| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/24/2001 | US6263565 Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same |
| 07/24/2001 | US6263564 Method of producing a printed board assembly and a shielding element for shielding components on a printed board assembly |
| 07/19/2001 | WO2001052610A1 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same |
| 07/19/2001 | WO2001052325A1 Microwave ic package with dual mode wave guide |
| 07/19/2001 | WO2001052004A1 Abbe error correction system and method |
| 07/19/2001 | WO2001051991A1 Resin composition, cured object obtained therefrom, and article thereof |
| 07/19/2001 | WO2001051276A2 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 07/19/2001 | WO2001051243A2 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
| 07/19/2001 | US20010009032 Structure having multiple levels of programmable integrated circuits for interconnecting electronic components |
| 07/19/2001 | US20010008778 Temporary attach article and method for temporary attach of devices to a substrate |
| 07/19/2001 | US20010008747 Process for filling apertures in a circuit board or chip carrier |
| 07/19/2001 | US20010008745 Mixing benzotriazole with development solution |
| 07/19/2001 | US20010008744 Mixing benzotriazole with development solution |
| 07/19/2001 | US20010008743 Corrosion inhibitor of NiCu for high performance writers |
| 07/19/2001 | US20010008685 Method for forming a gold plating electrode a substrate based on the electrode forming method ,and a wire bonding method utilizing this electrode forming method. |
| 07/19/2001 | US20010008680 PCB and method for making PCB with thin copper layer |
| 07/19/2001 | US20010008650 Coating dielectric resin on printed circuit |
| 07/19/2001 | US20010008479 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| 07/19/2001 | US20010008442 Positioning mark and alignment method using the same |
| 07/19/2001 | US20010008313 Chip package with degassing holes |
| 07/19/2001 | US20010008310 Method for forming bumps, semiconductor device, and solder paste |
| 07/19/2001 | US20010008309 Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof |
| 07/19/2001 | US20010008303 Semiconductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same |
| 07/19/2001 | US20010008302 Semiconductor device |
| 07/19/2001 | US20010008283 Semiconductor chip package |
| 07/19/2001 | US20010008272 Measuring instrument and method for measuring features on a substrate |
| 07/19/2001 | US20010008250 Method of forming a solder ball |
| 07/19/2001 | US20010008249 Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
| 07/19/2001 | US20010008234 Method for forming through holes |
| 07/19/2001 | US20010008225 Method of wiring formation and method for manufacturing electronic components |
| 07/19/2001 | US20010008169 Fine pitch anisotropic conductive adhesive |
| 07/19/2001 | US20010008160 Method of producing electronic part with bumps and method of producing electronic part |
| 07/19/2001 | US20010008101 Screen printing method and screen printing machine |
| 07/19/2001 | US20010008043 Method of making a circuit board not having solder failures |
| 07/19/2001 | DE19963452A1 Bohrdecklage aus oder im wesentlichen aus einer Metallfolie Bohrdecklage from or consisting essentially of a metal foil |
| 07/19/2001 | CA2396570A1 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 07/19/2001 | CA2396259A1 Abbe error correction system and method |
| 07/19/2001 | CA2395960A1 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
| 07/18/2001 | EP1117283A1 Printed wiring board and its manufacturing method |
| 07/18/2001 | EP1117282A1 Electronic module with power components and manufacturing method |
| 07/18/2001 | EP1117281A1 Printed wiring board and prepreg for printed wiring board |
| 07/18/2001 | EP1117006A1 Photoresist having increased photospeed |
| 07/18/2001 | EP1116950A1 Method and apparatus for inspecting a printed circuit board assembly |
| 07/18/2001 | EP1116932A2 Measuring apparatus and method for measuring structures on a substrat |
| 07/18/2001 | EP1116640A2 Control unit and method of manufacturing the same |
| 07/18/2001 | EP1116421A1 Method for producing etched circuits |
| 07/18/2001 | EP1116420A1 Printed circuit plate used for testing electric components |
| 07/18/2001 | EP1116302A1 Connecting system |
| 07/18/2001 | EP1116268A2 Method and device for buried chips |
| 07/18/2001 | EP1116180A1 Method for contacting a circuit chip |
| 07/18/2001 | EP1115924A1 Non-crimping polyester monofilament and process for producing same |
| 07/18/2001 | EP1115916A1 Electrolytic cleaning of conductive bodies |
| 07/18/2001 | EP1115915A2 Contact element |
| 07/18/2001 | EP1115567A1 Resin/copper/metal laminate and method of producing same |
| 07/18/2001 | EP1115563A1 Phenol-novolacs with improved optical properties |
| 07/18/2001 | EP1115544A1 Polymeric materials and process for producing same |
| 07/18/2001 | EP1115503A1 Electroless metal deposition of electronic components in an enclosable vessel |
| 07/18/2001 | CN1304636A Method for producing contact between two circuit layers separated by insulating layer |
| 07/18/2001 | CN1304635A Method for producing wirings having solder bumps |
| 07/18/2001 | CN1304634A Wiring method and wiring device |
| 07/18/2001 | CN1304585A Differential line driver |
| 07/18/2001 | CN1304536A Polymer thick-film resistor printed on planar circuit board surface |
| 07/18/2001 | CN1304535A Rigid/flex printed circuit board and manufacturing method therefor |
| 07/18/2001 | CN1304284A Flexible wiring board with multilayer structure and its making method |
| 07/18/2001 | CN1304283A Method for making laminated circuit board |
| 07/18/2001 | CN1304282A Pulse light diagram recorder |
| 07/18/2001 | CN1304281A Electric linking parts and its manufacturing method |
| 07/18/2001 | CN1304280A Manufacturing method and apparatu for circuit substrate |
| 07/18/2001 | CN1304279A Multi-layer printed circuit board |
| 07/18/2001 | CN1304278A Multi-layer printed circuit board |
| 07/18/2001 | CN1304174A Electronic packaged component with high density interconnection layer |
| 07/18/2001 | CN1304170A Method for making electronic element with lugs and method for making said electronic element |
| 07/18/2001 | CN1304141A Heat-proofing insulating shield sleeve |
| 07/18/2001 | CN1303892A Thermoset binding material |
| 07/18/2001 | CN1303744A Process for coating board and system of coating board for implementing said process |
| 07/18/2001 | CN1068728C Motor, structure of stator of motor and assembly method of stator |
| 07/18/2001 | CN1068710C Method for automatically welding package of ball array integrated circuit by coil belt |
| 07/17/2001 | US6263198 Multi-layer printed wiring board having integrated broadside microwave coupled baluns |
| 07/17/2001 | US6263158 Fibrous supported polymer encapsulated electrical component |
| 07/17/2001 | US6262878 Chip capacitor |
| 07/17/2001 | US6262706 Retroreflective electrophoretic displays and materials for making the same |
| 07/17/2001 | US6262583 Test socket and methods |
| 07/17/2001 | US6262579 Method and structure for detecting open vias in high density interconnect substrates |
| 07/17/2001 | US6262518 Housing for piezoelectric transformer device |
| 07/17/2001 | US6262488 Semiconductor memory module having double-sided memory chip layout |
| 07/17/2001 | US6262477 Ball grid array electronic package |
| 07/17/2001 | US6262473 Film carrier tape and semiconductor device, method of making the same and circuit board |
| 07/17/2001 | US6262376 Chip carrier substrate |
| 07/17/2001 | US6261941 Method for manufacturing a multilayer wiring substrate |
| 07/17/2001 | US6261927 Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| 07/17/2001 | US6261869 Hybrid BGA and QFP chip package assembly and process for same |
| 07/17/2001 | US6261863 Components with releasable leads and methods of making releasable leads |
| 07/17/2001 | US6261856 Method and system of laser processing |
| 07/17/2001 | US6261741 Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby |
| 07/17/2001 | US6261703 Copper circuit junction substrate and method of producing the same |
| 07/17/2001 | US6261697 Oxidation surface treatment; plating |
| 07/17/2001 | US6261685 Thermosetting adhesive and adhesive sheet thereof |
| 07/17/2001 | US6261680 Electronic assembly with charge-dissipating transparent conformal coating |
| 07/17/2001 | US6261671 Curing heat resistant resin |
| 07/17/2001 | US6261467 Direct deposit thin film single/multi chip module |