN1296374A Circuit board making kit and making method |
| 05/23/2001 | CN1296286A Method for making wiring circuit board with convex point and method for forming convex point |
| 05/23/2001 | CN1296053A Adhesion material and circuit connection method |
| 05/23/2001 | CN1295896A Machine for punching sheet material |
| 05/22/2001 | US6237056 Apparatus and method for high speed board-to board ribbon cable data transfer |