| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/05/2001 | WO2001048800A1 Semiconductor wafer processing apparatus and processing method |
| 07/05/2001 | WO2001048275A1 Plating device and plating method |
| 07/05/2001 | WO2001048274A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| 07/05/2001 | WO2001047720A1 Thermal mass transfer donor element with light-to-heat conversion layer |
| 07/05/2001 | WO2001047660A1 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
| 07/05/2001 | WO2001047657A1 Drilling covering made from or essentially made from a metal foil |
| 07/05/2001 | WO2001029103A8 Radiation curable hot melt composition and a process for the application thereof |
| 07/05/2001 | WO2001008187A8 Reconfiguragle multichip module stack interface |
| 07/05/2001 | US20010006859 Automotive lamp unit and method for manufacturing the same |
| 07/05/2001 | US20010006766 Method for patterning thin films |
| 07/05/2001 | US20010006759 Radiation sensitive compositions |
| 07/05/2001 | US20010006756 Conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin |
| 07/05/2001 | US20010006740 Component of printed circuit boards |
| 07/05/2001 | US20010006722 Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate |
| 07/05/2001 | US20010006538 Symbol-based signaling device for an elctromagnetically-coupled bus system |
| 07/05/2001 | US20010006457 Printed-circuit board and method of mounting electric components thereon |
| 07/05/2001 | US20010006456 Method of manufacturing electronic parts |
| 07/05/2001 | US20010006455 Method for mounting semiconductor device and structure thereof |
| 07/05/2001 | US20010006253 Components with releasable leads and methods of making releasable leads |
| 07/05/2001 | US20010006186 Apparatus and method for inerting a wave soldering installation |
| 07/05/2001 | US20010006185 Rework and underfill nozzle for electronic components |
| 07/05/2001 | US20010006119 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same |
| 07/05/2001 | US20010006118 Non-contact type IC card and process for manufacturing same |
| 07/05/2001 | US20010006117 Mechanical -laser structure on printed circuit board and carrier |
| 07/05/2001 | US20010006116 Single mask screening process and structure produced thereby |
| 07/05/2001 | US20010006115 Method for strengthening air bridge circuits |
| 07/05/2001 | US20010006114 Curved ceramic moulded part |
| 07/05/2001 | US20010006072 Ultrasonic processing device and electronic parts fabrication method using the same |
| 07/05/2001 | US20010006016 Punch actuator monitoring system and method |
| 07/05/2001 | US20010005936 Electrically conductive paste and method of forming circuit |
| 07/05/2001 | DE19961116A1 Leiterplattenanordnung Printed circuit board assembly |
| 07/05/2001 | DE10063251A1 Wire-contacted pluggable contact arrangement with high density e.g. for electronics and automobiles, uses circuit board having several lamination layers with several sites provided for wire-bonding |
| 07/05/2001 | DE10061866A1 An einer Fahrzeugdecke montierbare elektrische Anordnung Mounted on a vehicle ceiling electrical arrangement |
| 07/05/2001 | DE10061613A1 Electric pluggable device with holder for an electronic component e.g. for automobiles, has frame with end section having a fixture element extending from end section, and a guide channel is provided in housing for receiving fixture element |
| 07/04/2001 | EP1113712A2 Process for manufacturing conductive lines |
| 07/04/2001 | EP1113495A2 Surface mounted power transistor with heat sink |
| 07/04/2001 | EP1112803A1 Solder material, device using the same and manufacturing process thereof |
| 07/04/2001 | EP1112676A1 Method and device for processing substrates |
| 07/04/2001 | EP1112673A1 Printed conductors made of polyalkylene dioxythiophene |
| 07/04/2001 | EP1112672A1 Low-impedance high-density deposited-on-laminate structures having reduced stress |
| 07/04/2001 | EP1112671A1 Door-dependent system for enabling and adjusting options on hearing aids |
| 07/04/2001 | EP1112586A2 Method for assembling metal printed conductors as electrodes on a channel plate for ultrawide flat screens |
| 07/04/2001 | EP1112530A1 Method for producing micro-openings |
| 07/04/2001 | EP1112392A1 Method for printing a catalyst on substrates for electroless deposition |
| 07/04/2001 | EP0764393B1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 07/04/2001 | CN2438268Y Composite set of brushless motor controller |
| 07/04/2001 | CN1302531A Double sided printed wiring board and method for manufacturing multilayer printed wiring board having three or more layers |
| 07/04/2001 | CN1302179A Method for producing multilayer printed circuit board using adhesive film |
| 07/04/2001 | CN1302178A Method of mounting electric connector of printed circuit board |
| 07/04/2001 | CN1302176A Single system module for electric/electronic equiopment |
| 07/04/2001 | CN1302083A Surface mounting assembly including terminal at side |
| 07/04/2001 | CN1301994A Conveyer belt type vacuum applicator and method for applying anti-corrosion film on printed circuit |
| 07/04/2001 | CN1067929C Lead-free solder used for connecting electronic parts on organic substrate and its use |
| 07/03/2001 | US6256769 Printed circuit board routing techniques |
| 07/03/2001 | US6256121 Apparatus for ablating high-density array of vias or indentation in surface of object |
| 07/03/2001 | US6255726 Vertical interconnect process for silicon segments with dielectric isolation |
| 07/03/2001 | US6255602 Multiple layer electrical interface |
| 07/03/2001 | US6255599 Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination |
| 07/03/2001 | US6255588 Arrangement for supplying power from a buss bar to a circuit board |
| 07/03/2001 | US6255586 Interlocked bonding pad structures and methods of fabrication therefor |
| 07/03/2001 | US6255582 Method and apparatus for connecting shielding ground plane of a flex cable to a grounding pad on a printed wire board |
| 07/03/2001 | US6255581 Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| 07/03/2001 | US6255367 Crosslinkable thermosetting polyester resin matrix in which is dispersed a solid particle modifying agent comprising a crystalline polymer bearing ionically bound polymerization catalyst moieties |
| 07/03/2001 | US6255213 Method of forming a structure upon a semiconductive substrate |
| 07/03/2001 | US6255196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/03/2001 | US6255142 Method for underfilling semiconductor devices |
| 07/03/2001 | US6255138 Process for producing microencapsulated electroconductive filler |
| 07/03/2001 | US6255126 Lithographic contact elements |
| 07/03/2001 | US6255039 Fabrication of high density multilayer interconnect printed circuit boards |
| 07/03/2001 | US6255033 Positive acting photoresist compositions and imageable element |
| 07/03/2001 | US6254999 Plated product having recesses and anchor portions |
| 07/03/2001 | US6254972 Polytetrafluoroethylene matrix containing particules overlaying conductive layer |
| 07/03/2001 | US6254971 Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device |
| 07/03/2001 | US6254923 Solder particle deposition |
| 07/03/2001 | US6254760 Electro-chemical deposition system and method |
| 07/03/2001 | US6254758 Method of forming conductor pattern on wiring board |
| 07/03/2001 | US6254463 Chemical planar head dampening system |
| 07/03/2001 | US6254429 Surface-mount connector with high-degree flatness |
| 07/03/2001 | US6253992 Solder ball placement fixtures and methods |
| 07/03/2001 | US6253986 Solder disc connection |
| 07/03/2001 | US6253985 Unit for supplying solder balls |
| 07/03/2001 | US6253676 Screen printing method and holding table for plate to be printed |
| 07/03/2001 | US6253675 Solder paste stenciling apparatus and method of use for rework |
| 07/03/2001 | CA2209884C Method of separating wafers into individual die |
| 06/28/2001 | WO2001047330A1 Multilayer printed wiring board and method of manufacturing the same |
| 06/28/2001 | WO2001047329A2 High speed electronic assembly system and method |
| 06/28/2001 | WO2001047328A1 Flanged terminal pins for dc/dc converters |
| 06/28/2001 | WO2001047326A1 Multilayer printed board |
| 06/28/2001 | WO2001047016A1 Method and apparatus for encoding information in an ic package |
| 06/28/2001 | WO2001047014A1 Organic flip chip packages with an array of through hole pins |
| 06/28/2001 | WO2001047013A1 Organic packages with solders for reliable flip chip connections |
| 06/28/2001 | WO2001047003A2 Methods and apparatus for forming submicron patterns on films |
| 06/28/2001 | WO2001046963A1 Polycarbosilane adhesion promoters for low dielectric constant polymeric materials |
| 06/28/2001 | WO2001045935A1 Method of manufacture of printed wiring boards and flexible circuitry |
| 06/28/2001 | WO2001045895A1 Headpiece for machine tools that produce multiple holes |
| 06/28/2001 | WO2000074133A3 Method for curing thermally curable underfill material |
| 06/28/2001 | WO2000068972A3 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 06/28/2001 | US20010005817 Circuit trace probe and method |
| 06/28/2001 | US20010005643 Method and apparatus for connecting circuit boards |
| 06/28/2001 | US20010005548 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |