Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2001
08/09/2001US20010012680 Method of depositing a thermoplastic polymer in semiconductor fabrication
08/09/2001US20010012638 Vertically mountable semiconductor device and methods
08/09/2001US20010012600 Nanolaminated thin film circuitry materials
08/09/2001US20010012570 Solder ball with chemically and mechanically enhanced surface properties
08/09/2001US20010012540 Using clamping fixture constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board
08/09/2001US20010012526 Package stack via bottom leaded plastic (BLP) packaging
08/09/2001US20010012198 Pick and place assembly and reflow soldering for high power active devices wite a flange
08/09/2001US20010012107 Method and apparatus for inspecting a printed circuit board assembly
08/09/2001US20010012087 Structure of liquid crystal display device for easy assembly and disassembly
08/09/2001US20010011948 Method of manufacturing resonant circuit devices
08/09/2001US20010011907 Test interconnect for bumped semiconductor components and method of fabrication
08/09/2001US20010011828 Spherical particle transport apparatus
08/09/2001US20010011777 Semiconductor device using a BGA package and method of producing the same
08/09/2001US20010011769 Vertical surface mount assembly and methods
08/09/2001US20010011762 Integrated circuit package alignment feature
08/09/2001US20010011724 Semiconductor testing device
08/09/2001US20010011676 Soldered integrated circuit connections
08/09/2001US20010011675 Heat and pressure bonding high molecular weight polyethylene thermoplastic resin
08/09/2001US20010011608 Wave solder application for ball grid array modules
08/09/2001US20010011607 Multilayer thin-film wiring board
08/09/2001US20010011606 Electric component
08/09/2001US20010011605 Electrical connection with inwardly deformable contacts
08/09/2001US20010011604 Head interconnect circuit with alignment finger
08/09/2001US20010011603 Cable and process of production thereof
08/09/2001US20010011598 Electronic device
08/09/2001US20010011506 Method and apparatus for dispensing material in a printer
08/09/2001US20010011413 Wiring method and wiring apparatus
08/09/2001DE19919716A1 Mikroelektronische Baugruppe Microelectronic assembly
08/09/2001DE10005026A1 Multifunktionsmodul eines Passiv-Infrarot-Bewegungsmelders Multifunctional module of a passive infrared motion detector
08/09/2001DE10005025A1 Fuse carrier employing MID technology, comprises simple electroplated- and insulating plastic parts
08/09/2001DE10004310A1 Electric motor for electric windows in motor vehicles, uses carrier element designed as blanking lattice for mounting Hall sensor for motor speed sensing
08/09/2001DE10004220A1 Vorrichtung zur Klemmbefestigung einer Flachbatterie Device for clamping a flat battery
08/09/2001DE10004162A1 Method of electrically contacting circuit board with conductive track on substrate in motor vehicle, involves electrically connecting first and second tracks and carrying circuit board on substrate
08/09/2001DE10002182A1 Device for electrical and mechanical joining of flat connection structures, such as individual components and the circuit board, uses an intermediate carrier between the contact areas of both connection structures
08/09/2001DE10001942A1 Multi-layer conductor arrangement e.g. for the manufacture of compact electrical circuits, has at least two electrical conductor layers arranged one above the other on the carrier in different planes
08/09/2001DE10000414A1 Method and device for recording inner layers of printed circuit boards consisting of multiple inner layers connected by an intermediate layer uses recording points for optical alignment of single layers.
08/08/2001EP1122989A2 Method of plating for filling via holes
08/08/2001EP1122988A2 Mounting board, method of manufacturing the same and method of mounting electronic-circuit element
08/08/2001EP1122826A1 Fuse carrier
08/08/2001EP1122786A2 High performance multi-chip IC package
08/08/2001EP1122782A2 Etched tri-layer metal with integrated wire traces for wire bonding
08/08/2001EP1122781A2 High-density mounted device employing an adhesive sheet
08/08/2001EP1122778A2 Circuit device and manufacturing method of circuit device
08/08/2001EP1122746A1 Composition for film formation and insulating film
08/08/2001EP1122699A1 Multi-functional module of a passive infrared movement detecter
08/08/2001EP1122567A1 Passive alignement using slanted wall pedestal
08/08/2001EP1122546A2 Scan test machine for densely spaced test sites
08/08/2001EP1122301A1 Cleaning solution for electronic materials and method for using the same
08/08/2001EP1121799A2 Image sensor mounted by mass reflow
08/08/2001EP1121687A1 Head suspension with flexible circuit interconnect for reduced moisture permeability
08/08/2001EP1121602A1 Improving multi-chip module testability using poled-polymer interlayer dielectrics
08/08/2001EP1121218A1 Method and apparatus for placing solder balls on a substrate
08/08/2001EP0944749B1 Process for the electrolytic deposition of copper layers
08/08/2001EP0903014B1 Proximity switch with mechanical decoupling of terminal pins and plug-in unit
08/08/2001CN2442478Y Electric crystal and positioning device of circuit element thereof
08/08/2001CN1307794A Multilayer printed wiring board and production method thereof
08/08/2001CN1307793A Assembly of an electronic component with spring packaging
08/08/2001CN1307792A Method for producing printed circuit boards with rouch conducting structures and at least one area with fine conducting structures
08/08/2001CN1307693A Photopolymerizable thermosetting resin compositions
08/08/2001CN1307625A Fine pitch anisotropic conductive adhesive
08/08/2001CN1307521A Improvements to press pads
08/08/2001CN1307508A Method for brazing by solder reflow electronic components and brazing device therefor
08/08/2001CN1069448C Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer
08/07/2001US6272020 Structure for mounting a semiconductor device and a capacitor device on a substrate
08/07/2001US6272018 Method for the verification of the polarity and presence of components on a printed circuit board
08/07/2001US6272003 Floating plate capacitor with extremely wide band low impedance
08/07/2001US6271671 Multi-chip module testability using poled-polymer interlayer dielectrics
08/07/2001US6271597 Methods for forming electrically conductive interconnections and electrically interconnected substrates
08/07/2001US6271589 Thick-film conductor circuit and production method therefor
08/07/2001US6271585 A composite formed by impregnating melted copper into a molybdenum green compact and rolled into a plate having the differences in thermal expansion coefficients of <8%; uniform distribution; semiconductors for electric cars
08/07/2001US6271576 Laser synthesized ceramic sensors and method for making
08/07/2001US6271507 Apparatus and method for bonding conductors
08/07/2001US6271483 Wiring board having vias
08/07/2001US6271482 Conductive elastomer interconnect
08/07/2001US6271481 Pad configurations for improved etching of multilayer circuit assemblies
08/07/2001US6271480 Electronic device
08/07/2001US6271479 Method and apparatus for connecting an electric component to a printed circuit board
08/07/2001US6271478 Multi-layer circuit board
08/07/2001US6271465 Low cost conformal EMI/RFI shield
08/07/2001US6271111 High density pluggable connector array and process thereof
08/07/2001US6271110 Bump-forming method using two plates and electronic device
08/07/2001US6271109 Substrate for accommodating warped semiconductor devices
08/07/2001US6271107 Semiconductor with polymeric layer
08/07/2001US6270944 Thermal transfer element for forming multilayers devices
08/07/2001US6270889 For making printed wiring boards
08/07/2001US6270880 For use as an electrical insulator in a circuit board such as a multilayer circuit board
08/07/2001US6270879 Release member for use in producing a multi-layer printed wiring board
08/07/2001US6270835 Providing three-layer structure comprising dielectric layer and electrically conductive layers; patterning electrically conductive layer to form structure; embedding into second dielectric material; patterning electrically conductive layer
08/07/2001US6270666 Magnetic treatment apparatus for fluids and method for using same
08/07/2001US6270648 Having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two ?super anodes? on a rotating drum cathode to deposit the treatment
08/07/2001US6270645 Simplified process for production of roughened copper foil
08/07/2001US6270620 Etching device
08/07/2001US6270607 Method of manufacturing multilayer printed wiring board
08/07/2001US6270601 Method for producing filled vias in electronic components
08/07/2001US6270374 Electrical connector with wafer for video positioning and surface mount holding feature
08/07/2001US6270363 Z-axis compressible polymer with fine metal matrix suspension
08/07/2001US6270362 High density surface mount connector
08/07/2001US6270361 Connection structure for bus bars
08/07/2001US6270359 Electric junction box
08/07/2001US6270356 IC socket