Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/07/2001 | US6270354 Multi-connectable printed circuit board |
08/07/2001 | US6270002 Ball arrangement method and ball arrangement apparatus |
08/07/2001 | US6269998 Process for manufacturing electronic circuits |
08/07/2001 | US6269742 Method and stencil for extruding material on a substrate |
08/07/2001 | US6269551 Method of drying copper foil and copper foil drying apparatus |
08/02/2001 | WO2001056347A1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard |
08/02/2001 | WO2001056345A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
08/02/2001 | WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
08/02/2001 | WO2001056343A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
08/02/2001 | WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
08/02/2001 | WO2001056341A1 Metal component carrier |
08/02/2001 | WO2001056340A1 Substrate material piece, flexible circuit board, and method of manufacturing the flexible circuit board |
08/02/2001 | WO2001056339A1 Flexible printed wiring board and its production method |
08/02/2001 | WO2001056338A1 High speed interconnect |
08/02/2001 | WO2001056079A2 A method for transferring and stacking of semiconductor devices |
08/02/2001 | WO2001054870A1 Flexible circuit cutting apparatus and method having indexing and registration mechanism |
08/02/2001 | US20010011197 In-line programming system and method |
08/02/2001 | US20010011111 Acid and alkali resistance containing dielectric |
08/02/2001 | US20010010977 Electrical connection box |
08/02/2001 | US20010010951 Apparatus for sealing a ball grid array package and circuit card interconnection |
08/02/2001 | US20010010850 Printed substrate board |
08/02/2001 | US20010010743 Passive alignment using slanted wall pedestal |
08/02/2001 | US20010010627 Semiconductor device and manufacturing method therefor |
08/02/2001 | US20010010625 Method and apparatus for increasing memory capacity |
08/02/2001 | US20010010536 Pulse light pattern writer |
08/02/2001 | US20010010469 Semiconductor inspection apparatus and inspection method using the apparatus |
08/02/2001 | US20010010406 Semiconductor device and method for manufacturing the same |
08/02/2001 | US20010010399 Vertical surface mount assembly and methods |
08/02/2001 | US20010010324 Solder bump forming method and apparatus |
08/02/2001 | US20010010323 System and method for forming stable solder bonds |
08/02/2001 | US20010010321 Enhanced pad design for substrate |
08/02/2001 | US20010010303 Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
08/02/2001 | US20010010274 Print board |
08/02/2001 | US20010010272 Wiring substrate and process for producing the same |
08/02/2001 | US20010010250 Circuit print board manufacturing method, circuit print board, and carbon sheet |
08/02/2001 | US20010010190 Hot press apparatus |
08/02/2001 | DE10101538A1 Anschlußstruktur Terminal structure |
08/02/2001 | DE10055436A1 Wärmestrahlungs-Einbettungsstruktur für ein elektrisches Bauteil und Einbettungsverfahren dafür Heat radiation embedding structure for an electrical part and embedding method therefor |
08/02/2001 | DE10027852A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und zum Anordnen auf einem Substrat geeignetes Halbleiterbaelement A method for disposing a semiconductor chip on a substrate, and for arranging on a substrate suitable Halbleiterbaelement |
08/01/2001 | EP1121008A1 Multilayer printed wiring board and method for manufacturing the same |
08/01/2001 | EP1121007A2 Circuit board with a metal substrate |
08/01/2001 | EP1121006A2 Transmitter-receiver unit that ensures mounting of cover |
08/01/2001 | EP1121005A1 Metal component carrier |
08/01/2001 | EP1120991A2 Electroacoustic transducer and attachment structure thereof |
08/01/2001 | EP1120807A1 Thick or thin film circuit with fuse |
08/01/2001 | EP1120796A2 Electronic component and manufacturing method thereof |
08/01/2001 | EP1120688A1 Laminate structure and method of manufacturing the same |
08/01/2001 | EP1120449A1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
08/01/2001 | EP1120214A1 Sheet retainer for punching ceramic green sheet and punching device |
08/01/2001 | EP1120026A1 Device for protecting an electric circuit against interface microdischarge phenomena |
08/01/2001 | EP1119437A1 Device for treating a substrate with laser radiation |
08/01/2001 | CN2440615Y Automatic tin solder |
08/01/2001 | CN1306736A Method for coating printed circuit boards or similar substrates |
08/01/2001 | CN1306386A 电路板 Circuit board |
08/01/2001 | CN1306307A Module with film circuit |
07/31/2001 | US6268996 Capacitor connector, especially for an electrolytic power capacitor |
07/31/2001 | US6268980 Magnetic head apparatus with head IC chip |
07/31/2001 | US6268920 Registration of sheet materials using statistical targets and method |
07/31/2001 | US6268739 Method and device for semiconductor testing using electrically conductive adhesives |
07/31/2001 | US6268719 Printed circuit board test apparatus |
07/31/2001 | US6268653 High power; containing high temperature solder |
07/31/2001 | US6268651 Arrangement for mounting a component upstanding on a carrier with surface mounted leads |
07/31/2001 | US6268648 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
07/31/2001 | US6268645 Semiconductor device |
07/31/2001 | US6268616 Electrical wiring board and method for identifying same |
07/31/2001 | US6268568 Printed circuit board with oval solder ball lands for BGA semiconductor packages |
07/31/2001 | US6268432 Polysiloxane, crosslinking agent and oxidation curable unsaturated compound |
07/31/2001 | US6268275 Method of locating conductive spheres utilizing screen and hopper of solder balls |
07/31/2001 | US6268239 Semiconductor chip cooling structure and manufacturing method thereof |
07/31/2001 | US6268238 Three dimensional package and architecture for high performance computer |
07/31/2001 | US6268109 Multilayer; photosensitive compound and overcoating |
07/31/2001 | US6268078 Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions |
07/31/2001 | US6268070 Laminate for multi-layer printed circuit |
07/31/2001 | US6268025 Multilayer |
07/31/2001 | US6268016 Electroless deposition of metals |
07/31/2001 | US6268015 Method of making and using lithographic contact springs |
07/31/2001 | US6267863 Electroplating solution for electroplating lead and lead/tin alloys |
07/31/2001 | US6267860 Electroconductive support; resistor |
07/31/2001 | US6267856 Parallel action holding clamp for electroplating articles |
07/31/2001 | US6267853 Electro-chemical deposition system |
07/31/2001 | US6267823 Solder, solder paste and soldering method |
07/31/2001 | US6267819 Dual track stenciling system with solder gathering head |
07/31/2001 | US6267818 Squeegee blade assembly |
07/31/2001 | US6267650 Apparatus and methods for substantial planarization of solder bumps |
07/31/2001 | US6267618 Terminal fitting for flat conductor |
07/31/2001 | US6267288 Pallet for combined surface mount and wave solder manufacture of printed ciruits |
07/31/2001 | US6266874 Methods of making microelectronic components having electrophoretically deposited layers |
07/26/2001 | WO2001054232A2 Flexible compliant interconnect assembly |
07/26/2001 | WO2001054231A1 Electrical connection piece and electrical connector |
07/26/2001 | WO2001054226A1 Rfid foil or film antennas |
07/26/2001 | WO2001054203A2 Direct printing of thin-film conductors using metal-chelate inks |
07/26/2001 | WO2001054196A1 Dual-sided, surface mountable integrated circuit package |
07/26/2001 | WO2001054068A2 Method and system for detecting defects on a printed circuit board |
07/26/2001 | WO2001054000A1 System for generating printed board three-dimensional shape data |
07/26/2001 | WO2001053890A1 Photosensitive resin composition |
07/26/2001 | WO2001053845A1 A printed circuit assembly with configurable boundary scan paths |
07/26/2001 | WO2001053375A1 Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same |
07/26/2001 | WO2001053007A1 Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
07/26/2001 | WO2001045477B1 Circuit forming board and method of manufacturing circuit forming board |
07/26/2001 | WO2001001453A3 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |