| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/13/2001 | EP1105942A1 Contact device mainly intended for contact between electric components and circuit supports and method for producing said device |
| 06/13/2001 | EP1105941A1 Connector with two rows of terminals having tail portions with similar impedance |
| 06/13/2001 | EP1105838A1 Support element for an integrated circuit module |
| 06/13/2001 | EP1105248A1 Laser drilling of holes in materials |
| 06/13/2001 | EP0977900A4 Lead-free solder |
| 06/13/2001 | DE19959407A1 Electrical connection between terminal with chip card, terminal testing chip card emulator has board in terminal contacting unit with contact areas connected via plug/socket to emulator |
| 06/13/2001 | DE19958776A1 Unlösbare elektrische und mechanische Verbindung, Kontaktteil für eine unlösbare elektrische und mechanische Verbindung und Verfahren zur Herstellung einer unlösbaren elektrischen und mechanischen Verbindung Permanent electrical and mechanical connection, contact part for an undetachable electrical and mechanical connection and method for producing a non-detachable electrical and mechanical connection |
| 06/13/2001 | DE19954765A1 Electronic circuit carrier, in particular, circuit board comprises areas which are free from solder stop lacquer, and have a size at least equal to the heat-radiating surfaces of the components in danger of overheating |
| 06/13/2001 | DE19949141A1 Multilayer-Anordnung Multilayer arrangement |
| 06/13/2001 | DE19940480C2 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte Conductor carrier layer for Einlaminierung in a smart card, chip card having a conductor carrier layer and method for manufacturing a smart card |
| 06/13/2001 | DE10061112A1 Electrical component has connector surface with incision bent in connection direction when connector is mounted on counter contact so surface rests on counter contact to make connection |
| 06/13/2001 | DE10054394A1 Widerstandsfähige Dickschichtleiter Durable thick film conductor |
| 06/13/2001 | DE10053389A1 Verbindungsstruktur für elektrische Komponenten einer Leiterplatte Connection structure for electrical components of a circuit board |
| 06/13/2001 | DE10047644A1 Circuit block for current supply, has construction including small transformer and various electronic components mounted on base plate |
| 06/13/2001 | CN1299581A Method of making microwave, multifunction modules using fluoropolymer substrates |
| 06/13/2001 | CN1299579A Circuit bord of protective circuit for storage battery, protective circuit for storage battery, and storage pack |
| 06/13/2001 | CN1299520A Wire bond attachment of a integrated circuit package to a heat sink |
| 06/13/2001 | CN1299230A Low side surface internet structure |
| 06/13/2001 | CN1299229A Printed circuit and its mfg. method |
| 06/13/2001 | CN1067184C Small motor holding device in individual calling receiver |
| 06/13/2001 | CN1067178C Circuit board and edg-mountable connector therefor, and method for preparing a circuit board edge |
| 06/13/2001 | CN1067120C Copper foil used for printed circuit |
| 06/12/2001 | US6246762 Spring biased microphone sub-assemblies |
| 06/12/2001 | US6246590 Substrate junction element |
| 06/12/2001 | US6246589 Retention clip for retaining a compact flash drive on a PC board |
| 06/12/2001 | US6246588 Computer motherboard using oppositely configured memory module sockets |
| 06/12/2001 | US6246587 Surface mounted device with grooves on a termination lead and methods of assembly |
| 06/12/2001 | US6246586 Method and apparatus for manufacturing a thin film, thin-film laminate, and electronic parts |
| 06/12/2001 | US6246548 Mechanically formed standoffs in a circuit interconnect |
| 06/12/2001 | US6246249 Semiconductor inspection apparatus and inspection method using the apparatus |
| 06/12/2001 | US6246247 Probe card assembly and kit, and methods of using same |
| 06/12/2001 | US6246108 Integrated circuit package including lead frame with electrically isolated alignment feature |
| 06/12/2001 | US6246102 Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture |
| 06/12/2001 | US6246016 Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board |
| 06/12/2001 | US6246014 Printed circuit assembly and method of manufacture therefor |
| 06/12/2001 | US6246013 Surface mounting structure and surface mount type electronic component included therein |
| 06/12/2001 | US6246012 Electroplated conductive carbon fibers with adhesive |
| 06/12/2001 | US6246011 Solder joint reliability |
| 06/12/2001 | US6246009 Fabrication multilayer combined rigid/flex printed circuit board |
| 06/12/2001 | US6245822 Method and apparatus for decomposition treating article having cured thermosetting resin |
| 06/12/2001 | US6245696 Lasable bond-ply materials for high density printed wiring boards |
| 06/12/2001 | US6245582 Process for manufacturing semiconductor device and semiconductor component |
| 06/12/2001 | US6245490 Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same |
| 06/12/2001 | US6245445 Rough electrical contact surface |
| 06/12/2001 | US6245432 Circuit substrate, circuit-formed suspension substrate, and production methods therefor |
| 06/12/2001 | US6245213 Concentrated solution is usable for isotopic etching, |
| 06/12/2001 | US6245208 Codepositing of gold-tin alloys |
| 06/12/2001 | US6245185 Method of making a multilayer ceramic product with thin layers |
| 06/12/2001 | US6245171 Multi-thickness, multi-layer green sheet lamination and method thereof |
| 06/12/2001 | US6244876 Busbar laminate assembly |
| 06/12/2001 | US6244798 Drill or milling head |
| 06/12/2001 | US6244173 Screen-formed plated article comprising mesh cloth using core-sheath composite filament, and cylinder for rotary screen |
| 06/12/2001 | US6243946 Method of forming an interlayer connection structure |
| 06/12/2001 | US6243945 Method for manufacturing electronic parts |
| 06/08/2001 | EP1145301A3 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 06/07/2001 | WO2001041523A1 Part mounting device and part mounting method |
| 06/07/2001 | WO2001041518A1 Low species buffered rinsing fluids and methods |
| 06/07/2001 | WO2001041517A1 Improvements in or relating to circuit boards |
| 06/07/2001 | WO2001041212A2 Integrated circuit package |
| 06/07/2001 | WO2001041204A1 Method and apparatus for forming thin film of metal |
| 06/07/2001 | WO2001041157A1 Anisotropically conductive film |
| 06/07/2001 | WO2001040533A1 Method and installation for selective surface treatment |
| 06/07/2001 | WO2001039986A1 Thermal transfer of microstructured layers |
| 06/07/2001 | WO2001039922A1 Soldering flux |
| 06/07/2001 | WO2001039920A1 Device for processing substrates and method therefor which entails the use of such a device |
| 06/07/2001 | WO2001039583A1 A slanted connector |
| 06/07/2001 | WO2001009682A3 Positive acting photoresist composition and imageable element |
| 06/07/2001 | WO2000059000A3 Method for making segmented through holes in printed circuit boards |
| 06/07/2001 | US20010003165 Data processing of a bitstream signal |
| 06/07/2001 | US20010003058 Flip chip with integrated flux and underfill |
| 06/07/2001 | US20010003053 Area of multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented |
| 06/07/2001 | US20010003036 Applying a positive type photosensitive resin onto a substrate to form a photosensitive film, exposing the film to form desired pattern, developing to form resist pattern; all of there steps are carried under irradation of safelight |
| 06/07/2001 | US20010002982 High strength; for microelectronic applications |
| 06/07/2001 | US20010002734 Selectively coating bond pads |
| 06/07/2001 | US20010002728 Printed-circuit board and method of manufacture thereof |
| 06/07/2001 | US20010002727 Semiconductor device and module of the same |
| 06/07/2001 | US20010002625 Wiring substrate, multi-layered wiring substrate and method of fabricating those |
| 06/07/2001 | US20010002624 Tip structures. |
| 06/07/2001 | US20010002505 Ceramic electronic component and method of producing the same |
| 06/07/2001 | DE19956436A1 Verfahren zur Herstellung einer Datenträgerkarte A method for producing a data carrier card |
| 06/07/2001 | DE10056355A1 Flux for solder paste used for soldering, contains ethyl cellulose with specific ethoxyl rate content |
| 06/07/2001 | DE10041623A1 Multi-layered ceramic substrate manufacture involves preparing raw compound multilayer body with metallic foils, and baking it while restraining contraction of green sheets in direction of main surface |
| 06/07/2001 | DE10016565A1 Connecting device for soldering to boards for connecting electrical conductors has conducting block with recess, longitudinal groove into which conductor is pressed |
| 06/07/2001 | DE10007799C1 Zur Stromzuführung zu elektrolytisch zu behandelnden Werkstücken oder Gegenelektroden dienender Träger und Verfahren zur elektrolytischen Behandlung von Werkstücken For supplying current to electrolytically treated workpieces or counter electrode serving carrier and method for electrolytic treatment of workpieces |
| 06/07/2001 | CA2392104A1 A slanted connector |
| 06/06/2001 | EP0930974B1 Inverted stamping process |
| 06/06/2001 | EP0897653B1 A circuit board |
| 06/06/2001 | CN2433040Y Welder with waste gas retrieving device |
| 06/06/2001 | CN1298627A Adapted electrically conductive layer |
| 06/06/2001 | CN1298626A Flip chip devices with flexible conductive adhesive |
| 06/06/2001 | CN1298496A Resist stripping process |
| 06/06/2001 | CN1298275A Flexible circuit board and its manufacture |
| 06/06/2001 | CN1297963A Polyporous material |
| 06/06/2001 | CN1297960A Epoxy resin composition and semi-solidified sheet and multilayer printed circuit board produced therewith |
| 06/05/2001 | US6243655 Circuit trace probe and method |
| 06/05/2001 | US6243605 Cardiac rhythm management system having multi-capacitor module |
| 06/05/2001 | US6243269 Centralized cooling interconnect for electronic packages |
| 06/05/2001 | US6243259 Electronic member and electronic device |
| 06/05/2001 | US6243253 Surface mount multilayer capacitor |
| 06/05/2001 | US6242935 Interconnect for testing semiconductor components and method of fabrication |