| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/17/2001 | US6261466 Composition for circuit board manufacture |
| 07/17/2001 | US6261435 Plating pretreatment method comprising vibrationally stirring treatment bath, aerating treatment bath, swinging plating target, and applying vibration to plating target simultaneously in single tank at a time |
| 07/17/2001 | US6261425 Electroplating machine |
| 07/17/2001 | US6261423 Sputtering process |
| 07/17/2001 | US6261357 Coating liquid for forming low-permittivity silica film and substrate having low-permittivity coating film |
| 07/17/2001 | US6261144 Wiring substrate and gas discharge display device and method therefor |
| 07/17/2001 | US6261136 Edge clip terminal |
| 07/17/2001 | US6261091 Process and apparatus for heat-treating substrate having film-forming composition thereon |
| 07/17/2001 | US6260265 Circuit board stiffener |
| 07/17/2001 | US6260259 Solder ball mounting device |
| 07/17/2001 | US6260231 Air knife drying system |
| 07/17/2001 | CA2026335C Furfuryl alcohol mixtures for use as cleaning agents |
| 07/12/2001 | WO2001050827A1 Printed circuit board comprising a heat dissipating aluminium plate and a method for producing same |
| 07/12/2001 | WO2001050826A1 Method and device for producing a conductive structure on a substrate |
| 07/12/2001 | WO2001050825A1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product |
| 07/12/2001 | WO2001050824A1 Method for manufacturing printed circuit boards |
| 07/12/2001 | WO2001050823A1 Self-aligned coaxial via capacitors |
| 07/12/2001 | WO2001050821A2 Conditioning of through holes and glass |
| 07/12/2001 | WO2001050760A1 Solder paste inspection system |
| 07/12/2001 | WO2001050517A1 Semiconductor package and enhanced fbg manufacturing |
| 07/12/2001 | WO2001050356A1 Method and apparatus for designing printed-circuit board |
| 07/12/2001 | WO2001050198A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/12/2001 | WO2001050190A1 Method of forming image on support |
| 07/12/2001 | WO2001049805A1 Method for roughening copper surfaces for bonding to substrates |
| 07/12/2001 | WO2001049422A1 Device for collectively filling blind cavities |
| 07/12/2001 | WO2001005200A3 Printed circuit fabrication |
| 07/12/2001 | WO2000079475A3 High-reliability touch panel |
| 07/12/2001 | US20010007881 Polymeric modifying agents |
| 07/12/2001 | US20010007522 Monolithic capacitor |
| 07/12/2001 | US20010007373 Tape carrier for semiconductor device and method of producing same |
| 07/12/2001 | US20010007330 Ball mount apparatus |
| 07/12/2001 | US20010007317 Using mixture of nitric acid, sulfamic acid and a hydroxybenzene |
| 07/12/2001 | US20010007289 Full additive process with filled plated through holes |
| 07/12/2001 | US20010007288 Method for assembling a carrier and a semiconductor device |
| 07/12/2001 | US20010007287 Electronics module having power components, and a method of manufacture |
| 07/12/2001 | US20010007254 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/12/2001 | DE19961842A1 Mehrschichtleiterplatte Multi-layer printed circuit board |
| 07/12/2001 | DE10065542A1 Kraftfahrzeug-Lampeneinheit und Verfahren zur Herstellung derselben Motor vehicle lamp unit and method of manufacturing the same |
| 07/12/2001 | DE10059808A1 Verfahren zur Verbindung einer integrierten Schaltung und einer flexiblen Schaltung A method of connecting an integrated circuit and a flexible circuit |
| 07/11/2001 | EP1115274A1 Electrical power module and method for its manufacture |
| 07/11/2001 | EP1115154A1 Power semiconductor module and motor drive system |
| 07/11/2001 | EP1115086A2 Non-contact type IC card and process for manufacturing same |
| 07/11/2001 | EP1115031A2 Pulse light pattern writer |
| 07/11/2001 | EP1115029A2 Positive working mask precursor |
| 07/11/2001 | EP1114852A2 Conductive adhesive and connection structure using the same |
| 07/11/2001 | EP1114573A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 07/11/2001 | EP1114572A1 Process for promoting adhesion between an inorganic substrate and an organic polymer |
| 07/11/2001 | EP1114439A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 07/11/2001 | EP1113931A1 Method and apparatus for applying a viscous or paste material onto a substrate |
| 07/11/2001 | EP1113885A1 Printing of electronic circuits and components |
| 07/11/2001 | EP0832448B1 Method of manufacturing passive elements using conductive polypyrrole formulations |
| 07/11/2001 | CN2439166Y Pluging & pulling tool |
| 07/11/2001 | CN2439164Y Electronic components assembling structure |
| 07/11/2001 | CN2439163Y Circuit board holding device |
| 07/11/2001 | CN1303514A Transformer bobbin |
| 07/11/2001 | CN1303230A Technology for making printed circuit board with additional layers |
| 07/11/2001 | CN1303229A Thin integrated resistor and capacitor and inductor component element and its manufacturing method |
| 07/11/2001 | CN1068276C Cushioning material for forming press |
| 07/10/2001 | US6259963 Equipment, method and computer program product for determining positions of inspection terminals on printed wiring board |
| 07/10/2001 | US6259603 Electronic control unit |
| 07/10/2001 | US6259593 Electronic component |
| 07/10/2001 | US6259265 Unified test system and method for testing printed circuit boards |
| 07/10/2001 | US6259163 Bond pad for stress releif between a substrate and an external substrate |
| 07/10/2001 | US6259161 Circuit electrode connected to a pattern formed on an organic substrate and method of forming the same |
| 07/10/2001 | US6259159 Reflowed solder ball with low melting point metal cap |
| 07/10/2001 | US6259157 Hybrid integrated circuit device, and method of manufacturing thereof |
| 07/10/2001 | US6259155 Polymer enhanced column grid array |
| 07/10/2001 | US6259058 Apparatus for separating non-metallic substrates |
| 07/10/2001 | US6259040 Electrical printed circuit board and process |
| 07/10/2001 | US6259039 Surface mount connector with pins in vias |
| 07/10/2001 | US6259038 Semiconductor chip mounting board and method of inspecting the same mounting board |
| 07/10/2001 | US6259037 Polytetrafluoroethylene thin film chip carrier |
| 07/10/2001 | US6259036 Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps |
| 07/10/2001 | US6259032 Circuit board grounding scheme |
| 07/10/2001 | US6259027 Compact wire harness for connecting electrical equipment |
| 07/10/2001 | US6259022 Chip card micromodule as a surface-mount device |
| 07/10/2001 | US6258703 Reflow of low melt solder tip C4's |
| 07/10/2001 | US6258627 Underfill preform interposer for joining chip to substrate |
| 07/10/2001 | US6258625 Method of interconnecting electronic components using a plurality of conductive studs |
| 07/10/2001 | US6258449 Low-thermal expansion circuit board and multilayer circuit board |
| 07/10/2001 | US6258294 Removal of solder and tin films from printed circuit boards while providing surrounding laminate with enhanced insulation resistance |
| 07/10/2001 | US6258220 Electro-chemical deposition system |
| 07/10/2001 | US6258192 Multi-thickness, multi-layer green sheet processing |
| 07/10/2001 | US6258165 Heater in a conveyor system |
| 07/10/2001 | US6257904 Connector with BGA arrangement for connecting to PC board |
| 07/10/2001 | US6257903 Self-docking electrical connector |
| 07/10/2001 | US6257771 Opitcal/electrical hybrid wiring board and its manufacturing method |
| 07/10/2001 | US6257482 Jet solder feeding device and soldering method |
| 07/10/2001 | US6257480 Jet soldering method and apparatus |
| 07/10/2001 | US6257478 Soldering/unsoldering arrangement |
| 07/10/2001 | US6257215 Resin-sealed electronic apparatus for use in internal combustion engines |
| 07/10/2001 | US6256880 Method for preparing side attach pad traces through buried conductive material |
| 07/10/2001 | US6256879 Compression connector |
| 07/10/2001 | US6256877 Method for transforming a substrate with edge contacts into a ball grid array |
| 07/10/2001 | US6256875 Method for manufacturing semiconductor device |
| 07/10/2001 | US6256874 Conductor interconnect with dendrites through film and method for producing same |
| 07/10/2001 | US6256866 Polymer thick-film resistor printed on planar circuit board surface |
| 07/10/2001 | US6256850 Method for producing a circuit board with embedded decoupling capacitance |
| 07/05/2001 | WO2001049089A1 Method of manufacturing buildup printed-circuit board |
| 07/05/2001 | WO2001048821A1 Integrated circuit |