| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/05/2001 | US6242932 Interposer for semiconductor components having contact balls |
| 06/05/2001 | US6242803 Semiconductor devices with integral contact structures |
| 06/05/2001 | US6242349 Forming a seed layer, annealing to increase grain size and plating copper on seed layer |
| 06/05/2001 | US6242286 Multilayer high density micro circuit module and method of manufacturing same |
| 06/05/2001 | US6242279 High density wire bond BGA |
| 06/05/2001 | US6242158 Photosensitive resin composition and photosensitive element using the resin composition |
| 06/05/2001 | US6242103 Substrate for semiconductor die testing |
| 06/05/2001 | US6242079 Printed wiring board and method for manufacturing the same |
| 06/05/2001 | US6242078 High density printed circuit substrate and method of fabrication |
| 06/05/2001 | US6242075 Planar multilayer ceramic structures with near surface channels |
| 06/05/2001 | US6241869 Apparatus and method for electroplating |
| 06/05/2001 | US6241868 Providing electrical contact between contact plate and contact pads on underside of substrate, wherein both contact plate and contact pads are isolated from electroplating solution |
| 06/05/2001 | US6241860 Electroplating machine |
| 06/05/2001 | US6241536 High density connector system |
| 06/05/2001 | US6241535 Low profile connector |
| 06/05/2001 | US6241532 High density electrical connector assembly and connector for use therewith |
| 06/05/2001 | US6241340 Ink-jet recording head, process for producing the head and ink-jet recording apparatus employing the head |
| 06/05/2001 | US6241145 Lead-free solder joining method and electronic module manufactured by using the method |
| 06/05/2001 | US6241143 Producing method of a film-type transmission line and method of connecting to an existing line |
| 06/05/2001 | US6241141 Reflow soldering self-aligning fixture |
| 06/05/2001 | US6240934 Method and device for treating holes or recesses extending into workpieces with liquid treatment media |
| 06/05/2001 | US6240840 Screen printing apparatus having a pressurized upper chamber |
| 06/05/2001 | US6240636 Method for producing vias in the manufacture of printed circuit boards |
| 06/05/2001 | US6240635 Printed circuit board scrap removal and printed circuit board fabrication process |
| 06/05/2001 | US6240632 Which prevents a solder resistant film from being peeled off and makes sizes of projecting electrodes uniform |
| 06/05/2001 | US6240625 Methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions |
| 06/05/2001 | US6240621 Method of manufacturing a plurality of electronic components |
| 06/05/2001 | CA2200136C Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure |
| 05/31/2001 | WO2001039563A2 Method of allocating cost savings associated with a manufacturing process |
| 05/31/2001 | WO2001039561A1 Wiring board and production method thereof |
| 05/31/2001 | WO2001039368A1 High voltage hybrid circuit |
| 05/31/2001 | WO2001039332A1 Differential signal electrical connectors |
| 05/31/2001 | WO2001039268A1 Clamping heat sinks to circuit boards over processors |
| 05/31/2001 | WO2001039267A1 Multilayer circuit board and semiconductor device |
| 05/31/2001 | WO2001039114A1 Method for production of a conductor cross-over on a data support card |
| 05/31/2001 | WO2001038892A1 Electrical test of the interconnection of conductors on a substrate |
| 05/31/2001 | WO2001038604A1 Accelerator solution for direct plating and method for direct plating |
| 05/31/2001 | WO2001038603A2 Metallizing method for dielectrics |
| 05/31/2001 | WO2001038086A1 Member having metallic layer, its manufacturing method, and its application |
| 05/31/2001 | WO2001038036A1 Method and device for treating substrates by means of laser beams |
| 05/31/2001 | WO2001016876A3 Chip card and a method for producing a chip card |
| 05/31/2001 | WO2000057468A3 Electric circuit and its method of production |
| 05/31/2001 | US20010002346 Battery connector |
| 05/31/2001 | US20010002330 Integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls, a pliable material bonds the balls in movable contact with the pads, avoiding thermal stress |
| 05/31/2001 | US20010002294 Printed circuit board and method of manufacturing the same |
| 05/31/2001 | US20010002163 Process for mounting electronic device and semiconductor device |
| 05/31/2001 | US20010002162 Process for mounting electronic device and semiconductor device |
| 05/31/2001 | US20010002160 Clamping heat sinks to circuit boards over processors |
| 05/31/2001 | US20010002106 Method of manufacturing and testing an electronic device, and an electronic device |
| 05/31/2001 | US20010002068 Test interconnect for semiconductor components having bumped and planar contacts |
| 05/31/2001 | US20010002044 Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed |
| 05/31/2001 | US20010001990 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| 05/31/2001 | US20010001976 Apparatus and method for fabricating buried and flat metal features |
| 05/31/2001 | US20010001889 Alignment weight for floating pin field design |
| 05/31/2001 | DE19957130A1 Metallizing dielectric materials comprises applying a photosensitive dielectric to a substrate, irradiating the dielectric through a mask, growing a metal, subjecting to high temperatures and chemically metallizing |
| 05/31/2001 | DE19956642A1 Circuit board connector has connecting medium in form of one-dimensional conducting synthetic material with positioning aids or guides for other circuit board to be contacted |
| 05/31/2001 | DE19955223A1 Druckeinrichtung zum beidseitigen simultanen Bedrucken von bogenförmigen starren oder flexiblen Substraten oder Substratbahnen Printing means for printing two-sided simultaneous of arcuate rigid or flexible substrates or substrate webs |
| 05/31/2001 | DE19950487A1 Circuit board for electronic system, has edge apertures used to provide interconnection arrangement |
| 05/31/2001 | DE10050629A1 Three=dimensional circuit body for vehicle has insulating layer formed corresponding to surface shape of car-body frame, and circuit patterns formed by applying electric conducting paste to insulating layer |
| 05/31/2001 | CA2391958A1 Method of allocating cost savings associated with a manufacturing process |
| 05/30/2001 | EP1104227A2 Method for replenishing adhesion promoting baths |
| 05/30/2001 | EP1104226A1 Production method for flexible substrate |
| 05/30/2001 | EP1104225A1 Surface mounting component and mounted structure of surface mounting component |
| 05/30/2001 | EP1104049A1 Flexible connector integrally having transmission line |
| 05/30/2001 | EP1104046A2 Circuit forming method and circuit connection structure in electrical connection box |
| 05/30/2001 | EP1104017A2 Method of flip-chip mounting a semiconductor chip to a circuit board |
| 05/30/2001 | EP1103995A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 05/30/2001 | EP1103905A2 Printed circuit board design support system, printed circuit board design method and storage medium storing control program for same |
| 05/30/2001 | EP1103855A1 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board |
| 05/30/2001 | EP1103634A1 Method for contact plated copper deposition |
| 05/30/2001 | EP1103633A1 Method for copper plating deposition |
| 05/30/2001 | EP1103575A1 Epoxy resin composition, prepreg and multilayer printed-wiring board |
| 05/30/2001 | EP1103373A2 Pattern-forming methods and lithographic printing plates |
| 05/30/2001 | EP1103170A1 Printed circuit board with a heatsink and method for mounting a heatsink |
| 05/30/2001 | EP1103169A1 Printed circuit card |
| 05/30/2001 | EP1103168A2 High density printed circuit substrate and method of fabrication |
| 05/30/2001 | EP1103069A1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 05/30/2001 | EP1103021A1 Circuit support with control elements communicating via bus lines |
| 05/30/2001 | EP1102823A1 Electroconductive, thermoplastic and heat-activated adhesive film |
| 05/30/2001 | EP1102821A1 Composition and method for polishing in metal cmp |
| 05/30/2001 | EP1102655A1 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same |
| 05/30/2001 | EP0941576B1 Crystal resonator |
| 05/30/2001 | EP0925562A4 Electronic article surveillance protection for printed circuit boards |
| 05/30/2001 | EP0737375B1 Electrically conductive structured sheets |
| 05/30/2001 | CN1297669A Apparatus having electroacoustic transducer mounted on PC board with aid of holding means |
| 05/30/2001 | CN1297567A Conductive paste, ceramic multilayer substrate, and method for mfg. ceramic multilayer substrate |
| 05/30/2001 | CN1297490A Method for coating surfaces of copper or of copper alloy with tin or tin alloy layer |
| 05/30/2001 | CN1297421A Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
| 05/30/2001 | CN1297384A Method and apparatus for two-layered coating of copper foils with meltable coating |
| 05/30/2001 | CN1297325A Electronic element with shielding case |
| 05/30/2001 | CN1297266A Electric connector with stress release |
| 05/30/2001 | CN1297265A Electric connector with stress release |
| 05/30/2001 | CN1297253A Wiring baseboard, semiconductor device with wiring baseboard, and mfg. and installing method thereof |
| 05/30/2001 | CN1297224A Suspension board with circuit |
| 05/30/2001 | CN1066494C Process for producing metal-bonded-ceramic material |
| 05/30/2001 | CN1066479C Chemical reducing solution for copper oxide |
| 05/30/2001 | CN1066397C Method for mfg. laminates and apparatus performing same |
| 05/30/2001 | CN1066373C Method for dry fluxing of metallic surface before soldering or tinning |
| 05/29/2001 | US6239983 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board |
| 05/29/2001 | US6239687 Variable voltage protection structures and method for making same |