| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/21/2001 | US20010004347 Optical pickup device with high-frequency superpostion circuit |
| 06/21/2001 | US20010004314 Module with thin-film circuit comprising a trimmable capacitor |
| 06/21/2001 | US20010004230 Air- wound coll for vacuum pick-up, surface mounting, and adjusting |
| 06/21/2001 | US20010004189 Cylindrical electrical component having two electrodes on bottom face |
| 06/21/2001 | US20010004134 Electronic device and method of producing same |
| 06/21/2001 | US20010004130 Semiconductor device and production method thereof |
| 06/21/2001 | US20010004024 Ball grid array modules |
| 06/21/2001 | US20010003866 Self-adjusting printed circuit board support and method of use |
| 06/21/2001 | DE19963264A1 Support material for electronic high heat-dissipation component in surface mounted device technology; has metal core, insulation layer with top and bottom connection structures and metal coating |
| 06/21/2001 | DE19963108C1 Verfahren zur Herstellung einer Lötverbindung und Schaltung mit einer solchen Lötverbindung A process for producing a solder connection and circuit with such a solder joint |
| 06/21/2001 | DE19960292A1 Micro-via-multilayer reconditioning method using laser technology |
| 06/21/2001 | DE19958240A1 Two-sided flexible circuit board manufacturing method |
| 06/21/2001 | DE19957789A1 Kontaktierungssystem für zwei Leiterplatten Connection system for two printed circuit boards |
| 06/21/2001 | DE19955214A1 Verfahren zum Herstellen von Leiterbildern A process for producing conductive patterns |
| 06/21/2001 | DE19954987A1 Method to prepare surface of electrical connector, especially solder pin for coil or wire, involves wetting connector for measurable time or surface with free flow of surface preparation fluid |
| 06/21/2001 | DE19948295C1 Automatic circuit board assembly method has mounting adapter fitted to component for facilitating handling via standard automatic assembly device |
| 06/21/2001 | DE10059234A1 Electrically conducting paste used in the production of printed circuit boards comprises complexes produced by mixing an electrically conducting filler and a heating element, and a resin |
| 06/21/2001 | DE10057115A1 Method for forming circuit using electrically conductive paste forming circuit arrangement on base-board, involves hardening circuit arrangement by applying magnetic field |
| 06/20/2001 | EP1109433A2 Manufacturing and applying process for a shield profile |
| 06/20/2001 | EP1109430A2 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board |
| 06/20/2001 | EP1109429A2 A method of manufacturing a circuit board and its manufacturing apparatus |
| 06/20/2001 | EP1109029A1 Apparatus and method using photoelectric effect for testing electrical traces |
| 06/20/2001 | EP1108532A1 Resin-coated metal foil |
| 06/20/2001 | EP1108348A1 A flexible circuit with conductive vias and a method of making |
| 06/20/2001 | EP0616723B1 Process for fabricating layered superlattice materials |
| 06/20/2001 | CN2435901Y Punching structure for circuit board |
| 06/20/2001 | CN1300527A Method of manufacturing method of ceramic multilayer board |
| 06/20/2001 | CN1300526A Ceramic circuit board and method of manufacture thereof |
| 06/20/2001 | CN1300525A Device for heating printed-circuit board |
| 06/20/2001 | CN1300520A Composite substrate, thin film el element using it, and method of producing the same |
| 06/20/2001 | CN1300271A Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate |
| 06/20/2001 | CN1300247A Sheet retainer for punching ceramic green sheet and punching device |
| 06/20/2001 | CN1300180A Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| 06/20/2001 | CN1300100A Surface mounting element and mounting structure for surface mounting element |
| 06/20/2001 | CN1300088A Mfg. method and apparatus for laminated electronic element |
| 06/20/2001 | CN1300051A Magnetic head assembly and mfg. method and lead-connection method for said magnetic head assembly |
| 06/20/2001 | CN1299852A Connection material |
| 06/20/2001 | CN1067508C Method and device for fixing chip protection layer on circuit board |
| 06/19/2001 | US6249598 Solder testing apparatus |
| 06/19/2001 | US6249434 Surface mounted conduction heat sink |
| 06/19/2001 | US6249337 Alignment mechanism and process for light exposure |
| 06/19/2001 | US6249271 Retroreflective electrophoretic displays and materials for making the same |
| 06/19/2001 | US6249207 Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same |
| 06/19/2001 | US6249135 Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage |
| 06/19/2001 | US6249131 Electronics package having a ball grid array which is electrically accessible |
| 06/19/2001 | US6249053 Chip package and method for manufacturing the same |
| 06/19/2001 | US6249051 Composite bump flip chip bonding |
| 06/19/2001 | US6249049 Ceramic package type electronic part which is high in connection strength to electrode |
| 06/19/2001 | US6249045 Tented plated through-holes and method for fabrication thereof |
| 06/19/2001 | US6248978 Heater comprising temperature sensing element positioned on electrode |
| 06/19/2001 | US6248964 Thick film on metal encoder element |
| 06/19/2001 | US6248962 Electrically conductive projections of the same material as their substrate |
| 06/19/2001 | US6248961 Wave solder application for ball grid array modules and solder plug |
| 06/19/2001 | US6248960 Ceramics substrate with electronic circuit and its manufacturing method |
| 06/19/2001 | US6248958 Resistivity control of CIC material |
| 06/19/2001 | US6248957 Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member |
| 06/19/2001 | US6248846 For acrylic compounds |
| 06/19/2001 | US6248452 Soldered integrated circuit connections |
| 06/19/2001 | US6248449 Flexible printed substrate having a conductive pattern formed thereon |
| 06/19/2001 | US6248428 Adhesive formed by dispersing cured heat-resistant resin particles of specified size soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment |
| 06/19/2001 | US6248424 Method and apparatus for indicating degree of manufacture of an article |
| 06/19/2001 | US6248401 Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer |
| 06/19/2001 | US6248247 Method of fortifying an air bridge circuit |
| 06/19/2001 | US6248151 Method of manufacturing three dimensional parts using an inert gas |
| 06/19/2001 | US6247951 Flexible circuit connector |
| 06/19/2001 | US6247640 Conductive particle arranging device and conductive particle transferring method using the same |
| 06/19/2001 | US6247639 Fixed-gap solder reflow method |
| 06/19/2001 | US6247635 High density connector having a ball type of contact surface |
| 06/19/2001 | US6247632 Molded selective solder pallet |
| 06/19/2001 | US6247228 Electrical connection with inwardly deformable contacts |
| 06/19/2001 | US6247221 Method for sealing and/or joining an end of a ceramic filter |
| 06/19/2001 | CA2146278C Back-up material and method for drilling printed circuit boards |
| 06/14/2001 | WO2001043515A1 Multilayered printed circuit board |
| 06/14/2001 | WO2001043514A1 Method and device for producing multilayer boards |
| 06/14/2001 | WO2001043513A1 Mounting electrical devices to circuit boards |
| 06/14/2001 | WO2001043269A2 Method and apparatus for making an electrical device |
| 06/14/2001 | WO2001043234A1 Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection |
| 06/14/2001 | WO2001042533A1 Electroplating apparatus |
| 06/14/2001 | WO2001042006A1 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 06/14/2001 | WO2001041969A2 Switchable wavelength laser-based etched circuit board processing system |
| 06/14/2001 | US20010003656 Electronic device assembly and a method of connecting electronic devices constituting the same |
| 06/14/2001 | US20010003614 Composite substrate, thin-film electroluminescent device using the substrate, and production process for the device |
| 06/14/2001 | US20010003610 Comprising organic porous base material provided with tackfree films on both sides, wherein connecting member of circuit substrates has through-holes filled with conductive resin compound up to surface of tackfree films |
| 06/14/2001 | US20010003579 Obtaining an acid-resistant cuprous oxide by reducing cupric oxide using a heat-resistant, odorless amine boranes, e.g., morpholine borane, reducing agent; surface treatment of copper to bond resins for printed circuits |
| 06/14/2001 | US20010003371 Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals |
| 06/14/2001 | US20010003296 Forming a projecting electrode by applying and hardening a thermosetting conductive adhesive on first connecting electrode, applying a hardenable conductive adhesive on projecting electrode, aligning components, hardening |
| 06/14/2001 | CA2393541A1 Switchable wavelength laser-based etched circuit board processing system |
| 06/13/2001 | EP1107655A2 Low profile interconnect structure |
| 06/13/2001 | EP1107654A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same |
| 06/13/2001 | EP1107374A2 Connexion system for two circuit boards |
| 06/13/2001 | EP1107337A2 Battery connector for mounting to a circuit board |
| 06/13/2001 | EP1107312A2 Multiple line grids incorporating therein circuit elements |
| 06/13/2001 | EP1107310A2 Isolation improvement of high power semiconductor modules |
| 06/13/2001 | EP1107305A2 Method for mounting a semiconductor device |
| 06/13/2001 | EP1106913A1 Circuit boards surface mountable display element |
| 06/13/2001 | EP1106656A1 Process for preparing green pigment composition containing no halogen |
| 06/13/2001 | EP1106294A2 Soldering machine |
| 06/13/2001 | EP1106040A1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 06/13/2001 | EP1106039A1 Method for producing contact between two circuit layers separated by an insulating layer |
| 06/13/2001 | EP1105950A1 Laser repetition rate multiplier |