Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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07/26/2001 | US20010010035 Power decoupling circuit generating system and power decoupling circuit generating method |
07/26/2001 | US20010009820 Terminal connection structure of flat circuit belt |
07/26/2001 | US20010009819 Branch connection structure for flat cable |
07/26/2001 | US20010009816 Filter device for at least one electrical line connectable externally to a housing |
07/26/2001 | US20010009781 Vertical surface mount assembly and methods |
07/26/2001 | US20010009750 Laminate film and processes for preparing printed wiring board |
07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
07/26/2001 | US20010009585 Electroacoustic transducer and attachment structure thereof |
07/26/2001 | US20010009503 Transmitter-receiver unit that ensures mounting of cover |
07/26/2001 | US20010009400 Indicator lamp |
07/26/2001 | US20010009393 Anisotropically electroconductive adhesive and a ladder filter using the same |
07/26/2001 | US20010009296 Process for forming an integrated circuit |
07/26/2001 | US20010009293 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds |
07/26/2001 | US20010009273 Electroconductive composition for filling via holes comprising silver, a hardener, a resin, and a titanate coupling compound for reducing metal oxides such as copper oxide |
07/26/2001 | US20010009261 Method and apparatus for lining up micro-balls |
07/26/2001 | US20010009251 Laser machining apparatus |
07/26/2001 | US20010009203 Multi-layer circuit board |
07/26/2001 | US20010009202 Direct attached board to board interconnection and method for forming same |
07/26/2001 | US20010009201 Circuit board, electrical connection box having the circuit board and method of making the circuit board |
07/26/2001 | US20010009155 Cleaning in one step, water having dissolved ozone and water having dissolved hydrogen; nontoxic |
07/26/2001 | US20010009067 Method for manufacturing wire harness with branch connection terminals |
07/26/2001 | US20010009066 Full additive process with filled plated through holes |
07/26/2001 | DE19963850A1 Verfahren und Vorrichtung zum Erzeugen einer leitfähigen Struktur auf einem Substrat Method and apparatus for producing a conductive structure on a substrate |
07/26/2001 | DE19962175A1 Re-wiring foil of surface-mount device (SMD) housing for integrated circuit |
07/26/2001 | DE19960961A1 Schlüssel mit integrierter, elektronischer Steuerschaltung für eine Kraftfahrzeug-Sicherheitsanlage Key with integrated electronic control circuit for a motor vehicle security system |
07/26/2001 | DE10064969A1 Device for filtering one or more electrical wires to be connected to a casing from outside fits in a multilayer printed circuit board with carrier layers and conductor layers with a filter side part of a contact pin fastened on it. |
07/26/2001 | DE10009500C1 Coil unit with circuit board and coil body that is simpler to manufacture than conventional ones - has connecting elements designed so that soldering winding wire to connecting elements and connecting elements into circuit board can be achieved in one process |
07/26/2001 | DE10002430A1 Dünnwandige Leiterbahnen, enthaltend mindestens einen thermplastischen Kunststoff Thin-walled conductor tracks, comprising at least one plastic thermplastischen |
07/26/2001 | DE10001163A1 Method for coating base plate with PCBs with liquid coating material, involves transporting plate vertically along on coating roller in contact with roller to be coated by coating device |
07/26/2001 | DE10000972A1 Production of a printed circuit board comprises forming a galvanic junction between a copper layer and an aluminum plate and forming an aluminum zincate layer in the region of the junction |
07/25/2001 | EP1119234A1 Electronic-part mounting |
07/25/2001 | EP1119233A1 Electronic-part mounting |
07/25/2001 | EP1119228A2 Electric connection box |
07/25/2001 | EP1119227A1 Printed wiring board and method for producing the same |
07/25/2001 | EP1119226A2 Thin-walled conductor tracks containing at least a thermoplastic polymer |
07/25/2001 | EP1119225A2 Circuit board, electrical connection box having the circuit board and method of making the circuit board |
07/25/2001 | EP1119091A2 Motor casing and casing support |
07/25/2001 | EP1119090A2 Motor casing and casing support |
07/25/2001 | EP1119089A2 Motor casing and casing support |
07/25/2001 | EP1119048A1 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame |
07/25/2001 | EP1119045A2 Diamond interconnection substrate and a manufacturing method therefor |
07/25/2001 | EP1118414A2 Soldering method and soldering apparatus |
07/25/2001 | EP1118412A1 Method and device for soldering components on delicate support |
07/25/2001 | EP1118411A1 Method and device for soldering components |
07/25/2001 | EP1118255A1 Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board |
07/25/2001 | EP1118120A1 Package for providing improved electrical contact and methods for forming the same |
07/25/2001 | EP1118119A1 Through hole bump contact |
07/25/2001 | EP1118111A1 Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding |
07/25/2001 | EP1118089A1 Method of manufacturing ceramic electronic components |
07/25/2001 | EP1118076A2 Large value buried inductors in low temperature co-fired ceramic circuit boards |
07/25/2001 | EP1117747A1 Adhesive compositions and their precursors |
07/25/2001 | EP1019989A4 Interposers for land grid arrays |
07/25/2001 | EP0644809B1 Three-dimensional printing techniques |
07/25/2001 | CN1305404A Method and device for cleaning printed circuit board mask or printed circuit board |
07/25/2001 | CN1305403A Method for encapsulating solder metal powders and solder metal powders produced according to this method |
07/25/2001 | CN1305398A Device and method for jetting droplets |
07/25/2001 | CN1305339A Composite laminate and its manufacturing method |
07/25/2001 | CN1305338A Module substrate and its manufacturing method |
07/25/2001 | CN1305111A Apparatus and method for detecting electric trace by using photoelectric effect |
07/25/2001 | CN1304814A Solder spouting device and soldering method |
07/24/2001 | US6266120 Dummy pad, a printed circuit board including the same, and a liquid crystal display including the same |
07/24/2001 | US6266119 Liquid crystal apparatus and production process thereof |
07/24/2001 | US6265952 Adapter for surface mounted devices |
07/24/2001 | US6265842 Cross-connect method and apparatus |
07/24/2001 | US6265824 Miniature filament lamp having planar contact surfaces arranged on the plane bottom surface of the base |
07/24/2001 | US6265773 Vertically mountable and alignable semiconductor device, assembly, and methods |
07/24/2001 | US6265772 Stacked semiconductor device |
07/24/2001 | US6265770 Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment |
07/24/2001 | US6265766 Flip chip adaptor package for bare die |
07/24/2001 | US6265765 Fan-out semiconductor chip assembly |
07/24/2001 | US6265753 Imidizing and curing an oligomeric precursor compound comprising a polybenzoxazole, polybezothiazole polyamic acid ester end-capped with an aryl-substituted acetylene moiety; enhanced isotropic optical and dielectrical properties |
07/24/2001 | US6265674 Terminal connecting structure of flexible board and printed circuit board |
07/24/2001 | US6265672 Multiple layer module structure for printed circuit board |
07/24/2001 | US6265671 Printed-wiring board and a production method thereof |
07/24/2001 | US6265660 Package stack via bottom leaded plastic (BLP) packaging |
07/24/2001 | US6265530 Die attach adhesives for use in microelectronic devices |
07/24/2001 | US6265498 Curing blend of thermosetting, thermoplastic resins |
07/24/2001 | US6265469 Blend containing a steric hindered piperidinyloxy compound |
07/24/2001 | US6265245 Compliant interconnect for testing a semiconductor die |
07/24/2001 | US6265244 Method for mounting semiconductor elements |
07/24/2001 | US6265129 Form a resist pattern that had a micro-groove in each element and which yet was satisfactory in feature profile and resolution. |
07/24/2001 | US6265090 Silver coated with metal oxide; high contraction starting temperature |
07/24/2001 | US6265085 Bonding material and bump |
07/24/2001 | US6265075 Enhanced copper adhesion; metallic catalyst seed; photoimageable dielectric |
07/24/2001 | US6265051 Edge connectors for printed circuit boards comprising conductive ink |
07/24/2001 | US6265050 Organic overcoat for electrode grid |
07/24/2001 | US6265020 Applying solution to printed circuit; inversion |
07/24/2001 | US6265017 Method and control system for applying solder flux to a printed circuit |
07/24/2001 | US6264862 Method for manufacturing a plug |
07/24/2001 | US6264851 Selective seed and plate using permanent resist |
07/24/2001 | US6264823 Non-caustic cleaning of conductive and non-conductive bodies |
07/24/2001 | US6264785 Mounting structure of electric part and mounting method thereof |
07/24/2001 | US6264510 Laser-welded bus bar structure |
07/24/2001 | US6264486 Zero insertion force sockets using negative thermal expansion materials |
07/24/2001 | US6264477 Photolithographically patterned spring contact |
07/24/2001 | US6264097 Method for forming a solder ball |
07/24/2001 | US6264094 Rework and underfill nozzle for electronic components |
07/24/2001 | US6264093 Lead-free solder process for printed wiring boards |
07/24/2001 | US6264090 High speed jet soldering system |
07/24/2001 | US6263937 Apparatus for making resin-impregnated fiber substrates |