Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2001
08/07/2001US6270354 Multi-connectable printed circuit board
08/07/2001US6270002 Ball arrangement method and ball arrangement apparatus
08/07/2001US6269998 Process for manufacturing electronic circuits
08/07/2001US6269742 Method and stencil for extruding material on a substrate
08/07/2001US6269551 Method of drying copper foil and copper foil drying apparatus
08/02/2001WO2001056347A1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
08/02/2001WO2001056345A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056343A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056341A1 Metal component carrier
08/02/2001WO2001056340A1 Substrate material piece, flexible circuit board, and method of manufacturing the flexible circuit board
08/02/2001WO2001056339A1 Flexible printed wiring board and its production method
08/02/2001WO2001056338A1 High speed interconnect
08/02/2001WO2001056079A2 A method for transferring and stacking of semiconductor devices
08/02/2001WO2001054870A1 Flexible circuit cutting apparatus and method having indexing and registration mechanism
08/02/2001US20010011197 In-line programming system and method
08/02/2001US20010011111 Acid and alkali resistance containing dielectric
08/02/2001US20010010977 Electrical connection box
08/02/2001US20010010951 Apparatus for sealing a ball grid array package and circuit card interconnection
08/02/2001US20010010850 Printed substrate board
08/02/2001US20010010743 Passive alignment using slanted wall pedestal
08/02/2001US20010010627 Semiconductor device and manufacturing method therefor
08/02/2001US20010010625 Method and apparatus for increasing memory capacity
08/02/2001US20010010536 Pulse light pattern writer
08/02/2001US20010010469 Semiconductor inspection apparatus and inspection method using the apparatus
08/02/2001US20010010406 Semiconductor device and method for manufacturing the same
08/02/2001US20010010399 Vertical surface mount assembly and methods
08/02/2001US20010010324 Solder bump forming method and apparatus
08/02/2001US20010010323 System and method for forming stable solder bonds
08/02/2001US20010010321 Enhanced pad design for substrate
08/02/2001US20010010303 Multilayer combined rigid/flex printed circuit board containing flexible soldermask
08/02/2001US20010010274 Print board
08/02/2001US20010010272 Wiring substrate and process for producing the same
08/02/2001US20010010250 Circuit print board manufacturing method, circuit print board, and carbon sheet
08/02/2001US20010010190 Hot press apparatus
08/02/2001DE10101538A1 Anschlußstruktur Terminal structure
08/02/2001DE10055436A1 Wärmestrahlungs-Einbettungsstruktur für ein elektrisches Bauteil und Einbettungsverfahren dafür Heat radiation embedding structure for an electrical part and embedding method therefor
08/02/2001DE10027852A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und zum Anordnen auf einem Substrat geeignetes Halbleiterbaelement A method for disposing a semiconductor chip on a substrate, and for arranging on a substrate suitable Halbleiterbaelement
08/01/2001EP1121008A1 Multilayer printed wiring board and method for manufacturing the same
08/01/2001EP1121007A2 Circuit board with a metal substrate
08/01/2001EP1121006A2 Transmitter-receiver unit that ensures mounting of cover
08/01/2001EP1121005A1 Metal component carrier
08/01/2001EP1120991A2 Electroacoustic transducer and attachment structure thereof
08/01/2001EP1120807A1 Thick or thin film circuit with fuse
08/01/2001EP1120796A2 Electronic component and manufacturing method thereof
08/01/2001EP1120688A1 Laminate structure and method of manufacturing the same
08/01/2001EP1120449A1 Adhesive for bonding circuit members, circuit board, and method of producing the same
08/01/2001EP1120214A1 Sheet retainer for punching ceramic green sheet and punching device
08/01/2001EP1120026A1 Device for protecting an electric circuit against interface microdischarge phenomena
08/01/2001EP1119437A1 Device for treating a substrate with laser radiation
08/01/2001CN2440615Y Automatic tin solder
08/01/2001CN1306736A Method for coating printed circuit boards or similar substrates
08/01/2001CN1306386A 电路板 Circuit board
08/01/2001CN1306307A Module with film circuit
07/2001
07/31/2001US6268996 Capacitor connector, especially for an electrolytic power capacitor
07/31/2001US6268980 Magnetic head apparatus with head IC chip
07/31/2001US6268920 Registration of sheet materials using statistical targets and method
07/31/2001US6268739 Method and device for semiconductor testing using electrically conductive adhesives
07/31/2001US6268719 Printed circuit board test apparatus
07/31/2001US6268653 High power; containing high temperature solder
07/31/2001US6268651 Arrangement for mounting a component upstanding on a carrier with surface mounted leads
07/31/2001US6268648 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
07/31/2001US6268645 Semiconductor device
07/31/2001US6268616 Electrical wiring board and method for identifying same
07/31/2001US6268568 Printed circuit board with oval solder ball lands for BGA semiconductor packages
07/31/2001US6268432 Polysiloxane, crosslinking agent and oxidation curable unsaturated compound
07/31/2001US6268275 Method of locating conductive spheres utilizing screen and hopper of solder balls
07/31/2001US6268239 Semiconductor chip cooling structure and manufacturing method thereof
07/31/2001US6268238 Three dimensional package and architecture for high performance computer
07/31/2001US6268109 Multilayer; photosensitive compound and overcoating
07/31/2001US6268078 Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions
07/31/2001US6268070 Laminate for multi-layer printed circuit
07/31/2001US6268025 Multilayer
07/31/2001US6268016 Electroless deposition of metals
07/31/2001US6268015 Method of making and using lithographic contact springs
07/31/2001US6267863 Electroplating solution for electroplating lead and lead/tin alloys
07/31/2001US6267860 Electroconductive support; resistor
07/31/2001US6267856 Parallel action holding clamp for electroplating articles
07/31/2001US6267853 Electro-chemical deposition system
07/31/2001US6267823 Solder, solder paste and soldering method
07/31/2001US6267819 Dual track stenciling system with solder gathering head
07/31/2001US6267818 Squeegee blade assembly
07/31/2001US6267650 Apparatus and methods for substantial planarization of solder bumps
07/31/2001US6267618 Terminal fitting for flat conductor
07/31/2001US6267288 Pallet for combined surface mount and wave solder manufacture of printed ciruits
07/31/2001US6266874 Methods of making microelectronic components having electrophoretically deposited layers
07/26/2001WO2001054232A2 Flexible compliant interconnect assembly
07/26/2001WO2001054231A1 Electrical connection piece and electrical connector
07/26/2001WO2001054226A1 Rfid foil or film antennas
07/26/2001WO2001054203A2 Direct printing of thin-film conductors using metal-chelate inks
07/26/2001WO2001054196A1 Dual-sided, surface mountable integrated circuit package
07/26/2001WO2001054068A2 Method and system for detecting defects on a printed circuit board
07/26/2001WO2001054000A1 System for generating printed board three-dimensional shape data
07/26/2001WO2001053890A1 Photosensitive resin composition
07/26/2001WO2001053845A1 A printed circuit assembly with configurable boundary scan paths
07/26/2001WO2001053375A1 Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same
07/26/2001WO2001053007A1 Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
07/26/2001WO2001045477B1 Circuit forming board and method of manufacturing circuit forming board
07/26/2001WO2001001453A3 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards