| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/28/2001 | US20010005545 Circuit board and method of manufacturing the same |
| 06/28/2001 | US20010005544 Printed pattern defect repair sheet, and repair device and method for printed pattern defect |
| 06/28/2001 | US20010005314 Interconnection process for module assembly and rework |
| 06/28/2001 | US20010005313 Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
| 06/28/2001 | US20010005304 Printed circuit board capacitor structure and method |
| 06/28/2001 | US20010005241 Liquid crystal display device having an improved attachment structure of a chip component |
| 06/28/2001 | US20010005083 Vehicle ceiling-mounting electric equipment assembly |
| 06/28/2001 | US20010005053 Electronic part, an electronic part mounting element and an process for manufacturing such the articles |
| 06/28/2001 | US20010005048 Circuit board arrangement |
| 06/28/2001 | US20010005047 Flip chip C4 extension structure and process |
| 06/28/2001 | US20010004990 Rework and underfill nozzle for electronic components |
| 06/28/2001 | US20010004944 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board |
| 06/28/2001 | US20010004943 Stress accommodation in electronic device interconnect technology for millimeter contact locations |
| 06/28/2001 | US20010004942 Method and structure for reducing power noise |
| 06/28/2001 | US20010004941 Circuit module and method for mounting the same |
| 06/28/2001 | US20010004803 Method of manufacturing a circuit board and its manufacturing apparatus |
| 06/28/2001 | DE19963281A1 Verfahren zum Herstellen von Leiterbahnen A method for producing conductor tracks |
| 06/28/2001 | DE19961683A1 Bauteil mit Dünnschichtschaltkreis Component with thin-film circuit |
| 06/28/2001 | DE19961675A1 Bauteil mit Dünnschichtschaltkreis mit trimmbarem Kondensator Component with thin-film circuit with capacitor trimmbarem |
| 06/28/2001 | DE19959248A1 Isolationsverbesserung bei Hochleistungs-Halbleitermodulen Isolation improvement in high-power semiconductor modules |
| 06/28/2001 | DE10064629A1 Making connections between printed circuits, including bonding of ribbon cables, employs hydrocarbon flux and melt- or diffusion-bonding |
| 06/28/2001 | DE10063367A1 Electric vehicle lock module; has crossing conductor tracks to connect components, where first track has gap near crossing point of second track that is bridged by serially-connected component |
| 06/28/2001 | DE10015269A1 Manufacturing method for electrical resistance inserted into circuit-board especially multilayer circuit board |
| 06/28/2001 | CA2395760A1 Methods and apparatus for forming submicron patterns on films |
| 06/28/2001 | CA2395651A1 Flanged terminal pins for dc/dc converters |
| 06/27/2001 | EP1111975A1 Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof |
| 06/27/2001 | EP1111974A2 Process for manufacturing a solder connection |
| 06/27/2001 | EP1111973A2 Column grid array connector and a method of attaching a column of solder |
| 06/27/2001 | EP1111972A2 Flexible printed substrate |
| 06/27/2001 | EP1111971A1 Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| 06/27/2001 | EP1111970A2 Circuit board for use at high voltage |
| 06/27/2001 | EP1111969A1 Method and structure for reducing power noise |
| 06/27/2001 | EP1111731A1 Conductors guide plate |
| 06/27/2001 | EP1111694A2 Thin film device with a trimmable capacitor |
| 06/27/2001 | EP1111679A2 Device with thin-film circuit |
| 06/27/2001 | EP1111676A2 Unit interconnection substrate for electronic parts |
| 06/27/2001 | EP1111662A2 Apparatus and method for aligning semiconductor die to interconnect metal on flex substrate and product therefrom |
| 06/27/2001 | EP1111090A2 Method for partially plating on a base |
| 06/27/2001 | EP1111021A2 Double-sided adhesive tape |
| 06/27/2001 | EP1110438A1 Smd component with planar contact surfaces and method for producing planar surfaces for smd connecting legs |
| 06/27/2001 | EP1110437A1 Scanner system |
| 06/27/2001 | EP1110277A1 Printed circuit board arrangement with a multipole plug-in connector |
| 06/27/2001 | EP1110268A1 Method for vertical connection of conductors in a device in the microwave range |
| 06/27/2001 | EP1110243A1 Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
| 06/27/2001 | CN2437096Y Adjustable frame for welding printed circuit board |
| 06/27/2001 | CN1301480A Printed circuit board and method of production thereof |
| 06/27/2001 | CN1301479A Multiple printed panel for electronic components, and method for constructing bumps, soldering frames, spaces and similiar on said multiple printed panel |
| 06/27/2001 | CN1301316A Base webs for printed circuit board production using the foam process and aramid fibers |
| 06/27/2001 | CN1301313A Method for electro copperplating substrates |
| 06/27/2001 | CN1301130A Binding treatment of copper sheet with improved binding strength and bottom cutting resistant |
| 06/27/2001 | CN1301041A Modules having thin film circuit with refittable capacitors |
| 06/27/2001 | CN1301039A Device and method for aligning pipe core with interconnecting metal on flexible substrate, and products thereof |
| 06/27/2001 | CN1300877A Local electroplating method for substrate |
| 06/26/2001 | US6253071 Method and apparatus for a cross-connect system with automatic facility information transference to a remote location |
| 06/26/2001 | US6252779 Ball grid array via structure |
| 06/26/2001 | US6252761 Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate |
| 06/26/2001 | US6252649 Aligner |
| 06/26/2001 | US6252304 Metallized vias with and method of fabrication |
| 06/26/2001 | US6252197 Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
| 06/26/2001 | US6252179 Electronic package on metal carrier |
| 06/26/2001 | US6252178 Semiconductor device with bonding anchors in build-up layers |
| 06/26/2001 | US6252176 Printed wiring board, and manufacture thereof |
| 06/26/2001 | US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
| 06/26/2001 | US6251767 Ball grid assembly with solder columns |
| 06/26/2001 | US6251766 Method for improving attachment reliability of semiconductor chips and modules |
| 06/26/2001 | US6251765 Manufacturing metal dip solder bumps for semiconductor devices |
| 06/26/2001 | US6251704 Method of manufacturing semiconductor devices having solder bumps with reduced cracks |
| 06/26/2001 | US6251502 Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
| 06/26/2001 | US6251501 Surface mount circuit device and solder bumping method therefor |
| 06/26/2001 | US6251488 Precision spray processes for direct write electronic components |
| 06/26/2001 | US6251234 Electroplating machine |
| 06/26/2001 | US6251211 Circuitry interconnection method |
| 06/26/2001 | US6251124 Cardiac rhythm management system having multi-capacitor module |
| 06/26/2001 | US6250968 Electrical connector system with cross-talk compensation |
| 06/26/2001 | US6250933 Contact structure and production method thereof |
| 06/26/2001 | US6250606 Substrate for semiconductor device, semiconductor device and manufacturing method thereof |
| 06/26/2001 | US6250541 Method of forming interconnections on electronic modules |
| 06/26/2001 | US6250540 Fluxless joining process for enriched solders |
| 06/26/2001 | US6250335 Automotive hydraulic modulator |
| 06/26/2001 | US6250192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 06/26/2001 | US6249964 Method for manufacturing a printed circuit board |
| 06/26/2001 | US6249963 System and method for coupling conductive pellets to a component of an integrated circuit |
| 06/26/2001 | US6249962 Process for manufacturing a multi-layer circuit board with supporting layers of different materials |
| 06/21/2001 | WO2001045479A1 High density, high frequency memory chip modules having thermal management structures |
| 06/21/2001 | WO2001045478A1 Multilayered printed wiring board and production method therefor |
| 06/21/2001 | WO2001045477A1 Circuit forming board and method of manufacturing circuit forming board |
| 06/21/2001 | WO2001045475A1 Surface-treated copper foil and method for manufacturing the surface-treated copper foil |
| 06/21/2001 | WO2001045213A1 An electrical contact device for interconnecting electrical components |
| 06/21/2001 | WO2001045212A1 High density, high frequency linear and area array electrical connectors |
| 06/21/2001 | WO2001045172A1 Method and device for interconnecting electronic components in three dimensions |
| 06/21/2001 | WO2001045169A1 Power transistor module, power amplifier and methods in the fabrication thereof |
| 06/21/2001 | WO2001045117A1 Ultra-thin inductive component |
| 06/21/2001 | WO2001045039A1 Method for producing a chip card with flush contacts |
| 06/21/2001 | WO2001044605A1 Key with integrated, electronic control circuit for a vehicle security system |
| 06/21/2001 | WO2001044373A1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 06/21/2001 | WO2001044143A1 Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same |
| 06/21/2001 | WO2000079849A9 High performance ball grid array substrates |
| 06/21/2001 | US20010004556 Contact structure and production method thereof and probe contact assembly using same |
| 06/21/2001 | US20010004496 Metallic foil, e.g. copper, having a polyimide layer produced by forming a film of a polyamic acid varnish followed by imidating and having a specific expansion coefficient and softening point; printed circuits; noncurling |
| 06/21/2001 | US20010004489 Metallic plating on the base copper at the interconnecting location, followed by the lamination of the appropriate dielectric layer; the dielectric layer may have a pre-cut hole corresponding to the solid metallic interconnect |