Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2001
07/26/2001US20010010035 Power decoupling circuit generating system and power decoupling circuit generating method
07/26/2001US20010009820 Terminal connection structure of flat circuit belt
07/26/2001US20010009819 Branch connection structure for flat cable
07/26/2001US20010009816 Filter device for at least one electrical line connectable externally to a housing
07/26/2001US20010009781 Vertical surface mount assembly and methods
07/26/2001US20010009750 Laminate film and processes for preparing printed wiring board
07/26/2001US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging
07/26/2001US20010009585 Electroacoustic transducer and attachment structure thereof
07/26/2001US20010009503 Transmitter-receiver unit that ensures mounting of cover
07/26/2001US20010009400 Indicator lamp
07/26/2001US20010009393 Anisotropically electroconductive adhesive and a ladder filter using the same
07/26/2001US20010009296 Process for forming an integrated circuit
07/26/2001US20010009293 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds
07/26/2001US20010009273 Electroconductive composition for filling via holes comprising silver, a hardener, a resin, and a titanate coupling compound for reducing metal oxides such as copper oxide
07/26/2001US20010009261 Method and apparatus for lining up micro-balls
07/26/2001US20010009251 Laser machining apparatus
07/26/2001US20010009203 Multi-layer circuit board
07/26/2001US20010009202 Direct attached board to board interconnection and method for forming same
07/26/2001US20010009201 Circuit board, electrical connection box having the circuit board and method of making the circuit board
07/26/2001US20010009155 Cleaning in one step, water having dissolved ozone and water having dissolved hydrogen; nontoxic
07/26/2001US20010009067 Method for manufacturing wire harness with branch connection terminals
07/26/2001US20010009066 Full additive process with filled plated through holes
07/26/2001DE19963850A1 Verfahren und Vorrichtung zum Erzeugen einer leitfähigen Struktur auf einem Substrat Method and apparatus for producing a conductive structure on a substrate
07/26/2001DE19962175A1 Re-wiring foil of surface-mount device (SMD) housing for integrated circuit
07/26/2001DE19960961A1 Schlüssel mit integrierter, elektronischer Steuerschaltung für eine Kraftfahrzeug-Sicherheitsanlage Key with integrated electronic control circuit for a motor vehicle security system
07/26/2001DE10064969A1 Device for filtering one or more electrical wires to be connected to a casing from outside fits in a multilayer printed circuit board with carrier layers and conductor layers with a filter side part of a contact pin fastened on it.
07/26/2001DE10009500C1 Coil unit with circuit board and coil body that is simpler to manufacture than conventional ones - has connecting elements designed so that soldering winding wire to connecting elements and connecting elements into circuit board can be achieved in one process
07/26/2001DE10002430A1 Dünnwandige Leiterbahnen, enthaltend mindestens einen thermplastischen Kunststoff Thin-walled conductor tracks, comprising at least one plastic thermplastischen
07/26/2001DE10001163A1 Method for coating base plate with PCBs with liquid coating material, involves transporting plate vertically along on coating roller in contact with roller to be coated by coating device
07/26/2001DE10000972A1 Production of a printed circuit board comprises forming a galvanic junction between a copper layer and an aluminum plate and forming an aluminum zincate layer in the region of the junction
07/25/2001EP1119234A1 Electronic-part mounting
07/25/2001EP1119233A1 Electronic-part mounting
07/25/2001EP1119228A2 Electric connection box
07/25/2001EP1119227A1 Printed wiring board and method for producing the same
07/25/2001EP1119226A2 Thin-walled conductor tracks containing at least a thermoplastic polymer
07/25/2001EP1119225A2 Circuit board, electrical connection box having the circuit board and method of making the circuit board
07/25/2001EP1119091A2 Motor casing and casing support
07/25/2001EP1119090A2 Motor casing and casing support
07/25/2001EP1119089A2 Motor casing and casing support
07/25/2001EP1119048A1 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame
07/25/2001EP1119045A2 Diamond interconnection substrate and a manufacturing method therefor
07/25/2001EP1118414A2 Soldering method and soldering apparatus
07/25/2001EP1118412A1 Method and device for soldering components on delicate support
07/25/2001EP1118411A1 Method and device for soldering components
07/25/2001EP1118255A1 Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board
07/25/2001EP1118120A1 Package for providing improved electrical contact and methods for forming the same
07/25/2001EP1118119A1 Through hole bump contact
07/25/2001EP1118111A1 Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding
07/25/2001EP1118089A1 Method of manufacturing ceramic electronic components
07/25/2001EP1118076A2 Large value buried inductors in low temperature co-fired ceramic circuit boards
07/25/2001EP1117747A1 Adhesive compositions and their precursors
07/25/2001EP1019989A4 Interposers for land grid arrays
07/25/2001EP0644809B1 Three-dimensional printing techniques
07/25/2001CN1305404A Method and device for cleaning printed circuit board mask or printed circuit board
07/25/2001CN1305403A Method for encapsulating solder metal powders and solder metal powders produced according to this method
07/25/2001CN1305398A Device and method for jetting droplets
07/25/2001CN1305339A Composite laminate and its manufacturing method
07/25/2001CN1305338A Module substrate and its manufacturing method
07/25/2001CN1305111A Apparatus and method for detecting electric trace by using photoelectric effect
07/25/2001CN1304814A Solder spouting device and soldering method
07/24/2001US6266120 Dummy pad, a printed circuit board including the same, and a liquid crystal display including the same
07/24/2001US6266119 Liquid crystal apparatus and production process thereof
07/24/2001US6265952 Adapter for surface mounted devices
07/24/2001US6265842 Cross-connect method and apparatus
07/24/2001US6265824 Miniature filament lamp having planar contact surfaces arranged on the plane bottom surface of the base
07/24/2001US6265773 Vertically mountable and alignable semiconductor device, assembly, and methods
07/24/2001US6265772 Stacked semiconductor device
07/24/2001US6265770 Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment
07/24/2001US6265766 Flip chip adaptor package for bare die
07/24/2001US6265765 Fan-out semiconductor chip assembly
07/24/2001US6265753 Imidizing and curing an oligomeric precursor compound comprising a polybenzoxazole, polybezothiazole polyamic acid ester end-capped with an aryl-substituted acetylene moiety; enhanced isotropic optical and dielectrical properties
07/24/2001US6265674 Terminal connecting structure of flexible board and printed circuit board
07/24/2001US6265672 Multiple layer module structure for printed circuit board
07/24/2001US6265671 Printed-wiring board and a production method thereof
07/24/2001US6265660 Package stack via bottom leaded plastic (BLP) packaging
07/24/2001US6265530 Die attach adhesives for use in microelectronic devices
07/24/2001US6265498 Curing blend of thermosetting, thermoplastic resins
07/24/2001US6265469 Blend containing a steric hindered piperidinyloxy compound
07/24/2001US6265245 Compliant interconnect for testing a semiconductor die
07/24/2001US6265244 Method for mounting semiconductor elements
07/24/2001US6265129 Form a resist pattern that had a micro-groove in each element and which yet was satisfactory in feature profile and resolution.
07/24/2001US6265090 Silver coated with metal oxide; high contraction starting temperature
07/24/2001US6265085 Bonding material and bump
07/24/2001US6265075 Enhanced copper adhesion; metallic catalyst seed; photoimageable dielectric
07/24/2001US6265051 Edge connectors for printed circuit boards comprising conductive ink
07/24/2001US6265050 Organic overcoat for electrode grid
07/24/2001US6265020 Applying solution to printed circuit; inversion
07/24/2001US6265017 Method and control system for applying solder flux to a printed circuit
07/24/2001US6264862 Method for manufacturing a plug
07/24/2001US6264851 Selective seed and plate using permanent resist
07/24/2001US6264823 Non-caustic cleaning of conductive and non-conductive bodies
07/24/2001US6264785 Mounting structure of electric part and mounting method thereof
07/24/2001US6264510 Laser-welded bus bar structure
07/24/2001US6264486 Zero insertion force sockets using negative thermal expansion materials
07/24/2001US6264477 Photolithographically patterned spring contact
07/24/2001US6264097 Method for forming a solder ball
07/24/2001US6264094 Rework and underfill nozzle for electronic components
07/24/2001US6264093 Lead-free solder process for printed wiring boards
07/24/2001US6264090 High speed jet soldering system
07/24/2001US6263937 Apparatus for making resin-impregnated fiber substrates